# US 11,309,374 B2 · Mask component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,374 B2 - Document ID: US11309374B2 - Status: Granted - Kind: B2 - Application number: 16/619,993 - Filed: 2019-10-15 - Published: 2021-10-28 - Granted: 2022-04-19 - Earliest claimed: 2019-06-14 - Assignees: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Applicants: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Inventors: Xiao Du - Web page: https://patentgrep.com/patent/US11309374B2 ## CPC - C23C 14/042: {using masks} - G03F 1/22: Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof - H10K 59/126: Shielding, e.g. light-blocking means over the TFTs - H10K 59/1201: {Manufacture or treatment} - H10K 71/166: {using selective deposition, e.g. using a mask} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract A mask component includes a first mask plate and a second mask plate, and the first mask plate includes a first shield region, a first open region disposed in the first shield region, an electronic component shield region disposed in the first open region, a connecting shield region disposed in the first open region. The electronic component shield region is connected to the first shield region by the connecting shield region. The connecting shield region includes a first connecting shield region disposed on one side of the electronic component shield region and a second connecting shield region disposed on another side of the electronic component shield region, and the first mask plate is configured to evaporate a common electrode to obtain a first region of the common electrode. ## Claims ### Claim 1 A mask component, comprising: a first mask plate, wherein the first mask plate comprises a first shield region, a first open region disposed in the first shield region, an electronic component shield region disposed in the first open region, a connecting shield region disposed in the first open region, the electronic component shield region is connected to the first shield region by the connecting shield region, the connecting shield region comprises a first connecting shield region disposed on one side of the electronic component shield region and a second connecting shield region disposed on another side of the electronic component shield region, and the first mask plate is configured to evaporate a common electrode to obtain a first region of the common electrode; and a second mask plate, wherein the second mask plate comprises a second shield region, a second open region disposed in the second shield region, and the electronic component shield region disposed in the second open region, the second shield region corresponds to the first open region and the first shield region, and the second mask plate is configured to evaporate the common electrode to obtain a second region of the common electrode. ### Claim 2 (depends on 1) The mask component according to claim 1, wherein the first connecting shield region is connected to one side of the first open region. ### Claim 3 (depends on 2) The mask component according to claim 2, wherein the first connecting shield region is an I-shape. ### Claim 4 (depends on 2) The mask component according to claim 2, wherein the first connecting shield region is connected to a long side of the first open region. ### Claim 5 (depends on 2) The mask component according to claim 2, wherein the first connecting shield region is connected to a short side of the first open region. ### Claim 6 (depends on 1) The mask component according to claim 1, wherein the first connecting shield region is connected to two sides of the first open region. ### Claim 7 (depends on 6) The mask component according to claim 6, wherein the first connecting shield region is an L-shape. ### Claim 8 (depends on 1) The mask component according to claim 1, wherein the first connecting shield region is connected to three sides of the first open region. ### Claim 9 (depends on 8) The mask component according to claim 8, wherein the first connecting shield region is a T-shape. ### Claim 10 (depends on 1) The mask component according to claim 1, wherein the first connecting shield region is connected to four sides of the first open region. ### Claim 11 (depends on 1) The mask component according to claim 1, wherein an area of the second open region is bigger than an area of the first connecting shield region. ### Claim 12 (depends on 1) The mask component according to claim 1, wherein a border of the first open region of the first mask plate is extended further from a panel display region by 50 to 500 μm. ### Claim 13 (depends on 1) The mask component according to claim 1, wherein a border of the second open region of the second mask plate is extended further from the first shield region by 50 to 500 μm. ### Claim 14 (depends on 1) The mask component according to claim 1, wherein the first connecting shield region surrounds the electronic component shield region. ### Claim 15 (depends on 1) The mask component according to claim 1, wherein the electronic component is a camera, and the electronic component shield region is a circular shape. ### Claim 16 (depends on 1) The mask component according to claim 1, wherein the electronic component is an under-display call module, and the electronic component shield region is a rectangular shape. ### Claim 17 (depends on 1) The mask component according to claim 1, wherein a border of the electronic component shield region is extended further from the electronic component by 50 to 500 μm. ### Claim 18 (depends on 1) The mask component according to claim 1, wherein the first mask plate has a thickness of 0.02 to 0.2 mm. ### Claim 19 (depends on 1) The mask component according to claim 1, wherein the second mask plate has a thickness of 0.02 to 0.2 mm. ### Claim 20 (depends on 1) The mask component according to claim 1, wherein a thickness of the first mask plate is greater than a thickness of the second mask plate.