# US 11,309,260 B2 · Chip on film structure and display device

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- Number: US 11,309,260 B2
- Document ID: US11309260B2
- Status: Granted
- Kind: B2
- Application number: 16/615,180
- Filed: 2019-09-20
- Published: 2021-12-30
- Granted: 2022-04-19
- Earliest claimed: 2019-07-16
- Assignees: Huizhou China Star Optoelectronics Technology Co., Ltd.
- Applicants: Huizhou China Star Optoelectronics Technology Co., Ltd.
- Inventors: Xiaohua Li
- Web page: https://patentgrep.com/patent/US11309260B2

## CPC

- H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00)
- G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels}
- H10W 70/688: {Flexible insulating substrates}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 2201/10128: Display
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A chip on film structure and a display device including chip on film structure, the chip on film structure including a film substrate including a body area, a plurality of traces, and a bonding area at opposite ends of the film substrate; at least one chip, the chip disposed in the body area through bonding and electrically connected to the display panel through the plurality of traces and the bonding area; and a guiding member disposed at one end of the film substrate connected to the display panel and covering the bonding area.

## Claims

### Claim 1

A display device comprising a frame, a backlight module disposed in the frame, a display panel disposed above the backlight module and abutting the frame, a printed circuit board disposed on a side of the display panel away from the backlight module, and a chip on film structure connected to the printed circuit board and the display panel, wherein the chip on film structure comprises a film substrate, a chip disposed on a surface of the film substrate, and a guiding member disposed at an end of the film substrate connected to the display panel.

### Claim 2 (depends on 1)

The display device according to claim 1, wherein the film substrate further comprising a body area, a plurality of traces, and a bonding area positioned at opposite ends of the film substrate; wherein the chip is disposed in the body area through bonding and is electrically connected to the display panel through the plurality of traces and the bonding area, and the guiding member covers the bonding area, wherein the chip on film structure is configured to guide liquid through the guiding member, thereby preventing the liquid from flowing into the bonding area and the body area.

### Claim 3 (depends on 1)

The display device according to claim 1, wherein the guiding member is T-shaped.

### Claim 4 (depends on 3)

The display device according to claim 3, wherein a length of a top to a bottom of the T-shaped guiding member is less than ⅓ of a length of the film substrate.

### Claim 5 (depends on 3)

The display device according to claim 3, wherein a length of a top to a bottom of the T-shaped guiding member is greater than a length of a vertical portion of the film substrate after bending.

### Claim 6 (depends on 1)

The display device according to claim 1, wherein the guiding member and the film substrate are integrally bonded into one piece.

### Claim 7 (depends on 1)

The display device according to claim 1, wherein material of the guiding member is one selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, and polyarylate.

### Claim 8 (depends on 1)

The display device according to claim 1, wherein the display panel further comprises a color filter substrate, a thin film transistor array substrate, and a liquid crystal layer disposed therebetween.