# US 11,309,516 B2 · Display panel packaging method and packaging structure each having laminated structure of water-blocking layer and light-absorbing adhesive layer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,516 B2 - Document ID: US11309516B2 - Status: Granted - Kind: B2 - Application number: 16/623,414 - Filed: 2019-11-08 - Published: 2021-12-30 - Granted: 2022-04-19 - Earliest claimed: 2019-10-28 - Applicants: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Inventors: Yang Miao; Jinchuan Li - Web page: https://patentgrep.com/patent/US11309516B2 ## CPC - H10K 71/50: Forming devices by joining two substrates together, e.g. lamination techniques - H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 59/873: {Encapsulations} - H10K 59/8792: {comprising light absorbing layers, e.g. black layers} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract The present invention provides a display panel packaging method and a packaging structure. The display panel packaging method includes: providing a first substrate and forming a water-blocking layer, dispensing a sealant on a second substrate, coating a polymeric adhesive material in a region surrounded by the sealant, coating a light-absorbing material on the polymeric adhesive material, bonding the two substrates and uniformly mixing the polymeric adhesive material and the light-absorbing material to form a uniformly mixed film, and curing them and finishing packaging. This display panel packaging is effective. ## Claims ### Claim 1 A packaging structure, comprising: a first substrate; a second substrate disposed opposite to the first substrate, the second substrate comprising a display region and a packaging region, and the packaging region disposed around the display region; a sealant disposed in the packaging region on the second substrate and disposed around the display region; and a polymer layer disposed in the display region on the second substrate, wherein the polymer layer is a transparent layer and is a laminated structure comprising a water-blocking layer and a light-absorbing adhesive layer disposed sequentially, and the light-absorbing adhesive layer comprises polymer nanofibers and an ultraviolet light absorber mixed uniformly. ### Claim 2 (depends on 1) The packaging structure according to claim 1, wherein the sealant comprises a first sealant and a second sealant disposed around the first sealant, and the second sealant comprises a water-absorbing sealant. ### Claim 3 A display panel packaging method, comprising steps of: S100: providing a first substrate and forming a water-blocking layer on the first substrate; S110: providing a second substrate and dispensing at least one turn of a first sealant on the second substrate; S120: dispensing at least one turn of a second sealant on the second substrate along an inner region of the first sealant and coating a polymeric adhesive material on the second substrate in a region surrounded by the second sealant, wherein the polymeric adhesive material is coated by an inkjet printing process, and the polymeric adhesive material comprises polyacrylate or polymethacrylate; S130: coating a light-absorbing material on the polymeric adhesive material; and S140: bonding the first substrate and the second substrate, uniformly mixing the polymeric adhesive material and the light-absorbing material, curing the first sealant, the second sealant, and the polymeric adhesive material, and finishing packaging. ### Claim 4 (depends on 3) The display panel packaging method according to claim 3, wherein in the step S130, the light-absorbing material comprises polymer nanofibers, and the polymer nanofibers are selected from the group consisting of TiO2, ZnO, and talcum. ### Claim 5 (depends on 4) The display panel packaging method according to claim 4, wherein the light-absorbing material is disposed on the polymeric adhesive material by an electrospinning process or an electrostatic spraying process. ### Claim 6 (depends on 3) The display panel packaging method according to claim 3, wherein a material of the water-blocking layer comprises SiNx, SiON, or SiOx. ### Claim 7 (depends on 3) The display panel packaging method according to claim 3, wherein a forming process of the water-blocking layer comprises a chemical vapor deposition process or an atomic layer deposition process. ### Claim 8 (depends on 3) The display panel packaging method according to claim 3, wherein in the step S100, an organic light-emitting diode (OLED) device layer is disposed on the first substrate, the water-blocking layer is formed on the OLED device layer, and the water-blocking layer covers the OLED device layer. ### Claim 9 (depends on 3) The display panel packaging method according to claim 3, wherein in the step S140, the first substrate is bonded to the second substrate, and the water-blocking layer, the polymeric adhesive material, and the light-absorbing material are formed into a uniformly mixed film and cured by ultraviolet irradiation or heating. ### Claim 10 A display panel packaging method, comprising steps of: S100: providing a first substrate and forming a water-blocking layer on the first substrate; S110: providing a second substrate and dispensing at least one turn of a first sealant on the second substrate; S120: dispensing at least one turn of a second sealant on the second substrate along an inner region of the first sealant and coating a polymeric adhesive material on the second substrate in a region surrounded by the second sealant; S130: coating a light-absorbing material on the polymeric adhesive material; and S140: bonding the first substrate and the second substrate, uniformly mixing the polymeric adhesive material and the light-absorbing material, curing the first sealant, the second sealant, and the polymeric adhesive material, and finishing packaging. ### Claim 11 (depends on 10) The display panel packaging method according to claim 10, wherein in the step S120, the polymeric adhesive material is coated by an inkjet printing process. ### Claim 12 (depends on 10) The display panel packaging method according to claim 10, wherein in the step S130, the light-absorbing material comprises polymer nanofibers, and the polymer nanofibers are selected from the group consisting of TiO2, ZnO, and talcum. ### Claim 13 (depends on 12) The display panel packaging method according to claim 12, wherein the light-absorbing material is disposed on the polymeric adhesive material by an electrospinning process or an electrostatic spraying process. ### Claim 14 (depends on 10) The display panel packaging method according to claim 10, wherein in the step S100, an organic light-emitting diode (OLED) device layer is disposed on the first substrate, the water-blocking layer is formed on the OLED device layer, and the water-blocking layer covers the OLED device layer. ### Claim 15 (depends on 10) The display panel packaging method according to claim 10, wherein in the step S140, the first substrate is bonded to the second substrate, and the water-blocking layer, the polymeric adhesive material, and the light-absorbing material are formed into a uniformly mixed film and cured by ultraviolet irradiation or heating. ### Claim 16 (depends on 10) The display panel packaging method according to claim 10, wherein a forming process of the water-blocking layer comprises a chemical vapor deposition process or an atomic layer deposition process. ### Claim 17 (depends on 10) The display panel packaging method according to claim 10, wherein a material of the water-blocking layer comprises SiNx, SiON, or SiOx.