# US 11,310,914 B2 · Circuit board, circuit module, method of manufacturing circuit board, and method of manufacturing circuit module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,914 B2 - Document ID: US11310914B2 - Status: Granted - Kind: B2 - Application number: 16/710,022 - Filed: 2019-12-11 - Published: 2020-04-16 - Granted: 2022-04-19 - Earliest claimed: 2017-06-16 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Takafumi Kusuyama - Web page: https://patentgrep.com/patent/US11310914B2 ## CPC - H05K 1/188: {manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component} - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H05K 3/3473: Plating of solder - H05K 3/4661: {Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387)} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/0367: Metallic bump or raised conductor not used as solder bump - H05K 2201/10674: Flip chip - H05K 2203/025: Abrading, e.g. grinding or sand blasting - H05K 2203/0577: Double layer of resist having the same pattern - H05K 2203/072: Electroless plating, e.g. finish plating or initial plating - H05K 2203/0723: Electroplating, e.g. finish plating - H10W 72/07233: {Ultrasonic bonding, e.g. thermosonic bonding} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A circuit board includes a board body, a first electrode, and a second electrode. The board body contains a resin material. The first electrode is disposed on a first main surface of the board body and includes a first electrode base and a first coating film that covers at least a part of an outer surface of the first electrode base. The second electrode is disposed on the first main surface of the board body and includes a pillar-shaped structure that includes a second electrode base, a first plating film that is disposed on the second electrode base, and a first plating structure having a first end directly connected to the first plating film, and a second coating film that covers at least a part of an outer surface of the pillar-shaped structure. ## Claims ### Claim 1 A circuit module comprising: a circuit board, a first electronic component, and a first resin layer, wherein the circuit board comprises: a board body; a first electrode; and a second electrode, wherein the board body contains a resin material, wherein the first electrode is disposed on a first main surface of the board body and includes a first electrode base and a first coating film, wherein the first coating film covers at least a part of an outer surface of the first electrode base, and wherein the second electrode is disposed on the first main surface of the board body and includes a pillar-shaped structure and a second coating film, wherein the pillar-shaped structure includes a second electrode base, a first plating film disposed on the second electrode base, and a first plating structure having a first end directly connected to the first plating film, and wherein the second coating film covers at least a part of an outer surface of the pillar-shaped structure, wherein the first resin layer is disposed at a side of the first main surface of the board body, wherein the first electronic component is connected to the first electrode and located in the first resin layer such that at least a part of a surface opposite to a surface facing the first electrode is exposed, wherein a second end of the first plating structure of the second electrode is inside an outer surface of the first resin layer parallel to the first main surface of the board body, wherein the second coating film is tubular and covers the side surface of the second electrode base so as not to cover the second end of the first plating structure, and a first end of the second coating film is flush with the second end of the first plating structure, and wherein a first main surface of a coating portion is connected to the first end of the second coating film and the second end of the first plating structure of the second electrode, and a second main surface of the coating portion is outside the outer surface of the first resin layer parallel to the first main surface of the board body.