# US 11,309,518 B2 · Mask and encapsulating method of display panel

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- Number: US 11,309,518 B2
- Document ID: US11309518B2
- Status: Granted
- Kind: B2
- Application number: 16/463,572
- Filed: 2019-01-22
- Published: 2021-11-18
- Granted: 2022-04-19
- Earliest claimed: 2018-10-26
- Applicants: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Inventors: Xiao Du
- Web page: https://patentgrep.com/patent/US11309518B2

## CPC

- C23C 14/042: {using masks}
- C23C 14/24: Vacuum evaporation
- H10K 59/8731: {multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers}
- H10K 77/111: {Flexible substrates}
- H10K 71/166: {using selective deposition, e.g. using a mask}
- H10K 2102/311: {Flexible OLED}
- Y02E 10/549: Organic PV cells
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A mask and an encapsulating method of a display panel are provided. The mask is configured to encapsulating the display substrate. The display substrate includes a display area, a bonding area, and a notch. The mask includes an opening area and a non-opening area. A size of the mask is determined by a size of the used display substrate. A corresponding size of the display substrate adapts the mask having the corresponding size. The present disclosure can effectively prevent line damage and also improve substrate yield.

## Claims

### Claim 1

An encapsulating method of a display panel, comprising:
in a substrate evaporation coating step S1, coating by evaporation a display substrate;
in a first mask installation step S2, aligning a first mask with the display substrate and attaching the first mask onto the display substrate, wherein the first mask comprises an opening area and a non-opening area, wherein the opening area comprises a first short border and a second short border arranged opposite each other, and wherein the non-opening area comprises a first shield plate protruding from a central section of the first short border of the opening area; and a second shield plate protruding from a central section of the second short border of the opening area;
in a first inorganic encapsulation layer formation step S3, forming a first inorganic encapsulation layer on the display substrate through the opening area of the first mask;
in a first mask removal step S4, removing the first mask;
in an organic encapsulation layer formation step S5, spraying an organic material on the display substrate, wherein the organic material is cured under ultraviolet irradiation to form an organic encapsulation layer;
in a second mask installation step S6, aligning a second mask with the display substrate and attaching the second mask onto the display substrate, wherein the second mask comprises another opening area and another non-opening area, wherein the opening area comprises another first short border and another second short border arranged opposite each other, and wherein the non-opening area comprises: another first shield plate protruding from a central section of the first short border of the opening area; and another second shield plate protruding from a connecting section of the second short border and one of long borders of the opening area;
in a second inorganic encapsulation layer formation step S7, forming a second inorganic encapsulation layer on the display substrate through the opening area of the second mask;
in a second mask removal step S8, removing the second mask.

### Claim 2 (depends on 1)

The encapsulating method of a display panel as claimed in claim 1, wherein the display substrate comprises:
a display area comprising two long sides, a first short side, and a second short side, wherein the two long sides are arranged opposite each other, and the first short side and the second short side are arranged opposite each other;
a bonding area disposed on a central section of the first short side; and
a notch disposed on a central section of the second short side or on a connecting section of the second short side and one of the long sides.

### Claim 3 (depends on 2)

The encapsulating method of a display panel as claimed in claim 2, in the first mask installation step or the second mask installation step, further comprising:
arranging the opening area of a corresponding mask being opposite to the display area of the display substrate;
arranging the first shield plate of the corresponding mask being opposite to the bonding area of the display substrate; and
arranging the second shield plate of the corresponding mask being opposite to the notch of the display substrate.

### Claim 4 (depends on 2)

The encapsulating method of a display panel as claimed in claim 2, wherein in the first inorganic encapsulation layer formation step, an upper surface of the display area is completely covered by the first inorganic encapsulation layer;
in the organic encapsulation layer formation step, a portion of an upper surface of the first inorganic encapsulation layer other than an edge area is covered by the organic encapsulation layer; and
in the second inorganic encapsulation layer formation step, the organic encapsulation layer and an upper surface of the edge area and a lateral surface of the first inorganic encapsulation layer are completely covered by the second inorganic encapsulation layer.