# US 11,310,403 B2 · Camera module and calibration method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,403 B2 - Document ID: US11310403B2 - Status: Granted - Kind: B2 - Application number: 16/659,641 - Filed: 2019-10-22 - Published: 2021-02-18 - Granted: 2022-04-19 - Earliest claimed: 2019-08-16 - Assignees: Primax Electronics Ltd. - Applicants: Primax Electronics Ltd. - Inventors: Chin-Ding Lai - Web page: https://patentgrep.com/patent/US11310403B2 ## CPC - G02B 7/025: {using glue} - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H02N 2/028: {along multiple or arbitrary translation directions, e.g. XYZ stages} - H02N 2/062: {Small signal circuits; Means for controlling position or derived quantities, e.g. for removing hysteresis} - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - G02B 7/021: {for more than one lens} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H02N: ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ## Abstract A camera module includes a substrate, a sensing chip, a lens module and a piezoelectric plate. The sensing chip is electrically connected with the substrate. The sensing chip includes a sensing region. The sensing chip is covered by the lens module. The sensing chip is arranged between the substrate and the lens module. When an external light beam passes through the lens module and projected on the sensing region, the sensing chip generates an image. The piezoelectric plate is arranged between the substrate and the lens module. When an electric power is provided to the piezoelectric plate, the piezoelectric plate is subjected to deformation, so that the lens group focuses on the sensing region. The present invention also provides a calibration method for the camera module. ## Claims ### Claim 1 A camera module, comprising: a substrate; a sensing chip electrically connected with the substrate, wherein the sensing chip comprises a sensing region; a lens module, wherein the sensing chip is covered by the lens module, and the sensing chip is arranged between the substrate and the lens module, wherein when an external light beam passes through the lens module and projected on the sensing region, the sensing chip generates an image, and the lens module comprises a lens holder and a lens group supported on the lens holder; and a piezoelectric plate arranged between the substrate and the lens module, and beneath the lens holder and separated from the lens group, wherein when an electric power is provided to the piezoelectric plate, the piezoelectric plate is subjected to a deformation, so that the lens group focuses on the sensing region; wherein the piezoelectric plate is in contact with the sensing chip. ### Claim 2 (depends on 1) The camera module according to claim 1, wherein the piezoelectric plate is a piezoelectric ceramic plate or a macro fiber composite (MFC) structure. ### Claim 3 (depends on 1) The camera module according to claim 1, wherein the lens module is a fixed-focus lens module. ### Claim 4 (depends on 1) The camera module according to claim 1, wherein the camera module further comprises a driving chip, which is electrically connected between the substrate and the piezoelectric plate, wherein when the driving chip provides the electric power to the piezoelectric plate, the piezoelectric plate is subjected to the deformation. ### Claim 5 (depends on 1) The camera module according to claim 1, wherein a top surface of the piezoelectric plate is connected with the lens holder of the lens module, and a bottom surface of the piezoelectric plate is connected with the substrate. ### Claim 6 (depends on 5) The camera module according to claim 5, wherein the top surface of the piezoelectric plate is connected with the lens holder of the lens module through a glue. ### Claim 7 (depends on 5) The camera module according to claim 5, wherein the bottom surface of the piezoelectric plate is connected with the substrate through a surface mount technology, or the bottom surface of the piezoelectric plate is connected with the substrate through an adhesive. ### Claim 8 (depends on 1) The camera module according to claim 1, wherein the piezoelectric plate has a hollow structure, and the sensing chip is enclosed by the hollow structure. ### Claim 9 (depends on 8) The camera module according to claim 8, wherein the lens holder has an opening, and a vertical projection area of the opening of the lens holder is greater than a vertical projection area of the hollow structure of the piezoelectric plate. ### Claim 10 (depends on 8) The camera module according to claim 8, wherein a vertical projection area of the hollow structure of the piezoelectric plate is equal to a vertical projection area of the sensing chip. ### Claim 11 (depends on 1) The camera module according to claim 1, wherein the lens group comprises at least one optical lens. ### Claim 12 (depends on 1) The camera module according to claim 1, wherein the substrate is a flexible printed circuit board, a rigid-flex board, a copper clad laminate or a ceramic substrate. ### Claim 13 (depends on 1) The camera module according to claim 1, wherein the camera module further comprises a memory, and a value of the electric power provided to the piezoelectric plate is stored in the memory. ### Claim 14 (depends on 1) The camera module according to claim 1, wherein the camera module is included in a portable electronic device and a vehicular electronic device. ### Claim 15 (depends on 1) The camera module according to claim 1, wherein the piezoelectric plate is separated from the lens holder. ### Claim 16 A calibration method for a camera module, the camera module comprising a substrate, a sensing chip, a lens module and a piezoelectric plate, the sensing chip being electrically connected with the substrate, the sensing chip being covered by the lens module and arranged between the substrate and the lens module, the lens module comprising a lens holder and a lens group supported on the lens holder, the piezoelectric plate being arranged between the substrate and the lens module, and beneath the lens holder and separated from the lens group, the calibration method comprising steps of: if a spacing distance between the lens group and the sensing chip does not match a focal length of the lens group, acquiring a value of an electric power for driving the deformation of the piezoelectric plate to have the spacing distance between the lens group and the sensing chip match the focal length of the lens group; storing the value of the electric power; and providing the value of the electric power to the piezoelectric plate when the camera module is enabled to perform an image capturing operation; wherein the piezoelectric plate is in contact with the sensing chip. ### Claim 17 (depends on 16) The calibration method according to claim 16, wherein the value of the electric power is stored in a memory of the camera module. ### Claim 18 (depends on 16) The calibration method according to claim 16, wherein the lens group comprises at least one optical lens.