# US 11,310,912 B2 · High-current circuit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,912 B2 - Document ID: US11310912B2 - Status: Granted - Kind: B2 - Application number: 17/289,553 - Filed: 2019-10-01 - Published: 2021-11-18 - Granted: 2022-04-19 - Earliest claimed: 2018-10-30 - Assignees: Auto-Kabel Management GmbH - Applicants: Auto-Kabel Management GmbH - Inventors: Udo Kratzer; David Cacciatore - Web page: https://patentgrep.com/patent/US11310912B2 ## CPC - H05K 1/0206: {by printed thermal vias} - H05K 1/0212: {Printed circuits or mounted components having integral heating means} - H05K 1/0263: {High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence)} - H05K 1/0265: {characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections} - H05K 1/113: {Via provided in pad; Pad over filled via} - H05K 7/14329: {specially adapted for the configuration of power bus bars} - H10W 90/00: Package configurations - H05K 1/181: associated with surface mounted components - H05K 2201/0376: Flush conductors, i.e. flush with the surface of the printed circuit - H05K 2201/0979: Redundant conductors or connections, i.e. more than one current path between two points - H05K 2201/09972: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently - H05K 2201/10053: Switch - H05K 2201/10166: Transistor - H05K 2201/10272: Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract High-current circuit having a printed circuit board comprising a non-conductive substrate 2, a conductor layer 4 applied to the substrate 2 and an insulation layer 6 applied to the conductor layer, contact pads 8, 10, 12, 20, 22, 24 in each case interrupting the insulation layer 6 being arranged on both sides of the conductor plate, and the contact pads 8, 10, 12, 20, 22, 24 making contact with one another via vias 14 through the substrate 2, and the vias 14 being arranged in the area of the contact pads 8, 10, 12, 20, 22, 24, 10, 12, 20, 22, 24, characterized in that at least a first one of the contact pads 8 is arranged on a first side of the printed circuit board and a first semiconductor switch 28 is connected directly to at least a second one of the contact pads 20 on a second side of the printed circuit board, and in that the semiconductor switch 28 is connected to the first contact pad 8 directly via the vias 14 and the second contact pad 20, without further conductor tracks. ## Claims ### Claim 1 A high-current circuit, in particular motor vehicle high-current circuit, comprising: a printed circuit board made from a non-conductive substrate, a conductor layer applied to the substrate and an insulating layer applied to the conductor layer, wherein contact pads which break through the insulation layer are arranged on both sides of the printed circuit board, and the contact pads are in contact with one another via vias through the substrate, the vias being arranged in the area of the contact pads, wherein a first one of the contact pads is arranged on a first side of the printed circuit board and multiple second ones of the contact pads are arranged on a second side of the printed circuit board, isolated from each other and neighbouring each other; multiple semiconductor switches, wherein each of the multiple semiconductor switches is directly connected to a respective one of the second contact pads and to the first contact pad directly via the vias and the respective one of the second contact pad, without further conductor tracks; wherein power terminals of the plurality of the semiconductor switches are respectively connected to a respective one of the second contact pads; and wherein the first contact pad is connected with two or more of the multiple second ones of the contact pads via a plurality of vias and arranged with their entire surface on the first side of the printed circuit board. ### Claim 2 (depends on 1) High-current circuit according to claim 1, wherein the areas of the first and second contact pads are arranged one above the other on the two sides of the printed circuit board. ### Claim 3 (depends on 1) High-current circuit according to claim 1, further comprising a flat part, on the first side of the printed circuit board, directly connected to the first contact pad. ### Claim 4 (depends on 1) High-current circuit according to claim 1, wherein two of the semiconductor switches are electrically connected in series with one another on the second side of the printed circuit board, a third contact pad on the second side forming an electrical connection between the semiconductors electrically connected in series with one another without a further conductor track. ### Claim 5 (depends on 4) High-current circuit according to claim 4, wherein the areas of the third and a fourth contact pad on the two sides of the printed circuit board are arranged one above the other. ### Claim 6 (depends on 1) High-current circuit according to claim 1, wherein a second semiconductor switch is directly connected to the first contact pad on the first side of the printed circuit board. ### Claim 7 (depends on 6) High-current circuit according to claim 6, wherein the first and/or second semiconductor switch is directly connected to a flat part on its side facing away from one of the contact pads, in particular in that the first semiconductor switch is connected to the second contact pad by means of a first wide surface and is connected to a first flat part by means of a second wide surface opposite the first surface, and/or the second semiconductor switch is connected to the first contact pad by means of a first wide surface and is connected to a second flat part by means of a second wide surface opposite the first surface. ### Claim 8 (depends on 7) High-current circuit according to claim 7, wherein the flat part is arranged directly on the second surface of the semiconductor switch. ### Claim 9 (depends on 7) High-current circuit according to claim 7, wherein the flat part is connected to the at least one contact pad over the entire surface. ### Claim 10 (depends on 7) High-current circuit according to claim 7, wherein at least one of the flat parts is led out of the surface of the printed circuit board and forms a terminal lug for a power conductor. ### Claim 11 (depends on 1) High-current circuit according to claim 1, wherein the semiconductor switches have power terminals on their wide surfaces. ### Claim 12 (depends on 1) High-current circuit according to claim 1, wherein the semiconductor switches are electrically connected to one another exclusively via the vias. ### Claim 13 (depends on 1) High-current circuit according to claim 1, wherein the contact pad on the first side of the printed circuit board has an area which is at least equal to the area of all the terminals of the semiconductor switches on the second side of the printed circuit board. ### Claim 14 (depends on 1) High-current circuit according to claim 1, wherein on the second side of the printed circuit board a power terminal of a respective one of the semiconductor switches is directly connected to the respective second contact pad and a switching terminal of the semiconductor switch is connected to a further contact pad of a conductor track. ### Claim 15 (depends on 1) High-current circuit according to claim 1, wherein at least three contact pads which are insulated from one another are arranged on the first side of the printed circuit board, the at least three contact pads each being connected via the vias to power terminals of a plurality of the semiconductor switches, and a flat part being connected to each of the contact pads over the entire surface. ### Claim 16 (depends on 1) High-current circuit according to claim 1, wherein at least one second contact pad for each respective one of two power terminals is arranged on the second side for each respective one semiconductor switch. ### Claim 17 (depends on 1) High-current circuit according to claim 1, wherein contact pads of a plurality of power terminals of a plurality of the semiconductor switches are connected to one another over their entire surface on the second side. ### Claim 18 (depends on 1) High-current circuit according to claim 1, wherein the number of vias per contact pad of a power terminal is at least ten, preferably more than thirty. ### Claim 19 (depends on 1) High-current circuit according to claim 1 wherein the conductor layer between two edges of the printed circuit board is completely cut through and divides the printed circuit board into a first region and a second region, wherein the high-current circuit is arranged in the first region and a logic circuit is arranged in the second region.