# US 11,310,606 B2 · MEMS microphone

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- Number: US 11,310,606 B2
- Document ID: US11310606B2
- Status: Granted
- Kind: B2
- Application number: 16/986,304
- Filed: 2020-08-06
- Published: 2020-12-31
- Granted: 2022-04-19
- Earliest claimed: 2019-06-29
- Assignees: Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Applicants: Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Inventors: Bei Tong; Zhan Zhan; Yang Li; Kahkeen Lai; Xiaohui Zhong; Lian Duan
- Web page: https://patentgrep.com/patent/US11310606B2

## CPC

- H04R 23/02: Transducers using more than one principle simultaneously
- B81B 3/0021: {Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00)}
- H04R 7/06: comprising a plurality of sections or layers
- H04R 17/02: Microphones
- H04R 19/005: {using semiconductor materials}
- H04R 19/04: Microphones (H04R19/01 takes precedence)
- B81B 2201/0257: Microphones or microspeakers
- B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
- B81B 2203/0315: Cavities
- B81B 2203/04: Electrodes
- H04R 2201/003: Mems transducers or their use
- H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)

## Abstract

The present disclosure provides an MEMS microphone including a base having a rear cavity and a capacitor system disposed on the base. The capacitor system includes a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity. A piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity. The piezoelectric diaphragm, under the deformation effect of the diaphragm, deforms to generate and output charges. Therefore, the MEMS microphone can output two groups of electrical signals, one group of electrical signals output by the capacitor system and one group of electrical signals output by the piezoelectric diaphragm, thereby sensitivity of the microphone is improved.

## Claims

### Claim 1

An MEMS microphone, comprising
a base having a rear cavity, and
a capacitor system disposed on the base;
the capacitor system comprising a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity;
wherein a piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity;
a first insulating layer is provided between the capacitor system and the base, the first insulating layer being connected with the capacitor system or the base, a second insulating layer is provided between the diaphragm and the rear plate, and the second insulating layer is connected with the diaphragm or the rear plate.

### Claim 2 (depends on 1)

The MEMS microphone according to claim 1, wherein a side of the piezoelectric diaphragm is provided with a pressed film electrode, the side being away from the acoustic cavity.

### Claim 3 (depends on 2)

The MEMS microphone according to claim 2, wherein the pressed film electrode is a loop.

### Claim 4 (depends on 1)

The MEMS microphone according to claim 1, wherein the diaphragm and the piezoelectric diaphragm are correspondingly provided with a through hole that is in communication with the acoustic cavity.

### Claim 5 (depends on 1)

The MEMS microphone according to claim 1, wherein the rear plate is provided with an acoustic hole through which the acoustic cavity and the rear cavity are in communication.

### Claim 6 (depends on 5)

The MEMS microphone according to claim 5, wherein the rear plate comprises a first protection layer, a rear plate layer and a second protection layer that are superimposed in order, the first protection layer facing the acoustic cavity and the acoustic hole passing through the first protection layer, the rear plate layer and the second protection layer.

### Claim 7 (depends on 6)

The MEMS microphone according to claim 6, wherein a surface of the first protection layer is provided with an insulating protrusion that is configured to prevent the rear plate from sticking to the diaphragm, the surface facing the acoustic cavity.

### Claim 8 (depends on 1)

The MEMS microphone according to claim 1, wherein an outer side of the first insulating layer and second insulating layer is provided with a third protection layer.