# US 11,309,250 B2 · Electronic module

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- Number: US 11,309,250 B2
- Document ID: US11309250B2
- Status: Granted
- Kind: B2
- Application number: 16/962,492
- Filed: 2018-01-17
- Published: 2021-03-25
- Granted: 2022-04-19
- Earliest claimed: 2018-01-17
- Assignees: Shindengen Electric Manufacturing Co., Ltd.
- Applicants: Shindengen Electric Manufacturing Co., Ltd.
- Inventors: Kosuke Ikeda
- Web page: https://patentgrep.com/patent/US11309250B2

## CPC

- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H05K 3/00: Apparatus or processes for manufacturing printed circuits
- H05K 3/0011: {Working of insulating substrates or insulating layers}
- H10W 40/25: characterised by their materials
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 70/413: {Insulating or insulated substrates serving as die pads (H10W70/468 takes precedence)}
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 72/50: Bond wires
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 90/00: Package configurations
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/07354: {changes in dispositions}
- H10W 72/07637: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/763: {between laterally-adjacent chips}
- H10W 90/764: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An electronic module has a first substrate 11; an electronic element 13, 23 provided on one side of the first substrate 11; a sealing part 90 that seals at least the electronic element 13, 23; a connection terminal 110 electrically connected to the electronic element 13, 23 and exposed from a side surface of the sealing part 90; and a stress relaxation terminal 150, which is not electrically connected to the electronic element 13, 23, exposed from the side surface of the sealing part 90.

## Claims

### Claim 1

An electronic module comprising:
a first substrate;
an electronic element provided on one side of the first substrate;
a sealing part that seals at least the electronic element;
a connection terminal electrically connected to the electronic element and exposed from a side surface of the sealing part; and
a stress relaxation terminal, which is not electrically connected to the electronic element, exposed from the side surface of the sealing part, wherein
the connection terminal has a control terminal for inputting a control signal to the electronic element.

### Claim 2 (depends on 1)

The electronic module according to claim 1, wherein
the connection terminal has a power terminal for supplying power to the electronic element and
a width of the stress relaxation terminal is narrower than a width of the power terminal.

### Claim 3 (depends on 1)

The electronic module according to claim 1, wherein
the electronic element has a first electronic element and a second electronic element provided on one side of the first electronic element,
the stress relaxation terminal is not electrically connected to the first electronic element and the second electronic element.

### Claim 4 (depends on 3)

The electronic module, according to claim 3, further comprising:
a second conductor layer provided on one side of the second electronic element; and
a second substrate provided on one side of the second conductor layer, wherein
the stress relaxation terminal has a stress relaxation terminal base end part provided on the second conductor layer, a stress relaxation terminal outer part at least a portion of which is exposed from the sealing part, and a stress relaxation terminal bent part provided between the stress relaxation terminal base end part and the stress relaxation terminal outer part and bent toward one side at a side of the stress relaxation terminal base end part.

### Claim 5 (depends on 4)

The electronic module according to claim 4,
a non-connected conductor layer that is not electrically connected to the first electronic element and the second electronic element is provided on one side of the first substrate.

### Claim 6 (depends on 1)

The electronic module according to claim 1, wherein
the connection terminal has a plurality of power terminals for supplying power to a first electronic element or a second electronic element, and
at least one power terminal has a power terminal base end part electrically connected to a second conductor layer, a power terminal outer part at least a portion of which is exposed from the sealing part, and a power terminal bent part provided between the power terminal base end part and the power terminal outer part and bent toward one side at a side of the power terminal base end part.

### Claim 7 (depends on 1)

The electronic module according to claim 1, wherein
the connection terminal has a power terminal for supplying power to a first electronic element or a second electronic element, and
the stress relaxation terminal is provided at a peripherally outer side of the power terminal in a plane direction.

### Claim 8 (depends on 1)

The electronic module according to claim 1, wherein
the connection terminal has a plurality of control terminals for inputting a control signal to a first electronic element or a second electronic element,
the stress relaxation terminal goes beyond in an in-plane direction a first side surface or a second side surface, which is a side surface in an opposite side of the first side surface, of the first substrate, and extends to a peripheral outside of the first substrate,
the first substrate has a third side surface and a fourth side surface extending between the first side surface and the second side surface,
at least one of the control terminals goes beyond in an in-plane direction the third side surface or the fourth side surface of the first substrate, and extends to a peripheral outside of the first substrate.