# US 11,309,273 B2 · Electronic module

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- Number: US 11,309,273 B2
- Document ID: US11309273B2
- Status: Granted
- Kind: B2
- Application number: 16/060,279
- Filed: 2017-05-19
- Published: 2021-06-10
- Granted: 2022-04-19
- Earliest claimed: 2017-05-19
- Assignees: Shindengen Electric Manufacturing Co., Ltd.
- Applicants: Shindengen Electric Manufacturing Co., Ltd.
- Inventors: Kosuke Ikeda; Osamu Matsuzaki
- Web page: https://patentgrep.com/patent/US11309273B2

## CPC

- H10W 90/811: {Multiple chips on leadframes}
- H10W 70/427: {Bent parts}
- H10W 70/442: {of multiple leadframes in a single chip}
- H10W 70/461: {specially adapted for cooling}
- H10W 70/464: {Additional interconnections in combination with leadframes}
- H10W 70/466: {Tape carriers or flat leads}
- H10W 90/00: Package configurations
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 70/611: {for connecting multiple chips together}
- H10W 72/07354: {changes in dispositions}
- H10W 72/076: {of strap connectors}
- H10W 72/07633: {Ultrasonic bonding, e.g. thermosonic bonding}
- H10W 72/07636: {Soldering or alloying}
- H10W 72/07637: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/07653: {changes in shapes}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 72/631: {Shapes of strap connectors}
- H10W 72/634: {Cross-sectional shape}
- H10W 72/646: {the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector}
- H10W 72/647: {Dispositions of multiple strap connectors}
- H10W 72/868: {Die-attach connectors and strap connectors}
- H10W 72/886: {Die-attach connectors and strap connectors}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 72/931: {Shapes of bond pads}
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/764: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic module has a first substrate 11, a first electronic element 13 provided on one side of the first substrate 11, a first connection body 60 provided on one side of the first electronic element 13, a second electronic element 23 provided on one side of the first connection body 60, a second substrate 21 provided on one side of the second electronic element 23, and an abutment body 250 that abuts on a face on one side of the second electronic element 23 and is capable of imparting a force toward one side with respect to the second substrate 21.

## Claims

### Claim 1

An electronic module comprising:
a first substrate;
a first conductor layer provided on one side of the first substrate;
a first electronic element provided on one side of the first conductor layer;
a first connection body, being different from adhesive, provided on one side of the first electronic element and having a first head part and a first pillar part extending from the first head part to the other side;
a second electronic element provided on one side of the first connection body;
a second substrate provided on one side of the second electronic element and being a flat plate larger than the first electronic element and the second electronic element in plane;
a second conductor layer provided on the other side of the second substrate; and
an abutment body that has an abutment proximal end part that abuts on a face on one side of the second electronic element, a second-substrate-side abutment part that extends from the abutment proximal end part toward one side and abuts directly on the second conductor layer or the second substrate, and a first-substrate-side abutment part that extends from the second-substrate-side abutment part to the other side and abuts on the first conductor layer or the first substrate, and is capable of imparting a force toward one side with respect to the second substrate,
wherein the abutment body electrically connects the second electronic element and a terminal part which is connectable to an external device.

### Claim 2

An electronic module comprising:
a first substrate that is a metal substrate;
a first electronic element provided on one side of the first substrate;
a first connection body, being different from adhesive, provided on one side of the first electronic element and having a first head part and a first pillar part extending from the first head part to the other side;
a second electronic element provided on one side of the first connection body;
a second substrate provided on one side of the second electronic element, and being a metal substrate and being a metal substrate being a flat plate larger than the first electronic element and the second electronic element in plane; and
an abutment body that has an abutment proximal end part that abuts on a face on one side of the second electronic element, a second-substrate-side abutment part that extends from the abutment proximal end part toward one side and abuts directly on the second substrate, and a first-substrate-side abutment part that extends from the second-substrate-side abutment part to the other side and abuts on the first substrate, and is capable of imparting a force toward one side with respect to the second substrate,
wherein the abutment body electrically connects the second electronic element and a terminal part which is connectable to an external device.

### Claim 3 (depends on 1)

The electronic module according to claim 1, wherein
the second-substrate-side abutment part has a first convex part protruding to one side, and
the second-substrate-side abutment part abuts on the second conductor layer or the second substrate via conductive adhesive.

### Claim 4 (depends on 1)

The electronic module according to claim 1, wherein
the abutment body has a plurality of leg parts extending to the other side in addition to the first-substrate-side abutment part; and
the plurality of leg parts are configured to abut on the first conductor layer or the first substrate.

### Claim 5 (depends on 4)

The electronic module according to claim 4, wherein
an area where the plurality of leg parts abut on the first conductor layer or the first substrate is smaller than an area of the first-substrate-side abutment part abuts on the first conductor layer or the first substrate.