# US 11,309,868 B2 · Multiplexer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,868 B2 - Document ID: US11309868B2 - Status: Granted - Kind: B2 - Application number: 16/417,286 - Filed: 2019-05-20 - Published: 2020-02-27 - Granted: 2022-04-19 - Earliest claimed: 2018-08-24 - Assignees: Taiyo Yuden Co., Ltd. - Applicants: Taiyo Yuden Co., Ltd. - Inventors: Eiji Kuwahara - Web page: https://patentgrep.com/patent/US11309868B2 ## CPC - H03H 7/463: {Duplexers} - H03H 9/72: Networks using surface acoustic waves - H03H 7/0161: {Bandpass filters (H03H7/12 takes precedence)} - H03H 9/0542: {consisting of a lateral arrangement (H03H9/0566 takes precedence)} - H03H 9/0571: {including bulk acoustic wave [BAW] devices} - H03H 9/0576: {including surface acoustic wave [SAW] devices} - H03H 9/1085: {the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device} - H03H 9/205: having multiple resonators (crystal tuning forks H03H9/21) - H03H 9/54: comprising resonators of piezoelectric or electrostrictive material (comprising resonators using surface acoustic waves H03H9/64) - H03H 9/64: using surface acoustic waves - H03H 9/706: {Duplexers} - H03H 9/725: {Duplexers} - H03H 7/1708: {Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path (H03H7/07 takes precedence)} - H03H 7/1741: {Comprising typical LC combinations, irrespective of presence and location of additional resistors (when resistors are present, also classify in H03H7/06 - H03H7/07)} - H03H 7/175: {Series LC in series path (H03H7/1783 takes precedence)} - H03H 7/1758: {Series LC in shunt or branch path (H03H7/1791 takes precedence)} - H03H 7/1766: {Parallel LC in series path (H03H7/1783 takes precedence)} - H03H 7/1775: {Parallel LC in shunt or branch path (H03H7/1791 takes precedence)} - H03H 7/1791: {Combined LC in shunt or branch path} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract A multiplexer includes: a first terminal; a second terminal; a third terminal; a first filter connected between the first and second terminals, including a first capacitor, a first inductor, and one or more first acoustic wave resonators, and having a first passband; a second filter connected between the first and third terminals, including a second capacitor, a second inductor, and one or more second acoustic wave resonators, and having a second passband higher than the first passband; a substrate having a surface on which at least one first acoustic wave resonator of the one or more first acoustic wave resonators and at least one second acoustic wave resonator of the one or more second acoustic wave resonators are located; and a metal structure located on the surface and located between the at least one first acoustic wave resonator and the at least one second acoustic wave resonator. ## Claims ### Claim 1 A multiplexer comprising: a first terminal; a second terminal; a third terminal; a first filter that is connected between the first terminal and the second terminal, includes a first capacitor, a first inductor, and one or more first acoustic wave resonators, and has a first passband; a second filter that is connected between the first terminal and the third terminal, includes a second capacitor, a second inductor, and one or more second acoustic wave resonators, and has a second passband higher than the first passband, the second passband not overlapping with the first passband; a substrate that has a surface on which a film is directly located, at least one first acoustic wave resonator of the one or more first acoustic wave resonators and at least one second acoustic wave resonator of the one or more second acoustic wave resonators including the film, the at least one first acoustic wave resonator being shunt-connected between the first terminal and the second terminal; the at least one second acoustic wave resonator being shunt-connected between the first terminal and the third terminal; a resonant frequency of the at least one first acoustic wave resonator and a resonant frequency of the at least one second acoustic wave resonator being located between the first passband and the second passband; and a metal structure that is located on the surface, and is located between the at least one first acoustic wave resonator and the at least one second acoustic wave resonator, wherein the resonant frequency of the at least one first acoustic wave resonator is formed by the at least one first acoustic wave resonator without a separate inductor or capacitor and the resonant frequency of the at least one second acoustic wave resonator is formed by the at least one second acoustic wave resonator without a separate inductor or capacitor, and no capacitor is connected in parallel with the at least one first acoustic wave resonator between a first end of the at least one first acoustic wave resonator and a second end of the at least one first acoustic wave resonator and no capacitor is connected in parallel with the at least one second acoustic wave resonator between a first end of the at least one second acoustic wave resonator and a second end of the at least one second acoustic wave resonator. ### Claim 2 (depends on 1) The multiplexer according to claim 1, further comprising a multilayered body including dielectric layers being stacked, the first capacitor, the first inductor, the second capacitor and the second inductor, being separated from the substrate. ### Claim 3 (depends on 2) The multiplexer according to claim 2, wherein the multilayered body includes a first multilayered body including the first capacitor and the first inductor and not including the second capacitor and the second inductor and a second multilayered body including the second capacitor and the second inductor and not including the first capacitor and the first inductor. ### Claim 4 (depends on 3) The multiplexer according to claim 3, further comprising another substrate, the first multilayered body and the second multilayered body are located on the another substrate and the substrate is located on the another substrate between the first multilayered body and the second multilayered body. ### Claim 5 (depends on 2) The multiplexer according to claim 2, further comprising another substrate on which the substrate and the multilayered body are located. ### Claim 6 (depends on 1) The multiplexer according to claim 1, wherein the metal structure is a metal film located on the surface. ### Claim 7 (depends on 6) The multiplexer according to claim 6, wherein the metal film is provided in plurality, the metal films are arranged in a direction substantially perpendicular to a direction from the at least one first acoustic wave resonator to the at least one second acoustic wave resonator, and the metal films are located in different regions on the surface and separated from each other. ### Claim 8 (depends on 6) The multiplexer according to claim 6, wherein the metal film is located so as to cover the at least one second acoustic wave resonator when the at least one second acoustic wave resonator is viewed from the at least one first acoustic wave resonator. ### Claim 9 (depends on 6) The multiplexer according to claim 6, wherein a width of the metal film in a direction from the at least one first acoustic wave resonator to the at least one second acoustic wave resonator is larger than a first distance between the metal film and a first wire line in the direction and a second distance between the metal film and a second wire line in the direction, the first wire line is connected to the at least one second acoustic wave resonator and the second wire line connected to the at least one second acoustic wave resonator. ### Claim 10 (depends on 1) The multiplexer according to claim 1, wherein the first filter has a first guard band, the second filter has a second guard band, at least a part of the first passband overlaps with at least a part of the second guard band, and at least a part of the second passband overlaps with at least a part of the first guard band. ### Claim 11 (depends on 10) The multiplexer according to claim 10, wherein the first passband and the second guard band are wider than a band from 1700 MHz to 2200 MHz, and the second passband and the first guard band are wider than a band from 2300 MHz to 2690 MHz. ### Claim 12 (depends on 1) The multiplexer according to claim 1, wherein the metal structure is electrically connected to none of the first filter, the second filter, and other conductive patterns on the surface. ### Claim 13 (depends on 1) The multiplexer according to claim 1, wherein the metal structure is electrically connected to grounds of the first filter and the second filter in the multiplexer. ### Claim 14 (depends on 1) The multiplexer according to claim 1, wherein the metal structure is electrically connected to none of the first filter and the second filter in the multiplexer, and is electrically connected to a ground electrically independent from the first filter and the second filter. ### Claim 15 (depends on 1) The multiplexer according to claim 1, wherein between the first terminal and the second terminal, the first capacitor is connected in series and/or shunt-connected, and the first inductor is connected in series and/or shunt-connected, and between the first terminal and the third terminal, the second capacitor is connected in series and/or shunt-connected, and the second inductor is connected in series and/or shunt-connected. ### Claim 16 (depends on 1) The multiplexer according to claim 1, wherein a width of the first passband is 300 MHz or greater, and a width of the second passband is 300 MHz or greater. ### Claim 17 (depends on 1) The multiplexer according to claim 1, wherein the surface of the substrate is a surface of a piezoelectric substrate, and the file includes an interdigital transducer. ### Claim 18 (depends on 1) The multiplexer according to claim 1, wherein the surface of the substrate is a surface of a sapphire substrate, a spinel substrate, an alumina substrate, a glass substrate, a crystal substrate, or a silicon substrate, and the film includes a lower electrode, an upper electrode and a piezoelectric film being sandwiched by the lower electrode and the upper electrode.