# US 11,309,288 B2 · Electronic system, die assembly and device die

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- Number: US 11,309,288 B2
- Document ID: US11309288B2
- Status: Granted
- Kind: B2
- Application number: 16/843,411
- Filed: 2020-04-08
- Published: 2021-10-14
- Granted: 2022-04-19
- Earliest claimed: 2020-04-08
- Assignees: Nanya Technology Corporation
- Applicants: Nanya Technology Corporation
- Inventors: Wu-Der Yang
- Web page: https://patentgrep.com/patent/US11309288B2

## CPC

- H10W 90/00: Package configurations
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/30: Die-attach connectors
- H10W 72/50: Bond wires
- H10W 72/90: Bond pads, in general
- H10W 72/073: {of die-attach connectors}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/075: {of bond wires}
- H10W 72/354: {comprising polymers}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/923: {Bond pads having multiple stacked layers}
- H10W 72/9445: {Top-view layouts, e.g. mirror arrays}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/24: at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/752: {between stacked chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present disclosure provides a device die, a die assembly and an electronic system. The device die includes a package and a plurality of transfer pads disposed on a functional surface of the package. The transfer pads are divided into a plurality of segments electrically isolated from each other. In an adjacent pair of transfer pads, there is only one electrical connection between the transfer pads, comprising one segment in one transfer pad electrically connected to one segment in the other transfer pad. The die assembly includes a pair of device dies stacked in a stepped configuration. The electronic system includes a supporting member having at least one metallic layer, and a plurality of device dies disposed on the supporting member and mechanically and electrically coupled to the metallic layer by a plurality of conductive strings.

## Claims

### Claim 1

A device die, comprising:
a package having a functional surface; and
a pair of transfer pads disposed on the functional surface, wherein the transfer pads are divided into a plurality of segments electrically isolated from each other; and
at least one conductive trace disposed on the functional surface to mechanically and electrically connect one segment in one transfer pad to one segment in another transfer pad.

### Claim 2 (depends on 1)

The device die of claim 1, wherein the transfer pad comprises complimentary-shaped segments that mate with one another.

### Claim 3 (depends on 1)

The device die of claim 1, wherein each of the pair of transfer pads comprises a cut-out segment and an interlocking segment electrically isolated from the cut-out segment; the at least conductive trace electrically connects the pair of transfer pads, wherein the cut-out segment in one of the pair of transfer pads is electrically connected to the interlocking segment in another of the pair of transfer pads through the at least one conductive trace.

### Claim 4 (depends on 1)

The device die of claim 1, wherein the areas of the segments of all the transfer pads are the same.

### Claim 5 (depends on 1)

The device die of claim 1, further comprising at least one contact pad disposed on the functional surface and located close to one edge of the package, wherein the transfer pads are aligned with the contact pad.

### Claim 6

A die assembly, comprising:
a pair of device dies stacked in a stepped configuration, wherein at least one of the device dies comprises:
a package having a functional surface;
a pair of transfer pads disposed on the functional surface of the package, wherein the transfer pads are divided into a plurality of segments electrically isolated from each other; and
at least one conductive trace disposed on the functional surface of the package to mechanically and electrically connect one segment in one transfer pad to one segment in another transfer pad,
wherein the device dies are mechanically and electrically coupled to each other by an interconnect comprising a wire attached to the segment of one of the transfer pads in two of the device dies by ball bonding.

### Claim 7 (depends on 6)

The die assembly of claim 6, wherein the transfer pad comprises complimentary-shaped segments that mate with one another.

### Claim 8 (depends on 6)

The die assembly of claim 6, wherein each of the pair of transfer pads comprises a cut-out segment and an interlocking segment electrically isolated from the cut-out segment; the conductive trace electrically connects the pair of transfer pads, wherein the cut-out segment in one of the pair of transfer pads is electrically connected to the interlocking segment in another of the pair of transfer pads through the at least one conductive trace.

### Claim 9 (depends on 6)

The die assembly of claim 6, wherein the areas of the segments of all of the transfer pads are the same.

### Claim 10 (depends on 6)

The die assembly of claim 6, wherein at least one of the device dies further comprises at least one contact pad disposed on the functional surface and located close to one edge of the package, wherein the transfer pads are aligned with the contact pad.

### Claim 11 (depends on 6)

The die assembly of claim 6, wherein the device dies are arranged in a stepped configuration.

### Claim 12

An electronic system, comprising:
a supporting member comprising at least one metallic layer; and
a plurality of device dies disposed on the supporting member and mechanically and electrically coupled to the metallic layer by a plurality of conductive strings, wherein at least one device die comprises:
a package having a functional surface; and
a pair of transfer pads disposed on the functional surface of the package, wherein the transfer pads are divided into a plurality of segments electrically isolated from each other; and
at least one conductive trace disposed on the functional surface of the package to mechanically and electrically connect one segment in one transfer pad to one segment in another transfer pad,
wherein the device dies are mechanically and electrically coupled to each other by interconnects comprising a wire attached to one of the transfer pads in two of the device dies by ball bonding.

### Claim 13 (depends on 12)

The electronic system of claim 12, wherein the conductive string is attached to the contact pad and the metallic layer by stitch bonding.

### Claim 14 (depends on 12)

The electronic system of claim 12, wherein the transfer pad comprises complimentary-shaped segments that mate with one another.

### Claim 15 (depends on 12)

The electronic system of claim 12, wherein each of the pair of transfer pads comprises a cut-out segment and an interlocking segment electrically isolated from the cut-out segment; the conductive trace electrically connects the pair of transfer pads, wherein the cut-out segment in one of the pair of transfer pads is electrically connected to the interlocking segment in another of the pair of transfer pads through the at least one conductive trace.

### Claim 16 (depends on 12)

The electronic system of claim 12, wherein the areas of the segments of all the transfer pads are the same.

### Claim 17 (depends on 12)

The electronic system of claim 12, further comprising at least one contact pad disposed on the functional surface and located close to one edge of the package, wherein the transfer pads are aligned with the contact pad.

### Claim 18 (depends on 17)

The electronic system of claim 17, wherein one of the device dies is mechanically and electrically coupled to the supporting member by the conductive strings in contact with the metallic layer and the contact pad.