# US 11,310,913 B2 · Semiconductor component, and contacting assembly having a semiconductor component and a printed circuit board

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- Number: US 11,310,913 B2
- Document ID: US11310913B2
- Status: Granted
- Kind: B2
- Application number: 16/642,960
- Filed: 2018-08-03
- Published: 2020-06-18
- Granted: 2022-04-19
- Earliest claimed: 2017-08-28
- Assignees: Robert Bosch GmbH
- Applicants: Robert Bosch GmbH
- Inventors: Guenter Gera; Klaus Kosbi; Lars Vollmer; Matthias Lausmann
- Web page: https://patentgrep.com/patent/US11310913B2

## CPC

- H05K 1/145: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules}
- H10W 70/421: {Shapes or dispositions}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/657: {on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers}
- H05K 2201/09772: Conductors directly under a component but not electrically connected to the component
- H05K 2201/10719: Land grid array [LGA]
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

The invention relates to a semiconductor component (2), comprising a semiconductor chip (3), a housing (5) and a connection point arrangement (10) having at least two rows (14, 16) of planar connection points (12), which are arranged on a bottom side of the housing (5) and can be electrically connected by means of connections to corresponding contacts of a contact arrangement having at least two rows, which contact arrangement is arranged on a printed circuit board, wherein the geometry of the contact arrangement corresponds to the geometry of the connection point arrangement (10), a first distance is specified between two adjacent first connection points (14A) of a first row (14) of the connection point arrangement (10) and a second distance is specified between two adjacent second connection points (16A) of a second row (16) of the connection point arrangement (10), and the second connection points (16A) of the second row (16) are offset to the first connection points (14A) of the first row (14). The invention also relates to a corresponding contacting assembly having such a semiconductor element (2) and a printed circuit board. The first distance at least between two adjacent first connection points (14A) of the first row (14) of the connection point arrangement (10) corresponds to an intermediate space (C, D) between two contacts of the corresponding contact arrangement, in which intermediate space at least two conducting tracks (28) having functionally reliable dimensions and distances can be arranged.

## Claims

### Claim 1

A semiconductor component (2) comprising a semiconductor chip (3), a housing (5) and a connection point arrangement (10) having at least two rows (14, 16) of flat connection points (12), wherein the connection points (12) are arranged on a bottom side of the housing (5) and are configured to be electrically connected via connections (9) to corresponding contacts (22) of a contact arrangement (20) having at least two rows (24, 26), said contact arrangement being arranged on a printed circuit board (7), wherein a geometry of the contact arrangement (20) corresponds to a geometry of the connection point arrangement (10), wherein a first distance is specified between two adjacent first connection points (14A) of a first row (14) of the connection point arrangement (10) and a second distance is specified between two adjacent second connection points (16A) of a second row (16) of the connection point arrangement (10), wherein the second connection points (16A) of the second row (16) are arranged offset to the first connection points (14A) of the first row (14), characterized in that the first distance at least between two adjacent first connection points (14A) of the first row (14) of the connection point arrangement (10) corresponds to an intermediate space (C, D) between two contacts (22) of the corresponding contact arrangement (20), in which intermediate space at least two conductor tracks (28) having functionally reliable dimensions and distances can be arranged.

### Claim 2 (depends on 1)

The semiconductor component (2) as claimed in claim 1, characterized in that the first distances between two adjacent first connection points (14A) of the first row (14) have identical values or different values.

### Claim 3 (depends on 1)

The semiconductor component (2) as claimed in claim 1, characterized in that the second distances between two adjacent second connection points (16A) of the second row (16) have identical values or different values.

### Claim 4

A contact-making arrangement (1) comprising
a semiconductor component (2), which comprises a semiconductor chip (3), a housing (5) and a connection point arrangement (10) having at least two rows (14, 16) of flat connection points (12), wherein the connection points (12) are arranged on a bottom side of the housing (5), and
a printed circuit board (7), which comprises a contact arrangement (20) having at least two rows (24, 26) of contacts (22), wherein a geometry of the contact arrangement (20) corresponds to a geometry of the connection point arrangement (10) and the connection points (12) of the connection point arrangement (10) are electrically connected via connections (9) to corresponding contacts (22) of the contact arrangement (20),
wherein the connection points (12) of the connection point arrangement (10) are separated by way of the contacts (22) of the contact arrangement (20) and by way of conductor tracks (28) of the printed circuit board (7), wherein a first distance is specified between two adjacent first connection points (14A) of a first row (14) of the connection point arrangement (10) and between two adjacent first contacts (24A) of a first row (24) of the contact arrangement (20), and a second distance is specified between two adjacent second connection points (16A) of a second row (16) of the connection point arrangement (10) and between two adjacent second contacts (26A) of a second row (26) of the contact arrangement (20), wherein the second connection points (16A) and the second contacts (26A) of the respective second row (16, 26) are arranged offset to the first connection points (14A) and the first contacts (24A) of the respective first row (14, 24), wherein the second contacts (26A) of the second row (26) are configured to be contacted via the conductor tracks (28), which are each led through an intermediate space (B, C, D) between two adjacent contacts (24A) of the first row (24), and wherein the first distance at least between two adjacent first connection points (14A) of the first row (14) of the connection point arrangement (10) and between two corresponding adjacent first contacts (24A) of the first row (24) of the contact arrangement (20) corresponds to an intermediate space (C, D) between two contacts (22) of the contact arrangement (20), in which intermediate space at least two conductor tracks (28) having functionally reliable dimensions and distances can be arranged, said at least two conductor tracks each making contact with a second contact (26A) of the second row (26).

### Claim 5 (depends on 4)

The contact-making arrangement (1) as claimed in claim 4, characterized in that the first distances between two adjacent first connection points (14A) and between two adjacent first contacts (24A) of the respective first row (14, 24) have identical values.

### Claim 6 (depends on 4)

The contact-making arrangement (1) as claimed in claim 4, characterized in that the first distances between two adjacent first connection points (14A) and between two adjacent first contacts (24A) of the respective first row (14, 24) have different values.

### Claim 7 (depends on 6)

The contact-making arrangement (1) as claimed in claim 6, characterized in that a first intermediate space (A) between two adjacent first contacts (24A) represents a minimum contact distance (mpa).

### Claim 8 (depends on 6)

The contact-making arrangement (1) as claimed in claim 6, characterized in that only one conductor track (28) is led between two adjacent first contacts (24A) in a second intermediate space (B).

### Claim 9 (depends on 6)

The contact-making arrangement (1) as claimed in claim 6, characterized in that two conductor tracks (28) are led between two adjacent first contacts (24A) in a third intermediate space (C).

### Claim 10 (depends on 6)

The contact-making arrangement (1) as claimed in claim 6, characterized in that three conductor tracks (28) are led between two adjacent first contacts (24A) in a fourth intermediate space (D).

### Claim 11 (depends on 4)

The contact-making arrangement (1) as claimed in claim 4, characterized in that the second distances between two adjacent second connection points (16A) and between two adjacent second contacts (26A) of the respective second row (16, 26) have identical values or different values.

### Claim 12 (depends on 11)

The contact-making arrangement (1) as claimed in claim 11, characterized in that the second connection points (16A) and the second contacts (26A) of the respective second row (16, 26) are oriented symmetrically to a center of the associated intermediate space (B, C, D) between two adjacent first connection points (14A) and between two adjacent first contacts (24A) of the respective first row (14, 24).

### Claim 13 (depends on 4)

The contact-making arrangement (1) as claimed in claim 4, characterized in that a wiring density (VDK) in a section of the contact arrangement (20) is calculated according to the formula VDK=kk/(mpb+4*rv+2*kü+n*mlb+(n−1)*mla), wherein kk represents a number of contacts in the section in question, mpb represents a minimum contact width, rv represents a maximum resist offset, kü represents a minimum edge covering, n represents a number of conductor tracks in the intermediate space (B, C, D) between two adjacent first contacts (26A), mlb represents a minimum conductor track width and mla represents a minimum conductor track distance.

### Claim 14 (depends on 13)

The contact-making arrangement (1) as claimed in claim 13, characterized in that N is a natural number in the range of from 1 to 3.