# US 11,309,274 B2 · Electronic module

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- Number: US 11,309,274 B2
- Document ID: US11309274B2
- Status: Granted
- Kind: B2
- Application number: 16/757,713
- Filed: 2017-11-10
- Published: 2021-07-01
- Granted: 2022-04-19
- Earliest claimed: 2017-11-10
- Assignees: Shindengen Electric Manufacturing Co., Ltd.
- Applicants: Shindengen Electric Manufacturing Co., Ltd.
- Inventors: Yoshihiro Kamiyama
- Web page: https://patentgrep.com/patent/US11309274B2

## CPC

- H10W 70/466: {Tape carriers or flat leads}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 70/415: {Leadframe inner leads serving as die pads}
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 72/00: Interconnections or connectors in packages
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 90/00: Package configurations
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W 70/427: {Bent parts}
- H10W 70/429: {being the outer leads}
- H10W 72/076: {of strap connectors}
- H10W 72/07636: {Soldering or alloying}
- H10W 72/07652: {changes in structures or sizes}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/387: {Flow barriers}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 72/621: {Structures or relative sizes of strap connectors}
- H10W 72/627: {Multiple strap connectors having different structures or shapes}
- H10W 72/631: {Shapes of strap connectors}
- H10W 72/634: {Cross-sectional shape}
- H10W 72/642: {being orthogonal to a side surface of the chip, e.g. in parallel arrangements}
- H10W 72/646: {the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector}
- H10W 72/647: {Dispositions of multiple strap connectors}
- H10W 72/652: {comprising metals or metalloids, e.g. silver}
- H10W 72/681: {Auxiliary members, e.g. flow barriers}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/10: characterised by their shape or disposition
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/767: {between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic module has a sealing part 90; a rear surface-exposed conductor 10, 20, 30 having a rear surface-exposed part 12, 22, 32 whose rear surface is exposed; a rear surface-unexposed conductor 40, 50 whose rear surface is not exposed; an electronic element 15, 25, which is provided in the sealing part 90 and provided on a front surface of the rear surface-exposed conductor 40, 50; a first connector 60 for electrically connecting the electronic element 15, 25 with the rear surface-exposed conductor 10, 20, 30; and a second connector 70 for electrically connecting the electronic element 15, 25 with the rear surface-unexposed conductor 40, 50. A thickness T1 of the first connector 60 is thicker than a thickness T2 of the second connector 70.

## Claims

### Claim 1

An electronic module comprising:
a sealing part;
a rear surface-exposed conductor having a rear surface-exposed part with rear surface exposed;
a rear surface-unexposed conductor with rear surface not exposed;
an electronic element, provided in the sealing part and on a front surface of the rear surface-exposed conductor;
a first connector electrically connecting the electronic element with another rear surface-exposed conductor; and
a second connector electrically connecting the electronic element with the rear surface-unexposed conductor,
wherein a thickness throughout the whole first connector is thicker than a thickness of the second connector.

### Claim 2 (depends on 1)

The electronic module according to claim 1, wherein
the thickness of the first connector is thinner than a thickness of the rear surface-exposed conductor and a thickness of the rear surface-unexposed conductor.

### Claim 3 (depends on 1)

The electronic module according to claim 1, wherein
the thickness of the first connector is 1.2 times or more and 1.5 times or less than the thickness of the second connector.

### Claim 4 (depends on 1)

The electronic module according to claim 1, wherein
the first connector has a first connection base end part and a first connection tip end part, and
a hole is provided in each of the first connection base end part and the first connection tip end part.

### Claim 5 (depends on 1)

The electronic module according to claim 1, wherein
the second connector has a second connection base end part and a second connection tip end part, and
a width of the second connection base end part is larger than a width of the second connection tip end part.

### Claim 6 (depends on 1)

The electronic module according to claim 1, further comprising a fastening member insertion part provided at a peripheral part of the sealing part and configured to insert a fastening member, wherein
the rear surface-exposed conductor has a peripheral rear surface-exposed conductor and an inner rear surface-exposed conductor provided at a position farther from the fastening member insertion part than the peripheral rear surface-exposed conductor, and
an area of the rear surface-exposed part of the peripheral rear surface-exposed conductor is smaller than an area of the rear surface-exposed part of the inner rear surface-exposed conductor.

### Claim 7 (depends on 6)

The electronic module according to claim 6, wherein
a pair of fastening member insertion parts is provided, and
in comparison with the area of the rear surface-exposed part of the inner rear surface-exposed conductor, a reduction amount of the rear surface-exposed part of the peripheral rear surface-exposed conductor on one side is larger than a reduction amount of the rear surface-exposed part of the peripheral rear surface-exposed conductor on the other side.

### Claim 8

An electronic module comprising:
a sealing part;
a rear surface-exposed conductor having a rear surface-exposed part with rear surface exposed;
a rear surface-unexposed conductor with rear surface not exposed;
an electronic element, provided in the sealing part and on a front surface of the rear surface-exposed conductor;
a first connector for electrically connecting the electronic element with another rear surface-exposed conductor; and
a second connector for electrically connecting the electronic element with the rear surface-unexposed conductor, wherein
a thickness of the first connector is thicker than a thickness of the second connector,
the second connector has a second connection base end part and a second connection tip end part,
a width of the second connection base end part is larger than a width of the second connection tip end part,
the second connection base end part is provided with a hole, and
the second connection tip end part is not provided with a hole.

### Claim 9 (depends on 8)

The electronic module according to claim 8, further comprising a fastening member insertion part provided at a peripheral part of the sealing part and configured to insert a fastening member, wherein
the rear surface-exposed conductor has a peripheral rear surface-exposed conductor and an inner rear surface-exposed conductor provided at a position farther from the fastening member insertion part than the peripheral rear surface-exposed conductor, and
an area of the rear surface-exposed part of the peripheral rear surface-exposed conductor is smaller than an area of the rear surface-exposed part of the inner rear surface-exposed conductor.

### Claim 10 (depends on 9)

The electronic module according to claim 9, wherein
a pair of fastening member insertion parts is provided, and
in comparison with the area of the rear surface-exposed part of the inner rear surface-exposed conductor, a reduction amount of the rear surface-exposed part of the peripheral rear surface-exposed conductor on one side is larger than a reduction amount of the rear surface-exposed part of the peripheral rear surface-exposed conductor on the other side.

### Claim 11

An electronic module comprising:
a sealing part;
a rear surface-exposed conductor having a rear surface-exposed part with rear surface exposed;
a rear surface-unexposed conductor with rear surface not exposed;
an electronic element, provided in the sealing part and on a front surface of the rear surface-exposed conductor;
a first connector for electrically connecting the electronic element with another rear surface-exposed conductor; and
a second connector for electrically connecting the electronic element with the rear surface-unexposed conductor, wherein
a thickness of the first connector is thicker than a thickness of the second connector,
the rear surface-exposed conductor has a terminal part protruding outwardly from a side surface of the sealing part, and a connected part provided between the rear surface-exposed part and the terminal part and whose rear surface is not exposed, and
a thickness of the connected part is thinner than a thickness of the rear surface-exposed part and a thickness of the terminal part.

### Claim 12 (depends on 11)

The electronic module according to claim 11, further comprising a fastening member insertion part provided at a peripheral part of the sealing part and configured to insert a fastening member, wherein
the rear surface-exposed conductor has a peripheral rear surface-exposed conductor and an inner rear surface-exposed conductor provided at a position farther from the fastening member insertion part than the peripheral rear surface-exposed conductor, and
an area of the rear surface-exposed part of the peripheral rear surface-exposed conductor is smaller than an area of the rear surface-exposed part of the inner rear surface-exposed conductor.

### Claim 13 (depends on 12)

The electronic module according to claim 12, wherein
a pair of fastening member insertion parts is provided, and
in comparison with the area of the rear surface-exposed part of the inner rear surface-exposed conductor, a reduction amount of the rear surface-exposed part of the peripheral rear surface-exposed conductor on one side is larger than a reduction amount of the rear surface-exposed part of the peripheral rear surface-exposed conductor on the other side.