# US 11,309,451 B2 · Flat panel detector and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,451 B2 - Document ID: US11309451B2 - Status: Granted - Kind: B2 - Application number: 16/767,704 - Filed: 2019-12-09 - Published: 2021-07-01 - Granted: 2022-04-19 - Earliest claimed: 2019-02-26 - Assignees: Beijing Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Applicants: Beijing Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Inventors: Xuecheng Hou; Chia Chiang Lin; Chuncheng Che - Web page: https://patentgrep.com/patent/US11309451B2 ## CPC - H10F 30/29: the devices being sensitive to radiation having very short wavelengths, e.g. X-rays, gamma-rays or corpuscular radiation - H10W 90/00: Package configurations - H04N 25/30: for transforming X-rays into image signals - H10F 39/1895: {of the hybrid type} - H10F 39/1898: {Indirect radiation image sensors, e.g. using luminescent members} - H10F 77/12: Active materials - H10F 77/20: Electrodes - H10F 39/803: {Pixels having integrated switching, control, storage or amplification elements} - H10F 39/8057: {Optical shielding} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract A flat panel detector and a manufacturing method thereof. The flat panel detector includes a first substrate and a second substrate. The first substrate includes a driving circuit, the second substrate includes a photosensitive element, the first substrate and the second substrate are arranged opposite to each other so as to be assembled, and the driving circuit is electrically connected with the photosensitive element to drive the photosensitive element. The flat panel detector not only can improve the filling rate of a photodiode in a pixel unit and increase the photosensitive area of the pixel unit in the flat panel detector, but also can effectively prevent static electricity and scratches generated during use and improve the photoelectric characteristics and yield of the flat panel detector. ## Claims ### Claim 1 A flat panel detector, comprising a first substrate and a second substrate, wherein the first substrate comprises a driving circuit, the second substrate comprises a photosensitive element, the first substrate and the second substrate are arranged opposite to each other so as to be assembled, and the driving circuit is electrically connected with the photosensitive element to drive the photosensitive element, wherein the first substrate further comprises a conductive connection portion, and the conductive connection portion is electrically connected with the driving circuit, is disposed on a surface of the first substrate, and is electrically connected with the photosensitive element, wherein the conductive connection portion is in contact with the photosensitive element. ### Claim 2 (depends on 1) The flat panel detector according to claim 1, wherein the conductive connection portion comprises a metal electrode, a conductive adhesive or a conductive spacer. ### Claim 3 (depends on 1) The flat panel detector according to claim 1, wherein the first substrate further comprises a first passivation layer, the first passivation layer is disposed between the conductive connection portion and the driving circuit, the first passivation layer comprises an opening region, and the conductive connection portion is disposed in the opening region. ### Claim 4 (depends on 3) The flat panel detector according to claim 3, wherein the first passivation layer is a planarization layer so that the first substrate has a substantially flat surface. ### Claim 5 (depends on 1) The flat panel detector according to claim 1, wherein the second substrate further comprises a base substrate and a transparent electrode layer formed on the base substrate, and the photosensitive element is disposed at a side of the transparent electrode layer away from the base substrate and is electrically connected with the transparent electrode layer. ### Claim 6 (depends on 1) The flat panel detector according to claim 1, further comprising a conductive adhesive, wherein the conductive adhesive is disposed between the first substrate and the second substrate to bond and assemble the first substrate with the second substrate. ### Claim 7 (depends on 1) The flat panel detector according to claim 1, wherein the driving circuit and the photosensitive element are at least partially overlapped in a direction in which the first substrate and the second substrate are right opposite to each other. ### Claim 8 (depends on 1) The flat panel detector according to claim 1, wherein the first substrate further comprises a light shielding layer, wherein the light shielding layer is disposed at a side of the driving circuit away from the first substrate, so as to be closer to the second substrate than the driving circuit, wherein the light shielding layer is in contact with the photosensitive element. ### Claim 9 (depends on 1) The flat panel detector according to claim 1, wherein the first substrate comprises a first base substrate, the second substrate comprises a second base substrate, and the first base substrate or the second base substrate is made of glass or plastic. ### Claim 10 (depends on 1) The flat panel detector according to claim 1, wherein the photosensitive element comprises a photodiode, and the photodiode is a photodiode of PIN type or a photodiode of PN type. ### Claim 11 A manufacturing method of a flat panel detector, comprising: forming a first substrate comprising a driving circuit; forming a second substrate comprising a photosensitive element; and oppositely arranging the first substrate and the second substrate so as to assemble the first substrate with the second substrate, so that the driving circuit is electrically connected with the photosensitive element; wherein the manufacturing method further comprises: forming a first passivation layer comprising an opening region on the driving circuit; and forming a conductive connection portion in the opening region to connect the driving circuit with the photosensitive element, wherein the conductive connection portion is in contact with the photosensitive element. ### Claim 12 (depends on 11) The manufacturing method according to claim 11, further comprising: providing a light shielding layer at a side of the driving circuit away from the first substrate, so that the light shielding layer is closer to the second substrate than the driving circuit after oppositely arranging the first substrate and the second substrate so as to assemble the first substrate with the second substrate, wherein the light shielding layer is in contact with the photosensitive element. ### Claim 13 (depends on 11) The manufacturing method according to claim 11, wherein forming the second substrate comprising the photosensitive element comprises forming a transparent electrode layer on a base substrate of the second substrate, and forming the photosensitive element at a side of the transparent electrode layer away from the second substrate. ### Claim 14 (depends on 11) The manufacturing method according to claim 11, further comprising: providing a conductive adhesive between the first substrate and the second substrate to bond and assemble the first substrate with the second substrate. ### Claim 15 (depends on 12) The manufacturing method according to claim 12, wherein the light shielding layer and the conductive connection portion are in contact with the first passivation layer, respectively. ### Claim 16 (depends on 12) The manufacturing method according to claim 12, wherein the driving circuit comprises an active layer and a gate electrode, the gate electrode and the light shielding layer are arranged at two opposite sides of the active layer, respectively. ### Claim 17 (depends on 12) The manufacturing method according to claim 12, wherein an interval is provided between the light shielding layer and the conductive connection portion in a direction parallel with the first substrate. ### Claim 18 (depends on 8) The flat panel detector according to claim 8, wherein the light shielding layer and the conductive connection portion are in contact with the first passivation layer, respectively. ### Claim 19 (depends on 8) The flat panel detector according to claim 8, wherein the light shielding layer is made of metal, and the light shielding layer and the conductive connection portion have a same material. ### Claim 20 (depends on 8) The flat panel detector according to claim 8, wherein an interval is provided between the light shielding layer and the conductive connection portion in a direction parallel with the first substrate.