# US 11,309,298 B2 · Light-emitting diode device with driving mechanism > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,298 B2 - Document ID: US11309298B2 - Status: Granted - Kind: B2 - Application number: 17/001,662 - Filed: 2020-08-24 - Published: 2021-03-04 - Granted: 2022-04-19 - Earliest claimed: 2019-08-27 - Assignees: My-Semi Inc. - Applicants: My-Semi Inc. - Inventors: Cheng-Han Hsieh; Kuo-Lun Huang; Chun-Ting Kuo - Web page: https://patentgrep.com/patent/US11309298B2 ## CPC - H10W 90/00: Package configurations - H05B 45/20: Controlling the colour of the light - H10W 72/90: Bond pads, in general - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/29: Bond pads specially adapted therefor - H10W 72/50: Bond wires - H10W 72/551: {Materials of bond wires} - H10W 72/853: {On the same surface} - H10W 72/859: {Bump connectors and bond wires} - H10W 72/926: {Multiple bond pads having different sizes} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 80/701: {characterised by the pads after the direct bonding} - H10W 90/722: {between stacked chips} - H10W 90/792: {between multiple chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL ## Abstract A light-emitting diode device with a driving mechanism is provided. A first light-emitting diode chip, a second light-emitting diode chip and a third light-emitting diode chip are arranged on a driver circuit chip, and respectively configured to emit red light, green light and blue light. A first contact of the light-emitting diode chip, a first contact of the second light-emitting diode chip and a first contact of the third light-emitting diode chip are respectively in direct electrical contact with a first output contact, a second output contact and a third output contact of the driver circuit chip in a flip-chip manner. A second contact of the first light-emitting diode chip, a second contact of the second light-emitting diode chip and a second contact of the third light-emitting diode chip are in direct electrical contact with a common contact of the driver circuit chip. ## Claims ### Claim 1 A light-emitting diode device with a driving mechanism, comprising: a first light-emitting diode chip configured to emit red light; a second light-emitting diode chip configured to emit green light; a third light-emitting diode chip configured to emit blue light; and a driver circuit chip being in direct electrical contact with the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip, and configured to drive the first light-emitting diode chip to emit the red light, the second light-emitting diode chip to emit the green light and the third light-emitting diode chip to emit the blue light; wherein the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip are disposed on the driver circuit chip; wherein a first contact of the first light-emitting diode chip is in direct electrical contact with a first output contact of the driver circuit chip in a flip-chip manner, a first contact of the second light-emitting diode chip is in direct electrical contact with a second output contact of the driver circuit chip in the flip-chip manner, and a first contact of the third light-emitting diode chip is in direct electrical contact with a third output contact of the driver circuit chip in the flip-chip manner; wherein any two or three of a second contact of the first light-emitting diode chip, a second contact of the second light-emitting diode chip and a second contact of the third light-emitting diode chip are in direct electrical contact with a common contact of the driver circuit chip. ### Claim 2 (depends on 1) The light-emitting diode device according to claim 1, wherein a total area of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip is smaller than an area of the driver circuit chip. ### Claim 3 (depends on 1) The light-emitting diode device according to claim 1, wherein the first contacts of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip are cathodes; the second contacts of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip are anodes. ### Claim 4 (depends on 1) The light-emitting diode device according to claim 1, wherein the first contacts of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip are anodes; the second contacts of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip are cathodes. ### Claim 5 (depends on 1) The light-emitting diode device according to claim 1, wherein the driver circuit chip has an electrical contact pad, a serial data input pad and a serial data output pad, the electrical contact pad is grounded, the common contact of the driver circuit chip is connected to an input voltage source; wherein the serial data input pad receives a first control signal, the serial data output pad outputs the first control signal, the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip emit light according to the first control signal. ### Claim 6 (depends on 5) The light-emitting diode device according to claim 5, wherein the driver circuit chip further has a serial clock input pad and a serial clock output pad; wherein the serial clock input pad receives a second control signal, the serial clock output pad outputs the second control signal, and the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip emit light according to the first control signal and the second control signal. ### Claim 7 (depends on 6) The light-emitting diode device according to claim 6, wherein one or more of the common contact of the driver circuit chip, the electrical contact pad, the serial data input pad, the serial data output pad, the serial clock input pad and the serial clock output pad are connected to external wires through bonding wires, through-silicon vias, or metal layers formed along sides of the driver circuit chip. ### Claim 8 (depends on 1) The light-emitting diode device according to claim 1, wherein the driver circuit chip has an electrical contact pad, a serial data input pad and a serial data output pad, the electrical contact pad is connected to an input voltage source, and the common contact of the driver circuit chip is grounded; wherein the serial data input pad receives a first control signal, the serial data output pad outputs the first control signal, and the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip emit light according to the first control signal. ### Claim 9 (depends on 8) The light-emitting diode device according to claim 8, wherein the driver circuit chip further has a serial clock input pad and a serial clock output pad; wherein the serial clock input pad receives a second control signal, the serial clock output pad outputs the second control signal, and the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip emit light according to the first control signal and the second control signal. ### Claim 10 (depends on 9) The light-emitting diode device according to claim 9, wherein one or more of the common contact of the driver circuit chip, the electrical contact pad, the serial data input pad, the serial data output pad, the serial clock input pad and the serial clock output pad are connected to external wires through bonding wires, through-silicon vias, or metal layers formed along sides of the driver circuit chip. ### Claim 11 (depends on 1) The light-emitting diode device according to claim 1, wherein the driver circuit chip has an input power pad, a ground pad, a serial data input pad and a serial data output pad, the input power pad is connected to an input voltage source, the ground pad is grounded, and the common contact of the driver circuit chip is connected to the input power pad; wherein the serial data input pad receives a first control signal, the serial data output pad outputs the first control signal, and the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip emit light according to the first control signal. ### Claim 12 (depends on 11) The light-emitting diode device according to claim 11, wherein the driver circuit chip further has a serial clock input pad and a serial clock output pad; wherein the serial clock input pad receives a second control signal, the serial clock output pad outputs the second control signal, and the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip emit light according to the first control signal and the second control signal. ### Claim 13 (depends on 12) The light-emitting diode device according to claim 12, wherein one or more of the common contact of the driver circuit chip, the input power pad, the ground pad, the serial data input pad, the serial data output pad, the serial clock input pad and the serial clock output pad are connected to external wires through bonding wires, through-silicon vias, or metal layers formed along sides of the driver circuit chip. ### Claim 14 (depends on 1) The light-emitting diode device according to claim 1, wherein the driver circuit chip has an input power pad, a ground pad, a serial data input pad and a serial data output pad, the input power pad is connected to an input voltage source, the ground pad is grounded, and the common contact of the driver circuit chip is connected to the ground pad; wherein the serial data input pad receives a first control signal, the serial data output pad outputs the first control signal, and the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip emit light according to the first control signal. ### Claim 15 (depends on 14) The light-emitting diode device according to claim 14, wherein the driver circuit chip further has a serial clock input pad and a serial clock output pad; wherein the serial clock input pad receives a second control signal, the serial clock output pad outputs the second control signal, the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip emit light according to the first control signal and the second control signal. ### Claim 16 (depends on 15) The light-emitting diode device according to claim 15, wherein one or more of the common contact of the driver circuit chip, the input power pad, the ground pad, the serial data input pad, the serial data output pad, the serial clock input pad and the serial clock output pad are connected to external wires through bonding wires, through-silicon vias, or metal layers formed along sides of the driver circuit chip. ### Claim 17 A light-emitting diode device with a driving mechanism, comprising: a light-emitting diode package including a first light-emitting diode chip, a second light-emitting diode chip, a third light-emitting diode chip and an encapsulation layer, wherein the first light-emitting diode chip is configured to emit red light, the second light-emitting diode chip is configured to emit green light, and the third light-emitting diode chip is configured to emit blue light; and a driver circuit chip being in direct electrical contact with the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip, and configured to drive the first light-emitting diode chip to emit the red light, the second light-emitting diode chip to emit the green light and the third light-emitting diode chip to emit the blue light; wherein the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip are disposed on the driver circuit chip; wherein a first contact of the first light-emitting diode chip is in direct electrical contact with a first output contact of the driver circuit chip, a first contact of the second light-emitting diode chip is in direct electrical contact with a second output contact of the driver circuit chip, and a first contact of the third light-emitting diode chip is in direct electrical contact with a third output contact of the driver circuit chip; wherein a common contact of a second contact of the first light-emitting diode chip, a second contact of the second light-emitting diode chip and a second contact of the third light-emitting diode chip is in direct electrical contact with a common contact of the driver circuit chip.