# US 11,309,469 B2 · Light emitting diode, light emitting diode module, and display device having the light emitting diode module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,469 B2 - Document ID: US11309469B2 - Status: Granted - Kind: B2 - Application number: 16/557,184 - Filed: 2019-08-30 - Published: 2019-12-26 - Granted: 2022-04-19 - Earliest claimed: 2018-05-18 - Assignees: Seoul Semiconductor Co., Ltd. - Applicants: Seoul Semiconductor Co., Ltd. - Inventors: Seung Li Choi; Se Min Bang; Se Won Tae - Web page: https://patentgrep.com/patent/US11309469B2 ## CPC - H01L 33/62 - G02F 1/133603: {with LEDs} - H01L 33/36 - H01L 33/50 - H05K 2201/09472: Recessed pad for surface mounting; Recessed electrode of component - H01L - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion. ## Claims ### Claim 1 A light emitting diode comprising: a lead frame unit; and a light source unit disposed on the lead frame unit, the lead frame unit comprising: a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, the body portion including at least one solder hole recessed from the second surface of the body portion; a first conductive layer disposed on the first surface of the body portion; a second conductive layer disposed on the second surface of the body portion; and a connection portion disposed on a through hole defined through the body portion between the first conductive layer and the second conductive layer, the connection portion comprising: a connection portion conductive layer disposed on a surface of the through hole; a plug disposed on the connection portion conductive layer and filling the through hole; and a cover plate disposed on the through hole to cover the through hole. ### Claim 2 (depends on 1) The light emitting diode of claim 1, wherein the cover plate has a same shape as the connection portion conductive layer on the first surface and the second surface of the body portion. ### Claim 3 (depends on 1) The light emitting diode of claim 1, further comprising a solder insulating layer disposed on the second surface, wherein the solder insulating layer covers at least a portion of the second conductive layer disposed between the solder holes. ### Claim 4 (depends on 1) The light emitting diode of claim 1, wherein the solder hole and the connection portion are spaced apart from each other by at least about 50 μm when viewed from the second surface. ### Claim 5 (depends on 1) The light emitting diode of claim 1, wherein: the light source unit comprises a first light emitting diode chip and a second light emitting diode chip; the first light emitting diode chip and the second light emitting diode chip are spaced apart from each other by a first interval when viewed from a top of the light source unit; at least one of the first light emitting diode chip and the second light emitting diode chip is spaced apart from an edge of the light source unit by a light emitting diode chip margin when viewed from a top of the light source unit; and the first interval is greater than the light emitting diode chip margin. ### Claim 6 (depends on 5) The light emitting diode of claim 5, wherein: the light source unit has a substantially rectangular shape with long sides and short sides when viewed in a top view; the first light emitting diode chip and one short side of the light source unit adjacent to the first light emitting diode chip are spaced apart from each other by a second interval; the second light emitting diode chip and the other short side of the light source unit adjacent to the second light emitting diode chip are spaced apart from each other by a third interval; and the first interval is greater than the second interval and the third interval. ### Claim 7 (depends on 1) The light emitting diode of claim 1, wherein the first conductive layer includes a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion. ### Claim 8 (depends on 7) The light emitting diode of claim 7, wherein the connection portion overlaps with at least a portion of the circular portion in a plan view. ### Claim 9 (depends on 7) The light emitting diode of claim 7, wherein the elongated portion has a width less than a diameter of the circular portion. ### Claim 10 (depends on 1) The light emitting diode of claim 1, wherein the lead frame unit has a third surface connecting the first surface and the second surface, and the solder hole is defined over the second surface and the third surface. ### Claim 11 (depends on 10) The light emitting diode of claim 10, wherein the solder hole has a substantially semi-circular or substantially semi-elliptical shape in the second surface of the body portion, and has a substantially pentagonal shape in the third surface, and at least one internal angle defined by the substantially pentagonal shape is in a range from about 120 degrees to about 170 degrees. ### Claim 12 (depends on 10) The light emitting diode of claim 10, wherein the solder hole has a substantially semi-circular or substantially semi-elliptical shape in the second surface of the body portion, and a radius of the substantially semi-circular or substantially semi-elliptical shape is in a range from about 10% to about 50% of a thickness of the body portion. ### Claim 13 (depends on 1) The light emitting diode of claim 1, wherein the light source unit comprises a first light emitting diode chip and a second light emitting diode chip disposed on the lead frame unit to be substantially parallel to each other. ### Claim 14 (depends on 13) The light emitting diode of claim 13, wherein the first light emitting diode chip and the second light emitting diode chip are configured to emit light having a same wavelength as each other. ### Claim 15 (depends on 13) The light emitting diode of claim 13, wherein the first conductive layer comprises: a first upper electrode electrically connected to the first light emitting diode chip; a second upper electrode electrically connected to the first light emitting diode chip; a third upper electrode electrically connected to the second light emitting diode chip; and a fourth upper electrode electrically connected to the second light emitting diode chip. ### Claim 16 (depends on 13) The light emitting diode of claim 13, wherein the first light emitting diode chip and the second light emitting diode chip overlap at least a portion of the first conductive layer in a plan view. ### Claim 17 (depends on 13) The light emitting diode of claim 13, further comprising a first wavelength converter and a second wavelength converter, wherein: the first light emitting diode chip and the second light emitting diode chip are configured to emit light having a same wavelength as each other; the first wavelength converter is disposed on the first light emitting diode chip to convert a wavelength of light emitted from the first light emitting diode chip to a first wavelength band; and the second wavelength converter is disposed on the second light emitting diode chip to convert a wavelength of light emitted from the second light emitting diode chip to a second wavelength band different from the first wavelength band. ### Claim 18 (depends on 17) The light emitting diode of claim 17, wherein a light transmission portion is disposed on the first wavelength converter and the second wavelength converter, and the first wavelength converter and the second wavelength converter have a thickness smaller than a thickness of the light transmission portion.