# US 11,309,470 B2 · Array substrate and fabrication method thereof

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- Number: US 11,309,470 B2
- Document ID: US11309470B2
- Status: Granted
- Kind: B2
- Application number: 16/617,324
- Filed: 2019-11-11
- Published: 2021-10-28
- Granted: 2022-04-19
- Earliest claimed: 2019-09-20
- Assignees: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicants: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Inventors: Yong Fan
- Web page: https://patentgrep.com/patent/US11309470B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/00: Package configurations
- H10H 20/831: characterised by their shape
- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- H10H 20/0364: {of interconnections}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An array substrate and a method of fabricating the array substrate are disclosed. The array substrate includes a substrate including a plurality of pixel units arranged in an array. Each of the pixel units has a first electrode and a second electrode, and a first gap is provided between the first electrode and the second electrode. A bonding adhesive is disposed at the first gap. A micro light-emitting diode is disposed on the first electrode, the second electrode, and the bonding adhesive to prevent a failure of the micro light-emitting diode and improve product yield.

## Claims

### Claim 1

An array substrate, comprising:
a substrate comprising a plurality of pixel units arranged in an array, wherein each of the pixel units comprises a first electrode and a second electrode, and a first gap is provided between the first electrode and the second electrode;
a bonding adhesive disposed at the first gap; and
a micro light-emitting diode (LED) disposed on the first electrode, the second electrode, and the bonding adhesive and comprising a positive electrode, a negative electrode, and a micro LED body, wherein the positive electrode is disposed on the first electrode and the negative electrode is disposed on the second electrode;
wherein at least a first solder material is further disposed between the positive electrode and the first electrode, and at least a second solder material is further disposed between the negative electrode and the second electrode.

### Claim 2 (depends on 1)

The array substrate of claim 1, wherein a melting temperature of each of the first solder material and the second solder material is greater than a freezing point temperature of the bonding adhesive.

### Claim 3 (depends on 1)

The array substrate of claim 1, wherein the bonding adhesive has a horizontal width equal to that of the first gap.

### Claim 4 (depends on 3)

The array substrate of claim 3, wherein the bonding adhesive has a thickness between 0.5 microns to 5 microns.

### Claim 5 (depends on 4)

The array substrate of claim 4, wherein the bonding adhesive has a freezing point temperature between 100° C. to 250° C.

### Claim 6 (depends on 5)

The array substrate of claim 5, wherein the bonding adhesive is composed of one of epoxy, silica gel, polyurethane, and polyacrylic compound.

### Claim 7 (depends on 1)

The array substrate of claim 1, wherein the array substrate further comprises a data line, a sensing line, a first thin-film transistor, a second thin-film transistor, a third thin-film transistor, and a capacitor.