# US 11,309,621 B2 · Antenna module and electronic device including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,621 B2 - Document ID: US11309621B2 - Status: Granted - Kind: B2 - Application number: 16/844,706 - Filed: 2020-04-09 - Published: 2020-10-15 - Granted: 2022-04-19 - Earliest claimed: 2019-04-12 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Kwanghyun Baek; Dohyuk Ha; Youngju Lee; Jungyub Lee; Juneseok Lee; Jinsu Heo - Web page: https://patentgrep.com/patent/US11309621B2 ## CPC - H01Q 1/24: with receiving set - H01Q 21/0025: {Modular arrays} - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 1/526: {Electromagnetic shields} - H01Q 9/0414: {in a stacked or folded configuration} - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 1/181: associated with surface mounted components - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2201/10371: Shields or metal cases - H05K 2201/10734: Ball grid array [BGA]; Bump grid array - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a first printed circuit board (PCB) stacked at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked at least one layer. The antenna module further includes a wireless communication chip disposed on an upper surface of the second PCB and controlling an electrical signal for a radio frequency, a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feed line electrically connecting the first antenna and the wireless communication chip. ## Claims ### Claim 1 An antenna module comprising: a first printed circuit board (PCB) stacked at least one layer; a second PCB disposed on an upper surface of the first PCB and stacked at least one layer; a wireless communication chip disposed on an upper surface of the second PCB and configured to control an electrical signal for a radio frequency; a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB; a first antenna disposed on an inner surface of the first structure to face the first PCB; and a feed line electrically connecting the first antenna and the wireless communication chip. ### Claim 2 (depends on 1) The antenna module of claim 1, further comprising: a second antenna disposed on an outer surface of the first structure, wherein the second antenna is disposed on a surface opposite to the inner surface of the first structure where the first antenna is disposed. ### Claim 3 (depends on 2) The antenna module of claim 2, wherein the first antenna is spaced apart from the second antenna at an interval determined by the first structure. ### Claim 4 (depends on 1) The antenna module of claim 1, wherein: the first PCB and the second PCB are combined through a ball grid array (BGA), and the first PCB transmits a frequency signal for generating power or a radio frequency to the wireless communication chip through the second PCB. ### Claim 5 (depends on 1) The antenna module of claim 1, further comprising: a second structure disposed on the upper surface of the first PCB and surrounding the wireless communication chip and the second PCB, wherein the second structure is formed of or contains a metallic material for blocking electromagnetic waves. ### Claim 6 (depends on 5) The antenna module of claim 5, wherein: the second structure is connected to the upper surface of the first PCB through a connector, and the second structure operates as a ground layer for the first antenna. ### Claim 7 (depends on 5) The antenna module of claim 5, further comprising: a thermal interface material (TIM) disposed on the inner surface of the second structure facing the wireless communication chip and coupled with the wireless communication chip. ### Claim 8 An antenna module comprising: a first printed circuit board (PCB) stacked at least one layer; a second PCB disposed above an upper surface of the first PCB and stacked at least one layer; a wireless communication chip disposed above an upper surface of the second PCB and configured to control an electrical signal for a radio frequency; a first structure disposed above the upper surface of the first PCB and surrounding the upper surface of the first PCB; a first antenna disposed on an inner surface of the first structure to face the first PCB; a second antenna disposed on the inner surface of the first structure to face the first PCB; a third antenna disposed on the inner surface of the first structure to face the first PCB; a fourth antenna disposed on the inner surface of the first structure to face the first PCB; a first feed line electrically connecting the first antenna and the wireless communication chip; a second feed line electrically connecting the second antenna and the wireless communication chip; a third feed line electrically connecting the third antenna and the wireless communication chip; and a fourth feed line electrically connecting the fourth antenna and the wireless communication chip. ### Claim 9 (depends on 8) The antenna module of claim 8, further comprising: a fifth antenna disposed on an outer surface of the first structure opposite to the inner surface of the first structure where the first antenna is disposed; a sixth antenna disposed on the outer surface of the first structure opposite to the inner surface of the first structure where the second antenna is disposed; a seventh antenna disposed on the outer surface of the first structure opposite to the inner surface of the first structure where the third antenna is disposed; and an eighth antenna disposed on the outer surface of the first structure opposite to the inner surface of the first structure where the fourth antenna is disposed. ### Claim 10 (depends on 8) The antenna module of claim 8, wherein: the first PCB and the second PCB are combined through a ball grid array (BGA), and the first PCB transmits a frequency signal for generating power or a radio frequency to the wireless communication chip through the second PCB. ### Claim 11 (depends on 8) The antenna module of claim 8, further comprising: a second structure disposed on the upper surface of the first PCB and surrounding the wireless communication chip and the second PCB, wherein the second structure is formed of or contains a metallic material for blocking electromagnetic waves. ### Claim 12 (depends on 11) The antenna module of claim 11, wherein: the second structure is connected to the upper surface of the first PCB through a connector, and the second structure operates as a ground layer for the first antenna, the second antenna, the third antenna, and the fourth antenna. ### Claim 13 (depends on 11) The antenna module of claim 11, further comprising: a thermal interface material (TIM) disposed on the inner surface of the second structure facing the wireless communication chip and coupled with the wireless communication chip. ### Claim 14 An electronic device comprising: an antenna module including: a first printed circuit board (PCB) stacked at least one layer; a second PCB disposed on an upper surface of the first PCB and stacked at least one layer; a wireless communication chip disposed on an upper surface of the second PCB and configured to control an electrical signal for a radio frequency; a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB; a first antenna disposed on an inner surface of the first structure to face the first PCB; and a feed line electrically connecting the first antenna and the wireless communication chip. ### Claim 15 (depends on 14) The electronic device of claim 14, wherein: the antenna module further includes a second antenna disposed on an outer surface of the first structure, and the second antenna is disposed on a surface opposite to the inner surface of the first structure where the first antenna is disposed. ### Claim 16 (depends on 15) The electronic device of claim 15, wherein the first antenna is spaced apart from the second antenna at an interval determined by the first structure. ### Claim 17 (depends on 14) The electronic device of claim 14, wherein: the first PCB and the second PCB are combined with each other through a ball grid array (BGA), and the first PCB transmits a frequency signal for generating power or a radio frequency to the wireless communication chip through the second PCB. ### Claim 18 (depends on 14) The electronic device of claim 14, wherein: the antenna module further includes a second structure disposed on the upper surface of the first PCB and surrounding the wireless communication chip and the second PCB, and the second structure is formed of or contains a metallic material for blocking electromagnetic waves. ### Claim 19 (depends on 18) The electronic device of claim 18, wherein: the second structure is connected to the upper surface of the first PCB through a connector, and the second structure operates as a ground layer for the first antenna. ### Claim 20 (depends on 18) The electronic device of claim 18, wherein the antenna module further includes a thermal interface material (TIM) disposed on the inner surface of the second structure facing the wireless communication chip and coupled with the wireless communication chip.