# US 11,310,915 B2 · Thermoforming an electronic device with surface curvature > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,915 B2 - Document ID: US11310915B2 - Status: Granted - Kind: B2 - Application number: 16/968,020 - Filed: 2019-02-18 - Published: 2021-11-25 - Granted: 2022-04-19 - Earliest claimed: 2018-02-19 - Assignees: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO - Applicants: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO - Inventors: Edsger Constant Pieter Smits; Jan-Eric Jack Martijn Rubingh; Marco Barink - Web page: https://patentgrep.com/patent/US11310915B2 ## CPC - H05K 3/0014: {Shaping of the substrate, e.g. by moulding} - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 1/181: associated with surface mounted components - H05K 3/12: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/09018: Rigid curved substrate - H05K 2201/09263: Meander - H05K 2201/2009: Reinforced areas, e.g. for a specific part of a flexible printed circuit - H05K 2203/013: Inkjet printing, e.g. for printing insulating material or resist - H05K 2203/1105: Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating - H05K 2203/302: Bending a rigid substrate; Breaking rigid substrates by bending - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A method of manufacturing a curved electronic device (100) and resulting product. A patterned layer of non-conductive support material (12m) is printed onto a thermoplastic substrate (11) to form a support pattern. An electrical circuit (13,14) is applied onto the support pattern (12), wherein the electrical circuit (13,14) comprises circuit lines (13) comprising a conductive material (13m) applied onto support lines (12b) of the pattern and electrical components (14) applied onto support islands (12a) of the pattern. A thermoforming process (P) is used for deforming (S) the substrate (11) while a relatively high resistance of the support material (12m) to the deforming maintains a structural integrity of the electrical circuit (13,14). ## Claims ### Claim 1 A method of manufacturing a curved electronic device the method comprising: providing a substrate comprising a thermoplastic material; printing a patterned layer of non-conductive support material to form a support pattern onto the substrate, wherein the support pattern comprises support islands interconnected by support lines bridging open areas of the substrate without the support material between the support islands; applying an electrical circuit onto the support pattern, wherein the electrical circuit comprises circuit lines comprising a conductive material applied onto the support lines, and electrical components applied onto the support islands, the electrical components being electrically interconnected by the circuit lines; and deforming, using a thermoforming process with an elevated processing temperature, a shape of the substrate with the support pattern and electrical circuit according to a predefined surface curvature, wherein the support material has a higher resistance to the deforming than the thermoplastic material of the substrate at the processing temperature, and wherein the deforming is concentrated to the open areas between the support islands while the higher resistance of the support material to the deforming maintains a structural integrity of the electrical circuit applied thereon during the thermoforming process. ### Claim 2 (depends on 1) The method according to claim 1, wherein the support material has a higher glass transition temperature than the thermoplastic material of the substrate. ### Claim 3 (depends on 1) The method according to claim 1, wherein the thermoforming process comprises heating at least the substrate to a processing temperature above a glass transition temperature of the substrate, wherein the processing temperature is kept below a glass transition temperature of the support pattern. ### Claim 4 (depends on 1) The method according to claim 1, wherein the support material has a higher stiffness than the thermoplastic material of the substrate at least during the thermoforming process at the processing temperature. ### Claim 5 (depends on 1) The method according to claim 1, wherein the deforming comprises a bending, stretching, and/or compressing the substrate according to the predefined surface curvature, wherein the support pattern at least partially prevents the deforming of the substrate at positions of the electrical circuit, and wherein an amount of the bending, stretching, and/or compressing the substrate is concentrated to the open areas of the substrate not covered by the support pattern. ### Claim 6 (depends on 1) The method according to claim 1, wherein a first radius of curvature at the open areas of the substrate is smaller than a second radius of curvature of the substrate areas covered by the support pattern, wherein the second radius of curvature (R2) is kept above a threshold radius preventing structural damage to the electrical circuit (13,14). ### Claim 7 (depends on 1) The method according to claim 1, wherein a stretching or compressing at areas covered by the support pattern is kept below a threshold percentage for preventing structural damage to the electrical circuit. ### Claim 8 (depends on 1) The method according to claim 1, wherein the support pattern has a layer thickness between five and fifty micrometers, wherein the support islands have a minimum cross-section diameter of more than half a millimeter, and wherein the support lines have a lane width between fifty and two hundred micrometers. ### Claim 9 (depends on 1) The method according to any of the preceding claims claim 1, wherein the circuit lines follow a path of the support lines, wherein the support lines have a lane width that is equal to or slightly larger than a width of the circuit lines, and wherein edges of the support lines extending beyond edges circuit lines have an edge width less than hundred micrometer. ### Claim 10 (depends on 1) The method according to claim 1, wherein the support lines and the circuit lines follow a meandering path between support islands, and wherein a length along the meandering path is higher than a shortest straight distance between two end points of the meandering path by at least a factor of two. ### Claim 11 (depends on 1) The method according to claim 1, wherein support material forming the support pattern comprises a polymer material. ### Claim 12 (depends on 1) The method according to claim 1, wherein the printing of the support pattern comprises applying a liquid printing material onto the substrate by screen printing and hardening the printing material to form the support material of the support pattern. ### Claim 13 (depends on 1) The method according to claim 1, wherein the circuit lines comprise a metal ink and the electrical component comprises a surface mounted device placed before the thermoforming process. ### Claim 14 (depends on 1) The method according to claim 1, wherein a non-conductive top layer is applied on top of the electrical circuit. ### Claim 15 (depends on 1) The method according to claim 1, wherein a first radius of curvature at the open areas of the substrate is smaller than a second radius of curvature of the substrate areas covered by the support islands, wherein the second radius of curvature is kept above a threshold radius preventing structural damage to the electrical circuit. ### Claim 16 A curved electronic device comprising a substrate comprising a thermoplastic material; a patterned layer of non-conductive printed support material forming a support pattern on the substrate, wherein the support pattern comprises support islands interconnected by support lines bridging open areas of the substrate without the support material between the support islands; and an electrical circuit applied onto the support pattern, wherein the electrical circuit comprises: circuit lines comprising a conductive material applied onto the support lines, and electrical components applied onto the support islands which, the electrical components being electrically interconnected by the circuit lines; wherein a shape of the substrate with the support pattern and electrical circuit is deformed by a thermoforming process according to a predefined surface curvature, wherein the support material has a higher resistance to the deforming than the thermoplastic material of the substrate, and wherein the deforming is concentrated to the open areas between the support islands while the higher resistance of the support material to the deforming maintains a structural integrity of the electrical circuit applied thereon during the thermoforming process.