# US 11,309,299 B2 · Image sensor package and endoscope > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,299 B2 - Document ID: US11309299B2 - Status: Granted - Kind: B2 - Application number: 17/097,714 - Filed: 2020-11-13 - Published: 2021-08-12 - Granted: 2022-04-19 - Earliest claimed: 2020-02-11 - Assignees: Medimaging Integrated Solution, Inc. - Applicants: Medimaging Integrated Solution, Inc. - Inventors: Shangyi Wu; Mingche Hsieh - Web page: https://patentgrep.com/patent/US11309299B2 ## CPC - H10W 90/00: Package configurations - A61B 1/0011: {Manufacturing of endoscope parts} - A61B 1/00114: {Electrical cables in or with an endoscope} - A61B 1/00124: {electrical, e.g. electrical plug-and-socket connection} - A61B 1/00195: {with eyepieces} - A61B 1/051: {Details of CCD assembly} - A61B 1/053: {being detachable} - A61B 1/0676: {at distal tip of an endoscope} - A61B 1/0684: {using light emitting diodes [LED]} - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/56: provided with illuminating means - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 1/189: characterised by the use of flexible or folded printed circuits - H04N 23/555: {for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/181: associated with surface mounted components - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10287: Metal wires as connectors or conductors - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An image sensor package includes a substrate, an image sensor, a light-emitting element, and a package body. The substrate includes a plurality of first conductive contacts and a plurality of second conductive contacts. The image sensor is disposed on the substrate and electrically connected to the corresponding first conductive contacts. The light-emitting element is close to the image sensor, disposed on the substrate and electrically connected to the corresponding first conductive contacts. The package body is filled between the image sensor and the light emitting element. The above-mentioned image sensor package can achieve miniaturization, provide uniform illumination, and increase light utilization efficiency. An endoscope including the above-mentioned image sensor package is also disclosed. ## Claims ### Claim 1 An image sensor package comprising: a substrate including a plurality of first conductive contacts and a plurality of second conductive contacts, wherein the plurality of first conductive contacts and the plurality of second conductive contacts are respectively disposed on opposite surfaces of the substrate, and the plurality of second conductive contacts is electrically connected with the plurality of corresponding first conductive contacts; an image sensor disposed on the substrate and electrically connected with the plurality of corresponding first conductive contacts; a light-emitting element disposed on the substrate, neighboring the image sensor, and electrically connected with the plurality of corresponding first conductive contacts; a package body filled between the image sensor and the light-emitting element; and an adapter including a plurality of third conductive contacts and a plurality of fourth conductive contacts electrically connected with the plurality of corresponding third conductive contacts, wherein the adapter is connected with the substrate; the plurality of third conductive contacts is electrically connected with the plurality of corresponding second conductive contacts; and a plane where the plurality of fourth conductive contacts are disposed is vertical to a surface of the substrate; wherein the image sensor package further comprises an electric-conduction connector including a plurality of fifth conductive contacts and a plurality of sixth conductive contacts electrically connected with the plurality of corresponding fifth conductive contacts, wherein the plurality of fifth conductive contacts faces the plurality of fourth conductive contacts, and the adaptor is connected with the electric-conduction connector to facilitate electric connection of the plurality of fourth conductive contacts and the plurality of corresponding fifth conductive contacts; or the image sensor package further comprises a plurality of wires electrically connected with the fourth conductive contacts of the adapter; and a protective resin body, which encapsulates the plurality of fourth conductive contacts of the adapter and connection terminals of the plurality of wires. ### Claim 2 (depends on 1) The image sensor package according to claim 1, wherein a height of a light entrance surface of the image sensor is equal to or greater than a height of a light-emitting surface of the light-emitting element. ### Claim 3 (depends on 1) The image sensor package according to claim 1, wherein a height of a light entrance surface of the image sensor is greater than a height of a light-emitting surface of the light-emitting element; a difference of the height of the light entrance surface of the image sensor and the height of the light-emitting surface of the light-emitting element is equal to or less than 1 mm. ### Claim 4 (depends on 1) The image sensor package according to claim 1, wherein a height of a light entrance surface of the image sensor is equal to or greater than a height of a top surface of the package body. ### Claim 5 (depends on 1) The image sensor package according to claim 1, wherein the package body covers the light-emitting element. ### Claim 6 (depends on 1) The image sensor package according to claim 1, wherein a light-emitting surface of the light-emitting element is exposed from the package body; the package body is made of an opaque resin. ### Claim 7 (depends on 1) The image sensor package according to claim 1, wherein the image sensor includes a light-shielding layer; the light-shielding layer is disposed between the image sensor and the light-emitting element. ### Claim 8 (depends on 1) The image sensor package according to claim 1, wherein the image sensor includes an imaging lens. ### Claim 9 (depends on 1) The image sensor package according to claim 1, wherein the adapter is a rigid adapter or a flexible circuit board. ### Claim 10 (depends on 1) The image sensor package according to claim 1, wherein the substrate is made of a ceramic material. ### Claim 11 (depends on 1) The image sensor package according to claim 1, wherein the image sensor package comprises a plurality of the light-emitting elements, and the plurality of light-emitting elements is disposed around the image sensor. ### Claim 12 (depends on 1) The image sensor package according to claim 1, wherein the light-emitting element is a white LED (Light-emitting Diode), an infrared LED, a blue LED, an ultraviolet LED, or a combination thereof. ### Claim 13 An endoscope comprising: a pipe structure having a first opening and a second opening, wherein an end of the first opening of the pipe structure is to be extended into a cavity; an image sensor package disposed at the end of the first opening, capturing an image of the cavity, and generating a corresponding electronic signal, wherein the image sensor package comprises: a substrate including a plurality of first conductive contacts and a plurality of second conductive contacts, wherein the plurality of first conductive contacts and the plurality of second conductive contacts are respectively disposed on opposite surfaces of the substrate, and the plurality of second conductive contacts is electrically connected with the plurality of corresponding first conductive contacts; an image sensor disposed on the substrate and electrically connected with the plurality of corresponding first conductive contacts; a light-emitting element disposed on the substrate, neighboring the image sensor, and electrically connected with the corresponding first conductive contacts; and a package body filled between the image sensor and the light-emitting element; an adapter including a plurality of third conductive contacts and a plurality of fourth conductive contacts electrically connected with the plurality of corresponding third conductive contacts, wherein the adapter is connected with the substrate; the plurality of third conductive contacts is electrically connected with the plurality of corresponding second conductive contacts; and a plane where the plurality of fourth conductive contacts are disposed is vertical to a surface of the substrate; a plurality of wires electrically connected with the plurality of corresponding fourth conductive contacts of the adapter; and an electric connector electrically connected with the plurality of wires and for electric connection with an external electronic device in a pluggable manner; wherein the plurality of wires directly connected with the plurality of fourth conductive contacts of the adapter, and the image sensor package further comprises a protective resin body, which encapsulates the plurality of fourth conductive contacts of the adapter and connection terminals of the plurality of wires; or the image sensor package further comprises an electric-conduction connector including a plurality of fifth conductive contacts and a plurality of sixth conductive contacts electrically connected with the plurality of corresponding fifth conductive contacts, wherein the plurality of fifth conductive contacts faces the plurality of fourth conductive contacts, the adaptor is connected with the electric-conduction connector to facilitate electric connection of the plurality of fourth conductive contacts and the plurality of corresponding fifth conductive contacts, and the plurality of wires electrically connected with the plurality of corresponding sixth conductive contacts of the electric-conduction connector. ### Claim 14 (depends on 13) The endoscope according to claim 13 further comprising: an extension tube, wherein one end of the extension tube is connected with an end of the second opening of the pipe structure, and another end of the extension tube is connected with the electric connector; the plurality of wires is disposed inside the extension tube. ### Claim 15 (depends on 13) The endoscope according to claim 13 further comprising: an electronic element, which is electrically connected with the image sensor package and the electric connector to process electronic signals generated by the image sensor package. ### Claim 16 (depends on 13) The endoscope according to claim 13, wherein the pipe structure further includes a working channel. ### Claim 17 (depends on 13) The endoscope according to claim 13 further comprising: a casing, which is disposed between the pipe structure and the electric connector. ### Claim 18 (depends on 13) The endoscope according to claim 13, wherein a height of a light entrance surface of the image sensor is equal to or greater than a height of a light-emitting surface of the light-emitting element. ### Claim 19 (depends on 13) The endoscope according to claim 13, wherein a height of a light entrance surface of the image sensor is greater than a height of a light-emitting surface of the light-emitting element; a difference of the height of the light entrance surface of the image sensor and the height of the light-emitting surface of the light-emitting element is equal to or less than 1 mm. ### Claim 20 (depends on 13) The endoscope according to claim 13, wherein a height of a light entrance surface of the image sensor is equal to or greater than a height of a top surface of the package body. ### Claim 21 (depends on 13) The endoscope according to claim 13, wherein the package body covers the light-emitting element. ### Claim 22 (depends on 13) The endoscope according to claim 13, wherein a light-emitting surface of the light-emitting element is exposed from the package body; the package body is made of an opaque resin. ### Claim 23 (depends on 13) The endoscope according to claim 13, wherein the image sensor includes a light-shielding layer; the light-shielding layer is disposed between the image sensor and the light-emitting element. ### Claim 24 (depends on 13) The endoscope according to claim 13, wherein the image sensor includes an imaging lens. ### Claim 25 (depends on 13) The endoscope according to claim 13, wherein the adapter is a rigid adapter or a flexible circuit board. ### Claim 26 (depends on 13) The endoscope according to claim 13, wherein the substrate is made of a ceramic material. ### Claim 27 (depends on 13) The endoscope according to claim 13, wherein the image sensor package comprises a plurality of the light-emitting elements, and the plurality of light-emitting elements is disposed around the image sensor. ### Claim 28 (depends on 13) The endoscope according to claim 13, wherein the light-emitting element is a white LED (Light-emitting Diode), an infrared LED, a blue LED, an ultraviolet LED, or a combination thereof.