# US 11,309,472 B2 · Manufacturing method for LED substrate and LED substrate

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- Number: US 11,309,472 B2
- Document ID: US11309472B2
- Status: Granted
- Kind: B2
- Application number: 16/926,632
- Filed: 2020-07-10
- Published: 2021-12-02
- Granted: 2022-04-19
- Earliest claimed: 2020-05-27
- Assignees: Shenzhen Sangshen E-Commerce Co., Ltd.
- Applicants: Shenzhen Sangshen E-Commerce Co., Ltd.
- Inventors: Chenghao Li
- Web page: https://patentgrep.com/patent/US11309472B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8506: {Containers}
- H10H 20/036: {of packages}
- H10H 20/0364: {of interconnections}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

The present disclosure provides a manufacturing method for an LED substrate and the LED substrate, the manufacturing method for the LED substrate includes following steps: S1: preparing a carrier substrate, disposing riveting points on preset positions of the carrier substrate; S2: sintering conductive lines on the carrier substrate, and covering an outer periphery of each riveting point with connecting ends of the conductive lines; and S3: riveting terminal pins to the riveting points, combining the terminal pins with the carrier substrate, and forming a conductive connection between the terminal pins and the connecting ends of the conductive lines. Compared with a traditional manufacturing method of the LED substrate, in a manufacturing process, steps of silver paste spot coating, silver paste high-temperature sintering and the like are reduced.

## Claims

### Claim 1

A manufacturing method for an LED substrate, comprising:
S1: preparing a carrier substrate, and disposing riveting points on preset positions of the carrier substrate;
S2: sintering conductive lines on the carrier substrate, covering an outer periphery of each riveting point with connecting ends of the conductive lines; and
S3: riveting terminal pins to the riveting points, and combining the terminal pins with the carrier substrate, and forming a conductive connection between the terminal pins and the connecting ends of the conductive lines.

### Claim 2 (depends on 1)

The manufacturing method for the LED substrate according to claim 1, wherein the riveting points are disposed on hollow-out holes of the carrier substrate.

### Claim 3 (depends on 2)

The manufacturing method for the LED substrate according to claim 2, wherein in the S3, terminal foot claws are correspondingly disposed on a riveting end of each terminal pin, the terminal pins are riveted to a back surface of the carrier substrate by the terminal foot claws and the hollow-out holes to combine with the carrier substrate.

### Claim 4 (depends on 2)

The manufacturing method for the LED substrate according to claim 2, wherein in the S1, the preset positions comprise a positive preset position of an LED and a negative preset position of the LED; the hollow-out holes are respectively formed on the carrier substrate corresponding to the positive preset position and the negative preset position;
in the S3, the terminal pins comprise a positive terminal pin and a negative terminal pin, the positive terminal pin and the negative terminal pin are correspondingly riveted to the hollow-out hole in the positive preset position and the hollow-out hole in the negative preset position to form a positive electrode and a negative electrode.

### Claim 5 (depends on 3)

The manufacturing method for the LED substrate according to claim 3, wherein the terminal foot claws are uniformly distributed; when the terminal foot claws are riveted to the back surface of the carrier substrate, the terminal foot claws present a radial structure.

### Claim 6

An LED substrate, comprising a carrier substrate and terminal pins; wherein riveting points are disposed on preset positions of the carrier substrate; conductive lines are sintered on the carrier substrate, and an outer periphery of each riveting point is covered with connecting ends of the conductive lines; the terminal pins are riveted to the riveting points, then the terminal pins are combined with the carrier substrate, and a conductive connection is formed between the terminal pins and the connecting ends of the conductive lines.

### Claim 7 (depends on 6)

The LED substrate according to claim 6, wherein the riveting points are disposed on hollow-out holes of the carrier substrate.

### Claim 8 (depends on 7)

The LED substrate according to claim 7, wherein terminal foot claws are correspondingly disposed on a riveting end of each terminal pin, the terminal pins are riveted to a back surface of the carrier substrate by the terminal foot claws and the hollow-out holes to combine with the carrier substrate.

### Claim 9 (depends on 7)

The LED substrate according to claim 7, wherein the preset positions comprise a positive preset position of an LED and a negative preset position of the LED; the hollow-out holes are respectively formed on the carrier substrate corresponding to the positive preset position and the negative preset position; the terminal pins comprise a positive terminal pin and a negative terminal pin, the positive terminal pin and the negative terminal pin are correspondingly riveted to the hollow-out hole in the positive preset position and the hollow-out hole in the negative preset position to form a positive electrode and a negative electrode.

### Claim 10 (depends on 8)

The LED substrate according to claim 8, wherein the terminal foot claws are uniformly distributed; when the terminal foot claws are riveted to the back surface of the carrier substrate, the terminal foot claws present a radial structure.