# US 11,309,639 B2 · Antenna and communications apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,639 B2 - Document ID: US11309639B2 - Status: Granted - Kind: B2 - Application number: 17/020,022 - Filed: 2020-09-14 - Published: 2020-12-31 - Granted: 2022-04-19 - Earliest claimed: 2018-03-15 - Assignees: Huawei Technologies Co., Ltd. - Applicants: Huawei Technologies Co., Ltd. - Inventors: Ming Chang; Liangsheng Liu; Qizhang Hong - Web page: https://patentgrep.com/patent/US11309639B2 ## CPC - H01Q 9/0414: {in a stacked or folded configuration} - H01Q 21/065: {Patch antenna array} - H01Q 1/002: {Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna} - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 5/371: Branching current paths - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H01Q 9/0457: {electromagnetically coupled to the feed line} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An antenna and a communications apparatus, where the antenna includes surface radiating patches, inner radiating patches, a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, and a second dielectric substrate disposed below the inner radiating patches and configured to carry antenna feeders coupled to the inner radiating patches. A dielectric constant or dielectric loss of the first dielectric substrate is lower than that of an organic resin substrate, and a coefficient of thermal expansion of the second dielectric substrate is lower than that of the organic resin substrate. ## Claims ### Claim 1 An antenna comprising: a plurality of surface radiating patches; a plurality of inner radiating patches; a plurality of antenna feeders coupled to the inner radiating patches; an organic resin substrate comprising a first dielectric constant or a first dielectric loss, and a first coefficient of thermal expansion; a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, wherein a second dielectric constant or a second dielectric loss of the first dielectric substrate is lower than the first dielectric constant or the first dielectric loss; and a second dielectric substrate disposed below the inner radiating patches and configured to carry a first part of the antenna feeders, wherein a second coefficient of thermal expansion of the second dielectric substrate is lower than the first coefficient of thermal expansion. ### Claim 2 (depends on 1) The antenna of claim 1, wherein the second dielectric constant is lower than 3.6. ### Claim 3 (depends on 1) The antenna of claim 1, wherein the second coefficient of thermal expansion is in a range between 0.7-10 parts per million (PPM)/degrees Celsius (° C.). ### Claim 4 (depends on 1) The antenna of claim 1, wherein a material of the first dielectric substrate is either polytetrafluoroethylene (PTFE) or a PTFE composite material comprising fiberglass cloth, and wherein the second dielectric constant is in a range between 2-2.5. ### Claim 5 (depends on 1) The antenna of claim 1, wherein a material of the second dielectric substrate is either a bismaleimide triazine (BT) resin substrate material or a glass epoxy multilayer material with a high glass transition temperature (Tg). ### Claim 6 (depends on 1) The antenna of claim 1, further comprising an adhesive layer or a layer of the organic resin substrate configured to fill a space between the surface radiating patches and the inner radiating patches. ### Claim 7 (depends on 1) The antenna of claim 1, further comprising a layer of the organic resin substrate configured to: fill a space between the inner radiating patches and the second dielectric substrate; and carry a second part of the antenna feeders. ### Claim 8 (depends on 7) The antenna of claim 7, further comprising: a plurality of shield layers; and a plurality of ground layers, wherein the organic resin substrate is further configured to carry each of the shield layers and each of the ground layers that are alternately disposed. ### Claim 9 (depends on 1) The antenna of claim 1, further comprising a layer of the organic resin substrate disposed outside the second dielectric substrate and configured to carry a second part of the antenna feeders. ### Claim 10 (depends on 1) The antenna of claim 1, wherein the surface radiating patches are arranged in a first N×N array on the first dielectric substrate, wherein the inner radiating patches are distributed in a second N×N array on the second dielectric substrate, wherein N is a positive integer greater than 1, and wherein the surface radiating patches and the inner radiating patches overlap in a direction perpendicular to the first dielectric substrate. ### Claim 11 A communications apparatus comprising: a transceiver comprising a receiver and a transmitter; and an antenna coupled to the receiver and the transmitter, wherein the antenna comprises: a plurality of surface radiating patches; a plurality of inner radiating patches; a plurality of antenna feeders coupled to the inner radiating patches; an organic resin substrate comprising a first dielectric constant or a first dielectric loss, and a first coefficient of thermal expansion; a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, wherein a second dielectric constant or a second dielectric loss of the first dielectric substrate is lower than the second dielectric constant or the second dielectric loss; and a second dielectric substrate disposed below the inner radiating patches and configured to carry a first part of the antenna feeders, wherein a second coefficient of thermal expansion of the second dielectric substrate is lower than the first coefficient of thermal expansion. ### Claim 12 (depends on 11) The communications apparatus of claim 11, wherein the second dielectric constant is lower than 3.6. ### Claim 13 (depends on 11) The communications apparatus of claim 11, wherein the second coefficient of thermal expansion is in a range between 0.7-10 parts per million (PPM)/degrees Celsius (° C.). ### Claim 14 (depends on 11) The communications apparatus of claim 11, wherein a material of the first dielectric substrate is either polytetrafluoroethylene (PTFE) or a PTFE composite material comprising fiberglass cloth, and wherein the first dielectric constant is in a range between 2-2.5. ### Claim 15 (depends on 11) The communications apparatus of claim 11, wherein a material of the second dielectric substrate is either a bismaleimide triazine (BT) resin substrate material or a glass epoxy multilayer material with a high glass transition temperature (Tg). ### Claim 16 (depends on 11) The communications apparatus of claim 11, further comprising an adhesive layer or a layer of the organic resin substrate configured to fill a space between the surface radiating patches and the inner radiating patches. ### Claim 17 (depends on 11) The communications apparatus of claim 11, further comprising a layer of the organic resin substrate configured to: fill a space between the inner radiating patches and the second dielectric substrate; and carry a second part of the antenna feeders. ### Claim 18 (depends on 17) The communications apparatus of claim 17, further comprising: a plurality of shield layers; and a plurality of ground layers, wherein the organic resin substrate is further configured to carry each of the shield layers and each of the ground layers that are alternately disposed. ### Claim 19 (depends on 11) The communications apparatus of claim 11, further comprising a layer of the organic resin substrate disposed outside the second dielectric substrate and configured to carry a second part of the antenna feeders. ### Claim 20 (depends on 11) The communications apparatus of claim 11, wherein the surface radiating patches are arranged in a first N×N array on the first dielectric substrate, wherein the inner radiating patches are distributed in a second N×N array on the second dielectric substrate, wherein N is a positive integer greater than 1, and wherein the surface radiating patches and the inner radiating patches overlap in a direction perpendicular to the first dielectric substrate.