# US 11,309,471 B2 · Flip-chip light-emitting module

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- Number: US 11,309,471 B2
- Document ID: US11309471B2
- Status: Granted
- Kind: B2
- Application number: 16/835,624
- Filed: 2020-03-31
- Published: 2020-07-16
- Granted: 2022-04-19
- Earliest claimed: 2018-06-06
- Assignees: Azurewave Technologies, Inc.
- Applicants: Azurewave Technologies, Inc.
- Inventors: Kung-An Lin; Chung-Che Yang; Hung-Wei Lin; Hsiang-Yun Cheng
- Web page: https://patentgrep.com/patent/US11309471B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8506: {Containers}
- H10H 20/858: Means for heat extraction or cooling
- H10H 20/8581: {characterised by their material}
- H10H 20/831: characterised by their shape
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10W 90/00: Package configurations
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.

## Claims

### Claim 1

A flip-chip light-emitting module, comprising:
a thermal dissipation substrate including two separated plates, wherein a thermal dissipation channel is formed between the two separated plates;
two conductive adhesive layers respectively disposed on the two separated plates;
a package assembly including a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame, the frame including a conductive path; and
a light-emitting chip including a top conductive contact and a light-emitting surface at a same first side, the top conductive contact electrically connected to the conductive path through a conductor, and including two bottom conductive contacts at a second side of the light-emitting chip opposite to the first side respectively contacting the two conductive adhesive layers;
wherein the frame includes a side wall surrounding the thermal dissipation substrate and an extension wall extending from the side wall to the top conductive contact, the conductive path includes an external connective end disposed on the side wall, and an internal connective end disposed on the extension wall and electrically connected to the top conductive contact through the conductor.

### Claim 2 (depends on 1)

The flip-chip light-emitting module according to claim 1, wherein the light-emitting chip includes an optical axis extending outward from the light-emitting surface, the lens unit further includes a support deposited on the frame and a lens, the support and the frame together define an light channel around the optical axis, and the lens is deposed on the support and is in the light channel.

### Claim 3 (depends on 1)

The flip-chip light-emitting module according to claim 1, wherein the two separated plates of the thermal dissipation substrate correspond to the bottom conductive contacts so as to improves a heat-dissipating effect through the thermal dissipation channel between the two separated plates.

### Claim 4 (depends on 1)

The flip-chip light-emitting module according to claim 1, wherein the package assembly includes a filling layer filled between the frame and the thermal dissipation substrate.

### Claim 5 (depends on 1)

The flip-chip light-emitting module according to claim 1, wherein the frame of the package assembly is made of a ceramic material, and the light-emitting chip is selected from the group consisting of light-emitting diodes, resonant-cavity light-emitting diodes, and vertical-cavity surface-emitting laser chips.