# US 11,310,903 B2 · Multi-zone heat sink for printed circuit boards

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- Number: US 11,310,903 B2
- Document ID: US11310903B2
- Status: Granted
- Kind: B2
- Application number: 17/128,762
- Filed: 2020-12-21
- Published: 2021-06-24
- Granted: 2022-04-19
- Earliest claimed: 2019-12-19
- Assignees: dSPACE digital signal processing and control engineering GmbH
- Applicants: dSPACE digital signal processing and control engineering GmbH
- Inventors: Robert Breicher; Van Son Nguyen; Johannes Henkel
- Web page: https://patentgrep.com/patent/US11310903B2

## CPC

- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- H05K 7/20518: {Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots}
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.

## Claims

### Claim 1

A heat sink for contacting a large area of a printed circuit board populated with electronic components, the heat sink comprising:
a first sub-area for absorption of waste heat from a first electronic component arranged on the printed circuit board;
a second sub-area for absorption of waste heat from a second electronic component arranged on the printed circuit board;
a thermal isolator to thermally isolate the first sub-area from the second sub-area; and
a rigid mechanical connection formed between the first sub-area and the second sub-area that spans the thermal isolator,
wherein the first sub-area and the second sub-area each have a lower surface that is connected to the printed circuit board, an upper surface that opposes the lower surface and faces away from the printed circuit board and side surfaces that connect between the upper surface and the lower surface,
wherein the thermal isolator entirely physically separates the first sub-area from the second sub-area, such that a first one of the side surfaces of the first sub-area opposes a first one of the side surfaces of the second sub-area with the thermal isolator provided therebetween, and
wherein the rigid mechanical connection is a bridge that extends over the thermal isolator with one end of the bridge being integral with the upper surface of the first sub-area and another end of the bridge being integral with the upper surface of the second sub-area, so that the thermal isolator extends uninterrupted along an entire length of the first one of the side surfaces of the first sub-area and an entire length of the first one of the side surfaces of the second sub-area.

### Claim 2 (depends on 1)

The heat sink according to claim 1, wherein the thermal isolator is formed as a gap in the heat sink extending between the first sub-area and the second sub-area.

### Claim 3 (depends on 1)

The heat sink according to claim 1, wherein the rigid mechanical connection transitions seamlessly into the first sub-area and into the second sub-area.

### Claim 4 (depends on 1)

The heat sink according to claim 1, wherein the heatsink, including the first sub-area, the second sub-area and the rigid mechanical connection, is a monolithic, metallic body.

### Claim 5 (depends on 1)

The heat sink according to claim 1, wherein the rigid mechanical connection is formed to cause turbulence in an airflow cooling the heat sink to increase a thermal isolating effect of the rigid mechanical connection.

### Claim 6 (depends on 1)

A printed circuit board comprising:
a first electronic component;
a second electronic component; and
a heat sink according to claim 1 arranged on a large area of the printed circuit board, the first sub-area being spatially arranged to absorb waste heat from the first electronic component, and the second sub-area being spatially arranged to absorb waste heat from the second electronic component.

### Claim 7 (depends on 6)

The printed circuit board according to claim 6, wherein the heat sink is designed such that, by dimensioning the first sub-area and the second sub-area, a temperature of the first sub-area is higher than a temperature of the second sub-area at thermal equilibrium after the printed circuit board is in an operating state.