# US 11,310,400 B2 · Electronic device including electronic component assembly

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- Number: US 11,310,400 B2
- Document ID: US11310400B2
- Status: Granted
- Kind: B2
- Application number: 16/884,446
- Filed: 2020-05-27
- Published: 2021-01-28
- Granted: 2022-04-19
- Earliest claimed: 2019-07-26
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Jisoo Choi; Jehyun Son; Dusun Choi
- Web page: https://patentgrep.com/patent/US11310400B2

## CPC

- H04N 23/51: Housings
- G06F 1/1626: {with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]}
- G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)}
- G06F 1/1686: {the I/O peripheral being an integrated camera}
- G06F 1/1694: {the I/O peripheral being a single or a set of motion sensors for pointer control or gesture input obtained by sensing movements of the portable computer}
- G06F 1/1698: {the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone (details of antennas disposed inside a computer H01Q1/2266)}
- H04M 1/0264: {for a camera module assembly}
- H04M 1/0277: {for a printed circuit board assembly}
- H04N 23/45: for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
- H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H04M 1/026: {Details of the structure or mounting of specific components}
- H04M 2250/12: including a sensor for measuring a physical value, e.g. temperature or motion
- H05K 2201/05: Flexible printed circuits [FPCs]
- H05K 2201/10121: Optical component, e.g. opto-electronic component
- H05K 2201/10151: Sensor
- H05K 2201/10189: Non-printed connector
- H05K 2201/10356: Cables
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof; and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.

## Claims

### Claim 1

An electronic device comprising:
a housing including a printed circuit board (PCB) in an inner space thereof; and
a camera module assembly disposed in the inner space and including:
a module housing;
a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and
a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB,
wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction, and
wherein the module housing includes an extension having a support structure for supporting a radio frequency (RF) cable disposed in the inner space and electrically connecting the PCB to an antenna structure.

### Claim 2 (depends on 1)

The electronic device of claim 1, wherein the first FPCB includes a first electrical connector electrically connected to the PCB,
wherein the second FPCB includes a second electrical connector electrically connected to the PCB, and
wherein the first FPCB and the second FPCB are disposed such that the first electrical connector and the second electrical connector are aligned side by side.

### Claim 3 (depends on 1)

The electronic device of claim 1, wherein the module housing includes a first opening for accommodating the first camera module, and a second opening for accommodating the second camera module, and
wherein the first and second camera modules are disposed to be exposed or protruded at least in part through the first opening and the second opening, respectively.

### Claim 4 (depends on 1)

The electronic device of claim 1, wherein the support structure has a groove for accommodating and supporting at least a portion of the RF cable.

### Claim 5 (depends on 1)

The electronic device of claim 1, wherein the module housing comprises a polymer.

### Claim 6 (depends on 1)

The electronic device of claim 1, wherein the first camera module is configured to be removed from the module housing without removing the second camera module, and wherein the second camera module is configured to be removed from the module housing without removing the first camera module.

### Claim 7 (depends on 1)

The electronic device of claim 1, wherein the housing includes a front cover, a rear cover facing in a direction opposite to the front cover, and a lateral member disposed to surround the inner space between the front cover and the rear cover, and
wherein the camera module assembly is disposed such that the first camera module and the second camera module detect an external environment through the rear cover.

### Claim 8 (depends on 7)

The electronic device of claim 7, further comprising:
a display disposed in the inner space to be visible at least in part from an outside of the electronic device through the front cover.

### Claim 9

An electronic device comprising:
a housing including a printed circuit board (PCB) in an inner space thereof; and
an electronic component assembly disposed in the inner space and including:
a module housing;
a first electronic component having a first housing, the first electrical component disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and
a second electronic component having a second housing separate from the first housing, the second electronic component disposed in the module housing to be adjacent to the first electronic component and including a second FPCB drawn out of the module housing and connected to the PCB,
wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction, and
wherein the module housing includes an extension having a support structure for supporting a radio frequency (RF) cable disposed in the inner space and electrically connecting the PCB to an antenna structure.

### Claim 10 (depends on 9)

The electronic device of claim 9, wherein the first FPCB includes a first electrical connector electrically connected to the PCB,
wherein the second FPCB includes a second electrical connector electrically connected to the PCB, and
wherein the first FPCB and the second FPCB are disposed such that the first electrical connector and the second electrical connector are aligned side by side.

### Claim 11 (depends on 9)

The electronic device of claim 9, wherein the support structure has a groove for accommodating and supporting at least a portion of the RF cable.

### Claim 12 (depends on 9)

The electronic device of claim 9, wherein the first electronic component is configured to be removed from the module housing without removing the second electronic component, and wherein the second electronic component is configured to be removed without removing the first electronic component.

### Claim 13 (depends on 9)

The electronic device of claim 9, wherein at least one of the first electronic component or the second electronic component includes a proximity sensor module, a fingerprint sensor module, a gesture sensor module, a gyro sensor module, a barometric sensor module, a temperature sensor module, a humidity sensor module, a magnetic sensor module, an acceleration sensor module, a grip sensor module, an illumination sensor module, an infrared sensor module, a color sensor module, a camera module, an ultrasonic sensor module, an iris sensor module, a biometric sensor module, or a time-of-flight (TOF) sensor module.

### Claim 14 (depends on 9)

The electronic device of claim 9, wherein the housing includes a front cover, a rear cover facing in a direction opposite to the front cover, and a lateral member disposed to surround the inner space between the front cover and the rear cover, and
wherein the electronic component assembly is disposed such that the first electronic component and the second electronic component detect an external environment through the front cover or the rear cover.

### Claim 15 (depends on 14)

The electronic device of claim 14, further comprising:
a display disposed in the inner space to be visible at least in part from an outside of the electronic device through the front cover.

### Claim 16 (depends on 9)

The electronic device of claim 9, wherein the module housing is formed of metal and/or polymer.