# US 11,310,910 B2 · Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,310,910 B2
- Document ID: US11310910B2
- Status: Granted
- Kind: B2
- Application number: 16/493,531
- Filed: 2018-03-09
- Published: 2020-01-02
- Granted: 2022-04-19
- Earliest claimed: 2017-03-14
- Assignees: Mitsui Mining & Smelting Co., Ltd.
- Applicants: Mitsui Mining & Smelting Co., Ltd.
- Inventors: Yoshihiro Yoneda; Toshifumi Matsushima; Toshihiro Hosoi; Kenshiro Fukuda
- Web page: https://patentgrep.com/patent/US11310910B2

## CPC

- H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)}
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- B32B 15/043: {of metal (B32B15/01 takes precedence)}
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- C08K 3/22: of metals
- C08L 63/04: Epoxynovolacs
- C08L 67/00: Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain (of polyester-amides C08L77/12; of polyester-imides C08L79/08); Compositions of derivatives of such polymers
- C08L 77/00: Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain (of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08); Compositions of derivatives of such polymers
- C08L 77/10: Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
- H01G 4/1227: {based on alkaline earth titanates}
- H01G 4/14: Organic dielectrics
- H01G 4/18: of synthetic material, e.g. derivatives of cellulose (H01G4/16 takes precedence)
- H01G 4/206: {inorganic and synthetic material}
- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 1/162: {incorporating printed capacitors}
- B32B 2255/06: on metal layer
- B32B 2255/26: Polymeric coating
- B32B 2264/102: Oxide or hydroxide
- B32B 2307/204: Di-electric
- B32B 2457/08: PCBs, i.e. printed circuit boards
- B32B 2457/16: Capacitors
- C08L 2205/03: containing three or more polymers in a blend
- H01G 4/1236: {based on zirconium oxides or zirconates (H01G4/1263 takes precedence)}
- H01G 4/1254: {based on niobium or tungsteen, tantalum oxides or niobates, tantalates}
- H05K 1/0353: {consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement}
- H05K 2201/0209: Inorganic, non-metallic particles
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)

## Abstract

A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

## Claims

### Claim 1

A resin composition comprising
a resin component and
a dielectric filler,
wherein the resin component comprises
an epoxy resin composed of a biphenyl novolak epoxy resin,
an active ester resin, which is a curing agent that reacts to cure the epoxy resin, and
an aromatic polyamide resin containing a phenolic hydroxyl group;
wherein 100 parts by weight of the resin component comprises 22 to 46 parts by weight of the epoxy resin, 20 to 60 parts by weight of the aromatic polyamide resin and 18 to 34 parts by weight of the active ester resin,
wherein the resin composition has an insulation retention time of 500 hours or more, and
wherein the insulation retention time is determined by etching two sides of a copper clad laminate including a dielectric layer composed of the resin composition in cured state to form a circular circuit pattern with a diameter of 0.5 inches, soldering lines to upper and lower electrodes of the circuit pattern, connecting the lines to a tester for measurement of migration of ionized copper, placing the circular circuit pattern in a chamber having a temperature of 85° C. and a humidity of 85% RH, and applying a voltage of 3 V to the circular circuit pattern to measure time while a dielectric resistance is maintained at 1×105Ω or more.

### Claim 2 (depends on 1)

The resin composition according to claim 1, wherein the dielectric filler comprises at least one selected from the group consisting of BaTiO3, SrTiO3, Pb(Zr,Ti)O3, PbLaTiO3, PbLaZrO, and SrBi2Ta2O9.

### Claim 3 (depends on 1)

The resin composition according to claim 1, wherein the dielectric filler is BaTiO3.

### Claim 4 (depends on 1)

The resin composition according to claim 1, wherein 100 parts by weight of the solid content of the resin composition comprises 60 to 95 parts by weight of the dielectric filler.

### Claim 5 (depends on 1)

A resin-coated copper foil comprising a copper foil and the resin composition according to claim 1, wherein the resin composition is provided on at least one side of the copper foil.

### Claim 6 (depends on 1)

A dielectric layer composed of the resin composition according to claim 1 that is cured.

### Claim 7 (depends on 6)

The dielectric layer according to claim 6, wherein the dielectric layer has a thickness of 0.2 to 30 μm.

### Claim 8 (depends on 6)

A copper-clad laminate comprising, in sequence, a first copper foil, the dielectric layer according to claim 6, and a second copper foil.

### Claim 9 (depends on 6)

A capacitor device comprising the dielectric layer according to claim 6.

### Claim 10 (depends on 6)

A capacitor-embedded printed circuit board comprising the dielectric layer according to claim 6.