# US 11,309,626 B2 · Wireless communication device

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- Number: US 11,309,626 B2
- Document ID: US11309626B2
- Status: Granted
- Kind: B2
- Application number: 17/016,377
- Filed: 2020-09-10
- Published: 2021-12-23
- Granted: 2022-04-19
- Earliest claimed: 2020-06-17
- Assignees: Azurewave Technologies, Inc.
- Applicants: Azurewave Technologies, Inc.
- Inventors: Chih-Hao Liao; Hsin-Yeh Huang; Shu-Han Wu
- Web page: https://patentgrep.com/patent/US11309626B2

## CPC

- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H01Q 1/002: {Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna}
- H01Q 1/02: Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion}
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)}
- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 1/0269: {for visual or optical inspection}
- H05K 9/0026: {integrally formed from metal sheet}
- H05K 9/0084: {comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition}
- H05K 1/0243: {Printed circuits associated with mounted high frequency components}
- H05K 2201/0715: provided by an outer layer of PCB
- H05K 2201/09872: Insulating conformal coating
- H05K 2201/09936: Marks, inscriptions, etc. for information
- H05K 2203/1366: Spraying coating
- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- H10W 46/103: {alphanumeric information, e.g. words, letters or serial numbers}
- H10W 46/401: {for identification or tracking}
- H10W 46/607: {Located on parts of packages, e.g. on encapsulations or on package substrates}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 μm. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.

## Claims

### Claim 1

A wireless communication device, comprising:
a communication module including:
a circuit board having a carrying surface and a back surface that is opposite to the carrying surface, wherein the circuit board includes a grounding portion;
a communication chip mounted on the carrying surface of the circuit board;
a plurality of passive components mounted on the carrying surface of the circuit board; and
an insulating sheet disposed on the passive components and having a thickness that is greater than or equal to 150 μm, wherein the passive components are arranged in a projection space defined by orthogonally projecting the insulating sheet toward the carrying surface;
a dust and moisture resistant adhesive covering and connected to any electrically conductive portions of the communication module on the carrying surface; and
a nano-metallic layer covering and connected to the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, wherein the nano-metallic layer is electrically coupled to the grounding portion,
wherein the wireless communication device does not include any grounding metal housing that is mounted on the circuit board and that is arranged outside of the nano-metallic layer.

### Claim 2 (depends on 1)

The wireless communication device according to claim 1, wherein the insulating sheet has a tracking surface that is arranged away from the circuit board and that is covered by the nano-metallic layer, and the tracking surface is configured to show information related to the passive components.

### Claim 3 (depends on 2)

The wireless communication device according to claim 2, wherein the insulating sheet has at least one identification slot recessed in the tracking surface, inner surfaces of the at least one identification slot are covered by the nano-metallic layer, and the at least one identification slot is configured to show the information related to the passive components.

### Claim 4 (depends on 1)

The wireless communication device according to claim 1, wherein the thickness of the insulating sheet is within a range of 200-300 μm, and the insulating sheet is a glass fiber insulating sheet, a bakelite insulating sheet, or a ceramic insulating sheet.

### Claim 5 (depends on 1)

The wireless communication device according to claim 1, wherein a height of the insulating sheet with respect to the carrying surface is smaller than or equal to a height of the communication chip with respect to the carrying surface.

### Claim 6 (depends on 1)

The wireless communication device according to claim 1, wherein a thickness of the nano-metallic layer is within a range of 3-5 μm, and the dust and moisture resistant adhesive and a side portion of the communication module opposite to the back surface are entirely covered by the nano-metallic layer, so that the dust and moisture resistant adhesive and the side portion of the communication module are completely isolated from an external environment through the nano-metallic layer.

### Claim 7 (depends on 1)

The wireless communication device according to claim 1, wherein the circuit board has a surrounding lateral surface connected to the carrying surface and the back surface, the grounding portion is a grounding layer embedded in the circuit board, and an end of the grounding layer is arranged on the surrounding lateral surface, and wherein the nano-metallic layer is a nano-silver layer that is connected to the grounding layer by covering the surrounding lateral surface.

### Claim 8

A wireless communication device, comprising:
a communication module including:
a circuit board having a carrying surface and a back surface that is opposite to the carrying surface, wherein the circuit board includes a grounding portion;
a communication chip mounted on the carrying surface of the circuit board;
a plurality of passive components mounted on the carrying surface of the circuit board; and
an insulating sheet disposed on the communication chip and the passive components and having a thickness that is greater than or equal to 150 μm, wherein the communication chip and the passive components are arranged in a projection space defined by orthogonally projecting the insulating sheet toward the carrying surface;
a dust and moisture resistant adhesive covering and connected to any electrically conductive portions of the communication module on the carrying surface; and
a nano-metallic layer covering and connected to the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, wherein the nano-metallic layer is electrically coupled to the grounding portion,
wherein the wireless communication device does not include any grounding metal housing that is mounted on the circuit board and that is arranged outside of the nano-metallic layer.

### Claim 9 (depends on 8)

The wireless communication device according to claim 8, wherein a thickness of the nano-metallic layer is within a range of 3-5 μm, and the dust and moisture resistant adhesive and a side portion of the communication module opposite to the back surface are entirely covered by the nano-metallic layer, so that the dust and moisture resistant adhesive and the side portion of the communication module are completely isolated from an external environment through the nano-metallic layer.

### Claim 10 (depends on 9)

The wireless communication device according to claim 9, wherein a projection region defined by orthogonally projecting the insulating sheet onto the carrying surface is at least 70% of an area of the carrying surface.