# US 11,310,449 B2 · Solid-state imaging device and electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,449 B2 - Document ID: US11310449B2 - Status: Granted - Kind: B2 - Application number: 16/972,172 - Filed: 2019-03-26 - Published: 2021-08-05 - Granted: 2022-04-19 - Earliest claimed: 2018-06-12 - Assignees: Sony Semiconductor Solutions Corporation - Applicants: Sony Semiconductor Solutions Corporation - Inventors: Luonghung Asakura - Web page: https://patentgrep.com/patent/US11310449B2 ## CPC - H04N 25/617: for reducing electromagnetic interference, e.g. clocking noise - H04N 25/76: Addressed sensors, e.g. MOS or CMOS sensors - H04N 25/60: Noise processing, e.g. detecting, correcting, reducing or removing noise - H04N 25/677: for reducing the column or line fixed pattern noise - H04N 25/78: Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract Provided is a new solid-state imaging device and electronic apparatus capable of eliminating streaking. Provided is a solid-state imaging device including: plurality of pixels provided in a pixel region on a substrate in a matrix form; a plurality of first wirings commonly provided to each of the plurality of pixels arranged along a first direction; a second wiring capacitively coupled to each of the plurality of first wirings; and a second detection unit that is electrically connected to the second wiring and detects a second signal appearing on the second wiring. ## Claims ### Claim 1 A solid-state imaging device, comprising: a plurality of pixels in a pixel region on a substrate in a matrix form; a plurality of first wirings commonly provided to each pixel of the plurality of pixels arranged along a first direction; a second wiring capacitively coupled to each first wiring of the plurality of first wirings; a plurality of first detection units electrically connected to each first wiring of the plurality of first wirings, wherein the plurality of first detection units is configured to detect a first signal that appears on each first wiring of the plurality of first wirings; a second detection unit electrically connected to the second wiring, wherein the second detection unit is configured to: detect a second signal that appears on the second wiring; and detect a sum of a plurality of first signals that appears on each first wiring of the plurality of first wirings; and a processing unit configured to: estimate a noise amount based on an average of the detected sum of the plurality of first signals that appears on each first wiring of the plurality of first wirings; and correct a signal amount corresponding to the detected first signal based on the estimated noise amount. ### Claim 2 (depends on 1) The solid-state imaging device according to claim 1, wherein the plurality of first detection units and the second detection unit are analog-digital converters in a detection unit region on the substrate. ### Claim 3 (depends on 2) The solid-state imaging device according to claim 2, wherein the pixel region is on a first substrate, the detection unit region is on a second substrate, and the second substrate is different from the first substrate. ### Claim 4 (depends on 1) The solid-state imaging device according to claim 1, further comprising: a load device region in which a plurality of load devices is arranged on the substrate, wherein each load device of the plurality of load devices is electrically connected to each first wiring of the plurality of first wirings. ### Claim 5 (depends on 1) The solid-state imaging device according to claim 1, wherein the plurality of first detection units and the second detection unit have same circuit configuration. ### Claim 6 (depends on 1) The solid-state imaging device according to claim 1, wherein the second wiring is electrically connected to a bias circuit via a switch. ### Claim 7 (depends on 1) The solid-state imaging device according to claim 1, wherein a first capacitance value of a first coupling capacitor generated based on capacitively coupling each first wiring of the plurality of first wirings and the second wiring is proportional to an area of a region in which the plurality of first wirings and the second wiring overlay each other. ### Claim 8 (depends on 7) The solid-state imaging device according to claim 7, further comprising: a capacitor that is electrically connected to the second wiring and has a second capacitance value. ### Claim 9 (depends on 8) The solid-state imaging device according to claim 8, wherein the second capacitance value is greater than the first capacitance value. ### Claim 10 (depends on 7) The solid-state imaging device according to claim 7, wherein the second wiring is capacitively coupled to a third wiring to generate a second coupling capacitor having a second capacitance value. ### Claim 11 (depends on 1) The solid-state imaging device according to claim 1, wherein each first wiring of the plurality of first wirings extends along the first direction on the substrate, and the second wiring extends along a second direction orthogonal to the first direction on the substrate. ### Claim 12 (depends on 1) The solid-state imaging device according to claim 1, further comprising: a plurality of second wirings; and a plurality of second detection units, wherein each second wiring of the plurality of second wirings is capacitively coupled to a specific number of first wirings of the plurality of first wirings. ### Claim 13 (depends on 12) The solid-state imaging device according to claim 12, wherein a specific number of first detection units of the plurality of first detection units are alternately arranged to the plurality of second detection units in a detection unit region on the substrate. ### Claim 14 (depends on 1) The solid-state imaging device according to claim 1, further comprising: a plurality of second wirings; and a plurality of second detection units, wherein an array region in which the plurality of first detection units is sandwiched between the plurality of second detection units. ### Claim 15 (depends on 2) The solid-state imaging device according to claim 2, wherein the pixel region is on a first surface of the substrate, the detection unit region is on a second surface of the substrate, and the second surface is different from the first surface. ### Claim 16 An electronic apparatus, comprising: a solid-state imaging device, wherein the solid-state imaging device includes: a plurality of pixels in a pixel region on a substrate in a matrix form; a plurality of first wirings commonly provided to each pixel of the plurality of pixels arranged along a first direction; a second wiring capacitively coupled to each first wiring of the plurality of first wirings; a plurality of first detection units electrically connected to each first wiring of the plurality of first wirings, wherein the plurality of first detection units is configured to detect a first signal that appears on each first wiring of the plurality of first wirings; a second detection unit electrically connected to the second wiring, wherein the second detection unit is configured to: detect a second signal that appears on the second wiring; and detect a sum of a plurality of first signals that appears on each first wiring of the plurality of first wirings; and a processing unit configured to: estimate a noise amount based on an average of the detected sum of the plurality of first signals that appears on each first wiring of the plurality of first wirings; and correct a signal amount corresponding to the detected first signal based on the estimated noise amount. ### Claim 17 A solid-state imaging device, comprising: a plurality of pixels in a pixel region on a substrate in a matrix form; a plurality of first wirings commonly provided to each pixel of the plurality of pixels arranged along a first direction; a first detection unit electrically connected to each of the plurality of first wirings; a second wiring capacitively coupled to each first wiring of the plurality of first wirings; and a second detection unit electrically connected to the second wiring, wherein the second detection unit is configured to detect a second signal that appears on the second wiring, wherein a first capacitance value of a first coupling capacitor generated based on capacitively coupling each first wiring of the plurality of first wirings and the second wiring is proportional to an area of a region in which the plurality of first wirings and the second wiring overlay each other. ### Claim 18 (depends on 17) The solid-state imaging device according to claim 17, further comprising: a capacitor that is electrically connected to the second wiring and has a second capacitance value, wherein the second capacitance value is greater than the first capacitance value. ### Claim 19 (depends on 17) The solid-state imaging device according to claim 17, wherein the second wiring is capacitively coupled to a third wiring to generate a second coupling capacitor having a second capacitance value.