# US 11,310,916 B1 · Metal circuit on polymer composite substrate surface and method for manufacturing the same

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- Number: US 11,310,916 B1
- Document ID: US11310916B1
- Status: Granted
- Kind: B1
- Application number: 17/133,597
- Filed: 2020-12-23
- Granted: 2022-04-19
- Earliest claimed: 2020-12-23
- Assignees: Amulaire Thermal Technology, Inc.
- Applicants: Amulaire Thermal Technology, Inc.
- Inventors: Jhao-Siang Jheng; Chun-Lung Wu
- Web page: https://patentgrep.com/patent/US11310916B1

## CPC

- H05K 3/0044: {Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence)}
- H05K 3/202: {using self-supporting metal foil pattern}
- H05K 1/056: {the metal substrate being covered by an organic insulating layer}
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- H05K 2201/0209: Inorganic, non-metallic particles
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A metal circuit on a polymer composite substrate surface and a method for manufacturing the same are provided. The metal circuit on the polymer composite substrate surface includes a polymer composite layer and a metal circuit layer. The metal circuit layer is formed from a metal piece molded by metal processing, and is integrated onto a surface of the polymer composite layer. The metal circuit layer has one or a plurality of circuit grooves formed therein, the polymer composite layer has one or a plurality of bulges formed therein, and the bulge is deformed and bulged at the corresponding circuit groove.

## Claims

### Claim 1

A metal circuit on a polymer composite substrate surface, comprising:
a polymer composite layer; and
a metal circuit layer being formed from a metal piece molded by metal processing, and being integrated onto a surface of the polymer composite layer, wherein the metal circuit layer has one or a plurality of circuit grooves formed therein, the polymer composite layer has one or a plurality of bulges formed therein, and the bulge is deformed and bulged at the corresponding circuit groove.

### Claim 2 (depends on 1)

The metal circuit according to claim 1, wherein the polymer composite layer is one of an epoxy-based layer, a polyimide-based layer, and a polypropylene-based layer.

### Claim 3 (depends on 2)

The metal circuit according to claim 2, wherein the polymer composite layer includes a filler, and the filler is selected from at least one of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, and boron nitride.

### Claim 4 (depends on 1)

The metal circuit according to claim 1, wherein the metal circuit layer is formed by processing a stamped metal piece.

### Claim 5 (depends on 1)

The metal circuit according to claim 1, wherein the metal circuit layer is formed by processing a forged metal piece.

### Claim 6 (depends on 1)

The metal circuit according to claim 1, wherein a bulging height of the bulge is configured to be between 0.01 mm and 3 mm.

### Claim 7

A method for manufacturing a metal circuit on a polymer composite substrate surface, the method comprising:
(a) preforming a metal piece that has one or a plurality of circuit channels by metal processing;
(b) integrating the metal piece onto a surface of a polymer composite layer, so that the surface of the polymer composite layer is deformed and bulged to have one or a plurality of bulges at the one or plurality of circuit channels correspondingly; and
(c) removing a part of the metal piece, so that one or a plurality of circuit grooves is exposed to form a metal circuit layer having a patterned circuit, and the bulge is deformed and bulged at the corresponding circuit groove.

### Claim 8 (depends on 7)

The method according to claim 7, wherein the metal piece is a stamped metal piece having the plurality of circuit channels, and is preformed by a stamping process.

### Claim 9 (depends on 7)

The method according to claim 7, wherein the metal piece is a forged metal piece having the plurality of circuit channels, and is preformed by a forging process.

### Claim 10 (depends on 7)

The method according to claim 7, wherein the part of the metal piece is removed by milling, planing or cutting.