# US 11,309,443 B2 · Photosensitive module

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,309,443 B2
- Document ID: US11309443B2
- Status: Granted
- Kind: B2
- Application number: 16/851,765
- Filed: 2020-04-17
- Published: 2020-10-22
- Granted: 2022-04-19
- Earliest claimed: 2019-04-19
- Assignees: TDK Taiwan Corp.
- Applicants: TDK Taiwan Corp.
- Inventors: Chen-Er Hsu; Sin-Jhong Song; Chi-Fu Wu; Hao-Yu Wu; Tsutomu Fukai; Ming-Hung Wu
- Web page: https://patentgrep.com/patent/US11309443B2

## CPC

- G02B 27/646: {compensating for small deviations, e.g. due to vibration or shake (movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68)}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- G02B 7/003: {Alignment of optical elements (G02B7/001, G02B7/002 take precedence; for mirrors G02B7/1822)}
- G02B 7/08: adapted to co-operate with a remote control mechanism
- G02B 7/09: adapted for automatic focusing or varying magnification
- G02B 7/1821: {for rotating or oscillating mirrors}
- G03B 5/00: Adjustment of optical system relative to image or object surface other than for focusing
- G03B 5/02: Lateral adjustment of lens
- G03B 5/04: Vertical adjustment of lens; Rising fronts
- G03B 13/36: Autofocus systems
- H02K 11/21: Devices for sensing speed or position, or actuated thereby (specially adapted for machines having non-mechanical commutating devices H02K29/06, H02K29/14)
- H02K 41/0356: {moving along a straight path}
- H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof
- H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
- H10F 30/282: Insulated-gate field-effect transistors [IGFET], e.g. MISFET [metal-insulator-semiconductor field-effect transistor] phototransistors
- H10F 39/804: {Containers or encapsulations}
- H10F 39/811: {Interconnections}
- H10F 77/244: {made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers}
- H10F 77/413: {directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42)}
- H10F 77/60: Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
- H10F 77/707: {of the substrates or of layers on substrates, e.g. textured ITO layer on a glass substrate}
- H10F 77/93: {Interconnections}
- H10F 77/95: {Circuit arrangements}
- G02B 13/0045: {having five or more lenses}
- G03B 2205/0007: Movement of one or more optical elements for control of motion blur
- G03B 2205/0069: using electromagnetic actuators, e.g. voice coils
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D)
- H02K: DYNAMO-ELECTRIC MACHINES (dynamo-electric relays H01H53/00; conversion of DC or AC input power into surge output power {H03K3/53})
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

## Claims

### Claim 1

A photosensitive module, comprising:
a base;
an integrated package substrate, connected to the base, wherein the integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment; and
a photosensitive element, connected to the base, wherein the photosensitive element is configured to receive a light beam traveling along an optical axis;
wherein the integrated package substrate includes:
a third insulating layer;
a fourth insulating layer;
an intermediate layer, disposed between the third insulating layer and the fourth insulating layer, wherein the first electronic components are disposed in the intermediate layer;
a first circuit element, disposed between the third insulating layer and the intermediate layer; and
a second circuit element, disposed between the intermediate layer and the fourth insulating layer, wherein the intermediate layer, the third insulating layer and the fourth insulating layer are made of different materials.

### Claim 2 (depends on 1)

The photosensitive module as claimed in claim 1, wherein the photosensitive module further includes a second electronic component disposed on a surface of the integrated package substrate.

### Claim 3 (depends on 1)

The photosensitive module as claimed in claim 1, wherein the photosensitive module includes a heat dissipation structure, corresponding to the photosensitive element or the integrated package substrate, and the heat dissipation structure is made of a metal material.

### Claim 4 (depends on 3)

The photosensitive module as claimed in claim 3, wherein the heat dissipation structure penetrates the integrated package substrate.

### Claim 5 (depends on 4)

The photosensitive module as claimed in claim 4, wherein the photosensitive module further includes a heat conductive element which is in direct contact with the heat dissipation structure and the photosensitive element, and the heat conductive element is electrically independent of the photosensitive element.

### Claim 6 (depends on 1)

The photosensitive module as claimed in claim 1, wherein the photosensitive module further includes:
a circuit assembly;
a first electrical connection portion, wherein the integrated package substrate is electrically connected to the circuit assembly through the first electrical connection portion; and
a reinforcing material, in direct contact with the first electrical connection portion, the integrated package substrate and the circuit assembly.

### Claim 7 (depends on 6)

The photosensitive module as claimed in claim 6, wherein the photosensitive module further includes a second electrical connection portion, the photosensitive element is electrically connected to the integrated package substrate via the second electrical connection portion, and the first electrical connection portion and the second electrical connection portion are respectively disposed on different sides of the integrated package substrate which has a polyhedral structure.

### Claim 8 (depends on 6)

The photosensitive module as claimed in claim 6, wherein the photosensitive module further includes a second electrical connection portion, the photosensitive element is electrically connected to the integrated package substrate via the second electrical connection portion, and the first electrical connection portion and the second electrical connection portion are disposed on a same side of the integrated package substrate which has a polyhedral structure.

### Claim 9 (depends on 8)

The photosensitive module as claimed in claim 8, wherein the reinforcing material is further in direct contact with the second electrical connection portion.

### Claim 10 (depends on 8)

The photosensitive module as claimed in claim 8, wherein the photosensitive module further includes a second electronic component, and the second electronic component and the photosensitive element are respectively disposed on different sides of the integrated package substrate.

### Claim 11 (depends on 8)

The photosensitive module as claimed in claim 8, wherein the base includes an opening corresponding to the photosensitive element.

### Claim 12 (depends on 8)

The photosensitive module as claimed in claim 8, wherein the photosensitive module further includes a blocking wall disposed between the photosensitive element and the integrated package substrate, and the reinforcing material is in direct contact with the blocking wall, the second electrical connection portion, the integrated package substrate and the photosensitive element.

### Claim 13 (depends on 8)

The photosensitive module as claimed in claim 8, wherein when viewed in a direction perpendicular to the optical axis, the photosensitive element overlaps at least a portion of the base.

### Claim 14 (depends on 1)

The photosensitive module as claimed in claim 1, wherein when viewed in a direction perpendicular to the optical axis, the photosensitive element overlaps at least a portion of the integrated package substrate.

### Claim 15 (depends on 14)

The photosensitive module as claimed in claim 14, wherein the photosensitive module further includes a transparent element, and when viewed in the direction perpendicular to the optical axis, at least a portion of the transparent element overlaps the integrated package substrate.

### Claim 16 (depends on 1)

The photosensitive module as claimed in claim 1, wherein the photosensitive module further includes a transparent element corresponding to the photosensitive element, and when viewed in a direction perpendicular to the optical axis, the base is located between the transparent element and the photosensitive element.

### Claim 17 (depends on 1)

The photosensitive module as claimed in claim 1, wherein the integrated package substrate includes an accommodating space for accommodating the photosensitive element.

### Claim 18 (depends on 17)

The photosensitive module as claimed in claim 17, wherein at least a portion of the base is disposed in the accommodating space, and when viewed in a direction perpendicular to the optical axis, the base partially overlaps the integrated package substrate.

### Claim 19 (depends on 18)

The photosensitive module as claimed in claim 18, wherein the photosensitive module further includes a heat dissipation structure disposed between the photosensitive element and the base, and the heat dissipation structure is in direct contact with the photosensitive element, the base and the integrated package substrate.