# US 11,309,465 B2 · Method of manufacturing light emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,465 B2 - Document ID: US11309465B2 - Status: Granted - Kind: B2 - Application number: 16/693,072 - Filed: 2019-11-22 - Published: 2020-03-19 - Granted: 2022-04-19 - Earliest claimed: 2013-07-19 - Assignees: Nichia Corporation - Applicants: Nichia Corporation - Inventors: Takuya Nakabayashi - Web page: https://patentgrep.com/patent/US11309465B2 ## CPC - H10H 20/856: Reflecting means - H10H 20/83: Electrodes - H10H 20/8506: {Containers} - H10H 20/851: Wavelength conversion means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 72/0198: {batch processes} - H10H 20/036: {of packages} - H10H 20/0363: {of optical field-shaping means} - H10H 20/0364: {of interconnections} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/00: Package configurations - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of manufacturing a light emitting device includes: providing a substrate including a pair of connection terminals, the connection terminals each having a protruding portion at least on a first main surface of the connection terminal; providing a light emitting element on the protruding portion, the light emitting element having a semiconductor laminate and a pair of electrodes on a same surface of the semiconductor laminate; bonding the pair of the electrodes of the light emitting element and the pair of the connection terminals, respectively, by a molten material; and embedding a surface of the protruding portion of the connection terminals, a surface of the molten material, and a space between the substrate and the light emitting element into a light reflecting member. ## Claims ### Claim 1 A method of manufacturing a light emitting device comprising: providing a substrate including a pair of connection terminals, the connection terminals each having a protruding portion at least on a first main surface of the connection terminal; providing a light emitting element on the protruding portion, the light emitting element having a semiconductor laminate and a pair of electrodes on a same surface of the semiconductor laminate; bonding the pair of the electrodes of the light emitting element and the pair of the connection terminals, respectively, by a molten material with the molten material covering a side surface of the protruding portion of each of the connection terminals; and embedding the protruding portion of the connection terminals, the molten material, and a space between the substrate and the light emitting element into a light reflecting member. ### Claim 2 (depends on 1) The method of manufacturing a light emitting device according to claim 1, wherein the embedding of the protruding portion of the connection terminals, the molten material, and the space between the substrate and the light emitting element into the light reflecting member includes covering a side surface of the light emitting element with the light reflecting member while a first main surface of the light emitting element which is at the same side of the first main surface of the substrate is exposed from the light reflecting member. ### Claim 3 (depends on 1) The method of manufacturing the light emitting device according to claim 1, further comprising providing the light emitting element in which the semiconductor laminate is laminated over an element substrate used for growing a semiconductor layer of the semiconductor laminate, and removing the element substrate from the semiconductor laminate. ### Claim 4 (depends on 3) The method of manufacturing the light emitting device according to claim 3, further comprising disposing a light transmissive member on a surface of the semiconductor laminate, from which the element substrate used for growing the semiconductor layer has been removed. ### Claim 5 (depends on 1) The method of manufacturing the light emitting device according to claim 1, wherein the providing of the substrate includes providing the protruding portion to be spaced apart from an edge of the first main surface in each of the connection terminals. ### Claim 6 (depends on 1) The method of manufacturing the light emitting device according to claim 1, wherein the providing of the substrate includes providing the substrate that defines a through hole. ### Claim 7 (depends on 1) The method of manufacturing the light emitting device according to claim 1, wherein the embedding of the protruding portion of the connection terminals, the molten material, and the space between the substrate and the light emitting element into the light reflecting member further includes covering a side surface of the light emitting element by the light reflecting member. ### Claim 8 (depends on 1) The method of manufacturing the light emitting device according to claim 1, further comprising providing a light transmissive member over the light emitting element after the bonding of the pair of the electrodes of the light emitting element and the pair of the connection terminals. ### Claim 9 (depends on 8) The method of manufacturing the light emitting device according to claim 8, wherein the embedding of the protruding portion of the connection terminals, the molten material, and the space between the substrate and the light emitting element into the light reflecting member further includes covering a side surface of the light emitting element and a side surface of the light transmissive member by the light reflecting member. ### Claim 10 (depends on 8) The method of manufacturing the light emitting device according to claim 8, wherein the providing of the light transmissive member includes forming the light transmissive member by one of forming a sheet of the light transmissive member and attaching the sheet using hot-melt adhesive or an adhesive agent, potting, compression molding, spraying, electrostatic coating and printing. ### Claim 11 (depends on 5) The method of manufacturing a light emitting device according to claim 5, wherein the embedding of the protruding portion of the connection terminals, the molten material, and the space between the substrate and the light emitting element into the light reflecting member includes covering a side surface of the light emitting element with the light reflecting member while a first main surface of the light emitting element which is at the same side of the first main surface of the substrate is exposed from the light reflecting member. ### Claim 12 (depends on 5) The method of manufacturing the light emitting device according to claim 5, further comprising providing the light emitting element in which the semiconductor laminate is laminated over an element substrate used for growing a semiconductor layer of the semiconductor laminate, and removing the element substrate from the semiconductor laminate. ### Claim 13 (depends on 12) The method of manufacturing the light emitting device according to claim 12, further comprising disposing a light transmissive member on a surface of the semiconductor laminate, from which the element substrate used for growing the semiconductor layer has been removed. ### Claim 14 (depends on 5) The method of manufacturing the light emitting device according to claim 5, wherein the providing of the substrate includes providing the substrate that defines a through hole. ### Claim 15 (depends on 5) The method of manufacturing the light emitting device according to claim 5, wherein the embedding of the protruding portion of the connection terminals, the molten material, and the space between the substrate and the light emitting element into the light reflecting member further includes covering a side surface of the light emitting element by the light reflecting member. ### Claim 16 (depends on 5) The method of manufacturing the light emitting device according to claim 5, further comprising providing a light transmissive member over the light emitting element after the bonding of the pair of the electrodes of the light emitting element and the pair of the connection terminals. ### Claim 17 (depends on 16) The method of manufacturing the light emitting device according to claim 16, wherein the embedding of the protruding portion of the connection terminals, the molten material, and the space between the substrate and the light emitting element into the light reflecting member further includes covering a side surface of the light emitting element and a side surface of the light transmissive member by the light reflecting member. ### Claim 18 (depends on 16) The method of manufacturing the light emitting device according to claim 16, wherein the providing of the light transmissive member includes forming the light transmissive member by one of forming a sheet of the light transmissive member and attaching the sheet using hot-melt adhesive or an adhesive agent, potting, compression molding, spraying, electrostatic coating and printing. ### Claim 19 (depends on 14) The method of manufacturing the light emitting device according to claim 14, wherein the embedding of the protruding portion of the connection terminals, the molten material, and the space between the substrate and the light emitting element into the light reflecting member further includes covering a side surface of the light emitting element by the light reflecting member. ### Claim 20 (depends on 17) The method of manufacturing the light emitting device according to claim 17, wherein the providing of the light transmissive member includes forming the light transmissive member by one of forming a sheet of the light transmissive member and attaching the sheet using hot-melt adhesive or an adhesive agent, potting, compression molding, spraying, electrostatic coating and printing.