# US 11,309,350 B2 · Light-emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,350 B2 - Document ID: US11309350B2 - Status: Granted - Kind: B2 - Application number: 16/160,653 - Filed: 2018-10-15 - Published: 2019-02-14 - Granted: 2022-04-19 - Earliest claimed: 2012-08-15 - Assignees: Epistar Corporation - Applicants: Epistar Corporation - Inventors: Min Hsun Hsieh; Hsin-Mao Liu - Web page: https://patentgrep.com/patent/US11309350B2 ## CPC - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - G09G 3/32: semiconductive, e.g. using light-emitting diodes [LED] - H10H 20/8506: {Containers} - H10H 20/8515: {not being in contact with the bodies} - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/10: Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 (active-matrix LED displays H10H29/30) - H10H 20/036: {of packages} - H10H 20/0361: {of wavelength conversion means} - H10H 20/0362: {of encapsulations} - H10H 20/0364: {of interconnections} - H10H 20/8314: {extending at least partially onto an outer side surface of the bodies} - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract This disclosure discloses a light-emitting display module display. The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board; wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other; and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting, and a fence; and wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units. ## Claims ### Claim 1 A light-emitting module, comprising: a first encapsulated light-emitting diode (LED) unit comprising a first optoelectronic unit and a first electrode pad and a second electrode pad which are formed directly below the first optoelectronic unit; a non-transparent fence surrounding the first optoelectronic unit, and a transparent structure located on and covering the non-transparent fence, the first optoelectronic unit, the first electrode pad, and the second electrode pad; a second encapsulated LED unit having a second optoelectronic unit, and a third electrode pad and a fourth electrode pad formed directly below the second optoelectronic unit; a submount upon which the first encapsulated LED unit and the second encapsulated LED unit are located, wherein the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad face the submount; a first pin formed below the first electrode pad, and electrically connected to the first electrode pad; and a second pin formed below the second electrode pad and electrically connected to the second electrode pad, wherein the first pin is connected to the submount. ### Claim 2 (depends on 1) The light-emitting module of claim 1, wherein the second pin has a width larger than that of the second electrode pad. ### Claim 3 (depends on 1) The light-emitting module of claim 1, further comprising a conductive structure electrically connecting the first pin and the first electrode pad. ### Claim 4 (depends on 1) The light-emitting module of claim 1, wherein the transparent structure comprises a recess covering the first optoelectronic unit. ### Claim 5 (depends on 1) The light-emitting module of claim 1, wherein the transparent structure is arranged between the first optoelectronic unit and the non-transparent fence in a configuration of covering a top surface of the first optoelectronic unit and exposing a bottom surface of the first optoelectronic unit. ### Claim 6 (depends on 1) The light-emitting module of claim 1, wherein the first encapsulated LED unit has a size less than 0.1 mm3. ### Claim 7 (depends on 1) The light-emitting module of claim 1, wherein the first encapsulated LED unit is functioned as a pixel of a display. ### Claim 8 (depends on 1) The light-emitting module of claim 1, further comprising a third optoelectronic unit arranged with the first optoelectronic unit and the second optoelectronic unit in a linear pattern. ### Claim 9 (depends on 1) The light-emitting module of claim 1, wherein the non-transparent fence has a first top planar surface, and the transparent structure has a second top planar surface flush with the first top planar surface. ### Claim 10 (depends on 1) The light-emitting module of claim 1, wherein the first pin comprises a first surface and a second surface opposite to the first surface, the first surface is connected to the first electrode pad and the transparent structure, and the second surface is exposed from the transparent structure. ### Claim 11 (depends on 1) The light-emitting module of claim 1, wherein the submount comprises epoxy, bismaleimide triazine, polyimide resin, polytetrafluorethylene, Al2O3, AlN, or AlSiC. ### Claim 12 (depends on 1) The light-emitting module of claim 1, wherein the first electrode pad and the second electrode pad are formed at a same side of the first optoelectronic unit to face the first pin. ### Claim 13 (depends on 1) The light-emitting unit of claim 1, wherein the first electrode pad and the first pin are overlapped with each other in a vertical direction.