# US 11,309,338 B2 · Display device and electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,338 B2 - Document ID: US11309338B2 - Status: Granted - Kind: B2 - Application number: 16/301,067 - Filed: 2017-03-28 - Published: 2019-06-20 - Granted: 2022-04-19 - Earliest claimed: 2016-05-24 - Assignees: Sony Corporation - Applicants: Sony Corporation - Inventors: Toshihiko Watanabe; Akiyoshi Aoyagi; Hirokazu Nakayama - Web page: https://patentgrep.com/patent/US11309338B2 ## CPC - H10D 86/60: wherein the TFTs are in active matrices - H05K 1/112: {directly combined with via connections} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 3/34: by soldering - H05K 3/422: {characterised by electroless plating method; pretreatment therefor} - H05K 3/423: {characterised by electroplating method} - H05K 3/46: Manufacturing multilayer circuits - H10D 86/021: {of multiple TFTs} - H10D 86/443: {adapted for preventing breakage, peeling or short circuiting} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/66: Conductive materials thereof - H10W 70/695: Organic materials - H05K 2201/09609: Via grid, i.e. two-dimensional array of vias or holes in a single plane - H05K 2203/072: Electroless plating, e.g. finish plating or initial plating - H05K 2203/0723: Electroplating, e.g. finish plating - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Provided is a display device and an electronic apparatus that prevent the occurrence of failure in the connection between a mounting substrate and an electronic component. The display device includes an interconnection layer provided on a support substrate, a plurality of insulating layers provided above the interconnection layer, an opening provided in parts of the insulating layers, and a metal layer electrically connected to the interconnection layer and filling the opening up to a height below a layer surface of the insulating layer. ## Claims ### Claim 1 A display device, comprising: a first interconnection layer on a support substrate; a first insulating layer on the first interconnection layer; a second interconnection layer on the first insulating layer; a second insulating layer on the second interconnection layer; a first opening and a second opening, wherein the second opening includes the first opening, each of the first opening and the second opening pierces each of the second insulating layer and the first insulating layer, a shape of each of the first opening and the second opening is substantially circular, and a center of the first opening is different from a center of the second opening; a first metal layer in the first opening and a second metal layer in the second opening, wherein the first metal layer is electrically connected to the first interconnection layer, the second metal layer is on the first metal layer, the first metal layer and the second metal layer are not connected to the second interconnection layer, each of the second metal layer and the first metal layer fills the first opening up to a height below a layer surface of the second insulating layer, the first metal layer has a different material from the second metal layer. ### Claim 2 (depends on 1) The display device according to claim 1, wherein the first interconnection layer is electrically insulated from the second interconnection layer. ### Claim 3 (depends on 1) The display device according to claim 1, wherein the shape of the first opening is different in each of the second insulating layer and the first insulating layer. ### Claim 4 (depends on 3) The display device according to claim 3, wherein the shape of the first opening in the first insulating layer is smaller than the shape of the first opening in the second insulating layer. ### Claim 5 (depends on 3) The display device according to claim 3, wherein the shape of the first opening in the first insulating layer is coaxial with the shape of the first opening in the second insulating layer. ### Claim 6 (depends on 3) The display device according to claim 3, wherein the shape of the first opening in the first insulating layer is a shape that extends in a direction orthogonal to a direction of extension of the first interconnection layer, and the first insulating layer is in contact with the first interconnection layer. ### Claim 7 (depends on 1) The display device according to claim 1, wherein a material of the first metal layer contains a platinum group element, and the second metal layer is solder. ### Claim 8 (depends on 1) The display device according to claim 1, further comprising an electronic component facing the support substrate, wherein the second metal layer is solder, and the electronic component is electrically connected to the support substrate via the solder. ### Claim 9 (depends on 1) The display device according to claim 1, wherein the support substrate is a display panel including an optical element. ### Claim 10 An electronic apparatus, comprising: a first interconnection layer on a support substrate; a first insulating layer on the first interconnection layer; a second interconnection layer on the first insulating layer; a second insulating layer on the second interconnection layer; a first opening and a second opening, wherein the second opening includes the first opening, each of the first opening and the second opening pierces each of the second insulating layer and the first insulating layer, a shape of each of the first opening and the second opening is substantially circular, and a center of the first opening is different from a center of the second opening; a first metal layer in the first opening and a second metal layer in the second opening, wherein the first metal layer is electrically connected to the first interconnection layer, the second metal layer is on the first metal layer, the first metal layer and the second metal layer are not connected to the second interconnection layer, each of the second metal layer and the first metal layer fills the first opening up to a height below a layer surface of the second insulating layer, the first metal layer has a different material from the second metal layer. ### Claim 11 (depends on 1) The display device according to claim 1, wherein a thickness of the first insulating layer is different from a thickness of the second insulating layer.