# US 11,309,480 B2 · Ultra-thin film superconducting tapes

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- Number: US 11,309,480 B2
- Document ID: US11309480B2
- Status: Granted
- Kind: B2
- Application number: 15/573,632
- Filed: 2016-05-11
- Published: 2018-05-31
- Granted: 2022-04-19
- Earliest claimed: 2015-05-11
- Assignees: University of Houston System
- Applicants: The University of Houston System
- Inventors: Venkat Selvamanickam
- Web page: https://patentgrep.com/patent/US11309480B2

## CPC

- H10N 60/0801: {Manufacture or treatment of filaments or composite wires}
- H10N 60/0632: {Intermediate layers, e.g. for growth control}
- H10N 60/0661: {Processes performed after copper oxide formation, e.g. patterning}
- H10N 60/203: {comprising high-Tc ceramic materials}
- H10N 60/857: {comprising copper oxide}
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

## Abstract

An ultra-thin film superconducting tape and method for fabricating same is disclosed. Embodiments are directed to a superconducting tape being fabricated by processes which include removing a portion of the superconducting tape's substrate subsequent the substrate's initial formation, whereby a thickness of the superconducting tape is reduced to 15-80 μm.

## Claims

### Claim 1

A superconductor tape comprising:
a substrate;
a buffer layer overlying the substrate;
a superconductor layer overlying the buffer layer; and
an overlayer overlying the superconductor layer;
wherein the superconductor tape has a thickness in a range of 15—23 μm and an engineering current density of above 800 A/mm2 at 77 K, 0 T.

### Claim 2 (depends on 1)

The superconductor tape of claim 1, wherein the buffer layer has a thickness in a range of 0.1 to 2 μm, the superconductor layer has a thickness in a range of 0.5 to 5 μm, and the overlayer has a thickness in a range of 0.2 to 4 μm.

### Claim 3 (depends on 1)

The superconductor tape of claim 1, wherein the overlayer comprises silver (Ag) or gold (Au).

### Claim 4 (depends on 1)

The superconductor tape of claim 1, wherein the superconductor layer comprises a material selected from the group consisting of REBa2Cu3O7-x, where RE is one of more elements selected from the group consisting of Y, Gd, Sm, Nd, Eu, Dy, Ho, Yb, Er, Tm, and Lu, and wherein 0≤x≤1.

### Claim 5 (depends on 1)

The superconductor tape of claim 1, wherein the buffer layer comprises a material selected from the group consisting of MgO, LaMnO3, CeO2, Gd2Zr2O7, YSZ, SrTiO3, and combinations thereof.

### Claim 6 (depends on 1)

The superconductor tape of claim 1, wherein the substrate comprises a metal selected from the group consisting of Hastelloy, Stainless Steel, Ni-W, Inconel, metallic glasses, and combinations thereof.

### Claim 7 (depends on 1)

The superconductor tape of claim 1, further comprising a conductive layer overlying the overlayer.

### Claim 8 (depends on 7)

The superconductor tape of claim 7, wherein the conductive layer comprises copper (Cu) or at least one Cu alloy or a conductive metal alloy.

### Claim 9 (depends on 7)

The superconductor tape of claim 7, further comprising a second overlayer and a second conductive layer, wherein the substrate is positioned between the buffer layer and the second overlayer, and the second overlayer is positioned between the substrate and the second conductive layer.

### Claim 10

A superconductor tape comprising:
a substrate;
a buffer layer overlying the substrate;
a superconductor layer overlying the buffer layer; and
an overlayer overlying the superconductor layer;
wherein the substrate has a thickness in a range of 10—22 μm and the superconductor tape has an engineering current density of above 800 A/mm2 at 77 K, 0 T.

### Claim 11 (depends on 10)

The superconductor tape of claim 10, wherein the buffer layer has a thickness in a range of 0.1 to 2 μm, the superconductor layer has a thickness in a range of 0.5 to 5 μm, and the overlayer has a thickness in a range of 0.2 to 4 μm.

### Claim 12 (depends on 10)

The superconductor tape of claim 10, wherein the overlayer comprises silver (Ag) or gold (Au).

### Claim 13 (depends on 10)

The superconductor tape of claim 10, wherein the superconductor layer comprises a material selected from the group consisting of REBa2Cu3O7-x, where RE is one of more elements selected from the group consisting of Y, Gd, Sm, Nd, Eu, Dy, Ho, Yb, Er, Tm, and Lu, and wherein 0≤x≤1.

### Claim 14 (depends on 10)

The superconductor tape of claim 10, wherein the buffer layer comprises a material selected from the group consisting of MgO, LaMnO3, CeO2, Gd2Zr2O7, YSZ, SrTiO3, and combinations thereof.

### Claim 15 (depends on 10)

The superconductor tape of claim 10, wherein the substrate comprises a metal selected from the group consisting of Hastelloy, Stainless Steel, Ni-W, Inconel, metallic glasses, and combinations thereof.

### Claim 16 (depends on 10)

The superconductor tape of claim 10, further comprising a conductive layer overlying the overlayer.

### Claim 17 (depends on 16)

The superconductor tape of claim 16, wherein the conductive layer comprises copper (Cu) or at least one Cu alloy or a conductive metal alloy.

### Claim 18 (depends on 16)

The superconductor tape of claim 16, further comprising a second overlayer and a second conductive layer, wherein the substrate is positioned between the buffer layer and the second overlayer, and the second overlayer is positioned between the substrate and the second conductive layer.