# US 11,309,282 B2 · Method for manufacturing a semiconductor package having five-side protection

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- Number: US 11,309,282 B2
- Document ID: US11309282B2
- Status: Granted
- Kind: B2
- Application number: 17/012,295
- Filed: 2020-09-04
- Published: 2020-12-24
- Granted: 2022-04-19
- Earliest claimed: 2018-10-22
- Assignees: Nanya Technology Corporation
- Applicants: Nanya Technology Corporation
- Inventors: Hsih-Yang Chiu
- Web page: https://patentgrep.com/patent/US11309282B2

## CPC

- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 90/00: Package configurations
- H10D 62/117: {Shapes of semiconductor bodies}
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- H10W 72/073: {of die-attach connectors}
- H10W 72/30: Die-attach connectors
- H10W 74/014: {using batch processing}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10W 72/0198: {batch processes}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

The present disclosure provides a method for manufacturing a semiconductor package. The method includes steps of providing semiconductor wafer having a plurality of device chips disposed thereon, wherein each of the plurality of device chips has an active area and an inactive area arranged around the active area; forming a plurality of the openings, wherein each of the plurality of openings is formed in a back surface of the semiconductor wafer and forms an opening into the inactive area; and disposing a protecting material within the openings and over the back surface of the semiconductor wafer.

## Claims

### Claim 1

A method for manufacturing a semiconductor package, comprising:
providing a device chip, wherein the device chip has an active area and an inactive area arranged around the active area;
forming an opening within the inactive area in a lower surface of the device chip;
disposing a protecting material within the opening and over the lower surface of the device chip;
providing a carrier and an adhesive layer disposed over the carrier;
flipping the device chip upside down before forming the openings, so that front sides of the device chips face the adhesive layer and are in contact with the adhesive layer; and
removing the carrier and the adhesive layer after disposing the protecting layer within the opening and over the lower surface of the device chip.

### Claim 2 (depends on 1)

The method of claim 1, wherein the active area is exposed to the opening.

### Claim 3 (depends on 1)

The method of claim 1, wherein the protecting material encapsulates the active area of the device chip.

### Claim 4 (depends on 1)

The method of claim 1, wherein the adhesive layer is exposed to the opening.

### Claim 5 (depends on 1)

The method of claim 1, wherein the protecting material comprises:
a first portion disposed within the device chip in the inactive area and encircling the active area, wherein the first portion of the protecting material is interfaced between the device chip in the active area and the device chip in the inactive area; and
a second portion disposed over a lower surface of the device chip and in contact with the first portion.

### Claim 6

A method for manufacturing a semiconductor package assembly, comprising:
providing a semiconductor wafer having a plurality of device chips disposed thereon, wherein each of the plurality of device chips has an active area and an inactive area arranged around the active area;
forming a plurality of the openings, wherein each of the plurality of openings is formed in a back surface of the semiconductor wafer and forms an opening into the inactive area;
disposing a protecting material within the openings and over the back surface of the semiconductor wafer;
providing a carrier and an adhesive layer disposed over the carrier;
flipping the semiconductor wafer having the device chip disposed thereon upside down before forming the openings, so that front sides of the device chips face the adhesive layer and are in contact with the adhesive layer; and
removing the carrier and the adhesive layer after disposing the protecting layer within the opening and over the lower surface of the device chip.

### Claim 7 (depends on 6)

The method of claim 6, wherein the active area is exposed to each of the plurality of openings.

### Claim 8 (depends on 6)

The method of claim 6, wherein the protecting material encircles the active area.

### Claim 9 (depends on 6)

The method of claim 6, wherein the adhesive layer is exposed to the opening.

### Claim 10 (depends on 6)

The method of claim 6, wherein the protecting material comprises:
a first portion disposed within the device chip in the inactive area and encircling the active area, wherein the first portion of the protecting material is interfaced between the device chip in the active area and the device chip in the inactive area; and
a second portion disposed over a lower surface of the device chip and in contact with the first portion.

### Claim 11 (depends on 10)

The method of claim 10, wherein the second portion fully covers the back surface.