# US 11,309,270 B2 · Anisotropic conductive film and production method of the same

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- Number: US 11,309,270 B2
- Document ID: US11309270B2
- Status: Granted
- Kind: B2
- Application number: 15/115,771
- Filed: 2015-02-04
- Published: 2017-01-12
- Granted: 2022-04-19
- Earliest claimed: 2014-02-04
- Assignees: Dexerials Corporation
- Applicants: Dexerials Corporation
- Inventors: Reiji Tsukao; Yasushi Akutsu
- Web page: https://patentgrep.com/patent/US11309270B2

## CPC

- B32B 5/30: one layer {being formed of particles, e.g. chips,} granules, powder
- B32B 3/00: Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B 3/30: characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)}
- B32B 7/00: Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B 7/02: Physical, chemical or physicochemical properties
- B32B 7/04: Interconnection of layers
- B32B 27/00: Layered products comprising {a layer of} synthetic resin {(fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18)}
- B32B 27/06: as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)}
- B32B 27/08: of synthetic resin
- B32B 27/28: comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42}
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C09J 4/00: Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16}
- C09J 7/10: without carriers
- C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J 201/00: Adhesives based on unspecified macromolecular compounds
- H01R 4/04: using electrically conductive adhesives
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- B32B 2307/20: having particular electrical or magnetic properties, e.g. piezoelectric
- B32B 2307/202: Conductive
- B32B 2307/30: having particular thermal properties
- B32B 2307/302: Conductive
- B32B 2307/706: Anisotropic
- C08K 2201/001: Conductive additives
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/204: the adhesive coating being discontinuous
- C09J 2301/208: the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- C09J 2301/408: additives as essential feature of the adhesive layer
- C09J 2433/00: Presence of (meth)acrylic polymer
- C09J 2463/00: Presence of epoxy resin
- H10W 72/01304: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
- H10W 72/073: {of die-attach connectors}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/354: {comprising polymers}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

## Claims

### Claim 1

An anisotropic conductive film having a second connection layer layered on a surface of a first connection layer and a third connection layer layered on another surface of the first connection layer, wherein
the first connection layer is formed of a photopolymerized resin,
the second and third connection layers are each formed of a thermo-cationically or thermo-anionically polymerizable resin, a photo-cationically or photo-anionically polymerizable resin, a thermo-radically polymerizable resin, or a photo-radically polymerizable resin,
the third connection layer has a thickness of 3 μm,
the third connection layer is thinner than the first connection layer, and
the first connection layer has conductive particles for anisotropic conductive connection arranged in a single layer, the conductive particles being not embedded in the first connection layer.

### Claim 2 (depends on 1)

The anisotropic conductive film according to claim 1, wherein the first connection layer has a thickness of 6 μm to 1 μm.

### Claim 3 (depends on 1)

The anisotropic conductive film according to claim 1, wherein the third connection layer has a tack force larger than 3 kPa that is measured by a probe method.

### Claim 4 (depends on 1)

A connection structure in which a first electronic component and a second electronic component are connected by anisotropic conductive connection through the anisotropic conductive film according to claim 1.

### Claim 5 (depends on 1)

A method for manufacturing a connection structure comprising connecting a first electronic component to a second electronic component by anisotropic conductive connection through the anisotropic conductive film according to claim 1.

### Claim 6 (depends on 1)

The anisotropic conductive film according to claim 1, wherein in the first connection layer, a curing ratio in a region where the conductive particles are present is lower than a curing ratio in a region where the conductive particles are not present.

### Claim 7 (depends on 1)

The anisotropic conductive film according to claim 1, wherein the first connection layer is obtained by photo-radically polymerizing a photo-radically polymerizable resin layer containing an acrylate compound and a photo-radical polymerization initiator.

### Claim 8 (depends on 7)

The anisotropic conductive film according to claim 7, wherein the first connection layer includes the remaining acrylate compound and photo-radical polymerization initiator.

### Claim 9 (depends on 1)

The anisotropic conductive film according to claim 1, wherein the first connection layer contains an acrylate compound and a thermal radical polymerization initiator.

### Claim 10 (depends on 1)

The anisotropic conductive film according to claim 1, wherein the first connection layer contains an epoxy compound and a thermo-cationic or thermo-anionic polymerization initiator or a photo-cationic or photo-anionic polymerization initiator.

### Claim 11 (depends on 1)

The anisotropic conductive film according to claim 1, wherein the second connection layer is formed of a polymerizable resin containing an epoxy compound and a thermo-cationic or thermo-anionic polymerization initiator or a photo-cationic or photo-anionic polymerization initiator, or a polymerizable resin containing an acrylate compound and a thermo-radical or photo-radical polymerization initiator.

### Claim 12 (depends on 1)

The anisotropic conductive film according to claim 1, wherein the third connection layer is formed of a polymerizable resin containing an epoxy compound and a thermo-cationic or thermo-anionic polymerization initiator or a photo-cationic or photo-anionic polymerization initiator, or a polymerizable resin containing an acrylate compound and a thermo-radical or photo-radical polymerization initiator.