# US 11,309,344 B2 · Imaging device, solid state image sensor, and electronic device

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- Number: US 11,309,344 B2
- Document ID: US11309344B2
- Status: Granted
- Kind: B2
- Application number: 16/616,164
- Filed: 2018-05-15
- Published: 2020-03-12
- Granted: 2022-04-19
- Earliest claimed: 2017-05-29
- Assignees: Sony Semiconductor Solutions Corporation
- Applicants: Sony Semiconductor Solutions Corporation
- Inventors: Atsushi Yamamoto
- Web page: https://patentgrep.com/patent/US11309344B2

## CPC

- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- G02B 27/0018: {with means for preventing ghost images (anti-reflection coatings G02B1/11)}
- H04N 23/53: of electronic viewfinders, e.g. rotatable or detachable
- H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof
- H10F 39/804: {Containers or encapsulations}
- H10F 39/805: {Coatings}
- H10F 39/8057: {Optical shielding}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

To suppress generation of flare and ghosts. A solid state image sensor includes: a pixel array configured to generate a pixel signal according to an amount of incident light by photoelectric conversion in units of pixels arranged in an array manner; a glass substrate bonded with a light-receiving surface of the pixel array; and a light-shielding film formed on a peripheral portion that is an outside of an effective pixel region of the pixel array, in which the light-shielding film is formed at a front stage of the glass substrate. The present disclosure can be adapted to an imaging device.

## Claims

### Claim 1

An integrated assembly for an imaging device comprising:
a pixel array;
an optical assembly comprising one or more transparent materials mounted with the pixel array in the integrated assembly; and
a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials, wherein the optical assembly comprises a transparent substrate and wherein a width of a substrate including the pixel array is the same as a width of the transparent substrate.

### Claim 2 (depends on 1)

The integrated assembly of claim 1, wherein the optical assembly comprises a glass substrate that is bonded to the pixel array and the light shield is formed on a periphery of the glass substrate.

### Claim 3 (depends on 2)

The integrated assembly of claim 2, further comprising a non-flat film formed on the glass substrate.

### Claim 4 (depends on 3)

The integrated assembly of claim 3, further comprising a cavity formed between a central region of the pixel array and a central region of the glass substrate.

### Claim 5 (depends on 2)

The integrated assembly of claim 2, wherein the pixel array and glass substrate are part of a chip size package.

### Claim 6 (depends on 1)

The integrated assembly of claim 1, further comprising a non-flat film formed on the optical assembly.

### Claim 7 (depends on 6)

The integrated assembly of claim 6, further comprising a cavity formed between a central region of the pixel array and a central region of the optical assembly, wherein the light shield is formed on at least a peripheral region of the non-flat film.

### Claim 8 (depends on 1)

The integrated assembly of claim 1, wherein the optical assembly comprises a glass substrate and an infrared filter formed on the glass substrate, wherein the glass substrate is bonded to the pixel array and the light shield is formed on a periphery of the infrared filter.

### Claim 9 (depends on 8)

The integrated assembly of claim 8, further comprising a non-flat film formed on the infrared filter.

### Claim 10 (depends on 1)

The integrated assembly of claim 1, wherein the optical assembly comprises:
a glass substrate that is bonded to the pixel array; and
an infrared filter formed on the glass substrate, the integrated assembly further comprising
a non-flat film formed on the infrared filter, wherein the light shield is formed on at least a peripheral region of the non-flat film.

### Claim 11 (depends on 1)

The integrated assembly of claim 1, wherein the optical assembly comprises an infrared filter that is bonded to the glass substrate and the light shield is formed on a periphery of the infrared filter.

### Claim 12 (depends on 11)

The integrated assembly of claim 11, further comprising a non-flat film formed on the infrared filter.

### Claim 13 (depends on 1)

An imaging device, comprising a lens group and an integrated assembly according to claim 1.

### Claim 14 (depends on 1)

A camera module including an imaging apparatus, the imaging apparatus comprising:
integrated assembly according to claim 1; and
a plurality of lenses mounted apart from the pixel array.

### Claim 15 (depends on 1)

An electronic apparatus comprising:
a solid state image sensor comprising:
integrated assembly according to claim 1;
a plurality of lenses mounted apart from the pixel array;
a signal processing circuit arranged to receive signals from sensors in the pixel array;
memory arranged to store image data;
a monitor arranged to display image data; and
a control circuit configured to control transfer of signal electric charges in the solid state image sensor.