# US 11,309,233 B2 · Power semiconductor package having integrated inductor, resistor and capacitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,233 B2 - Document ID: US11309233B2 - Status: Granted - Kind: B2 - Application number: 16/801,023 - Filed: 2020-02-25 - Published: 2021-03-18 - Granted: 2022-04-19 - Earliest claimed: 2019-09-18 - Assignees: Alpha and Omega Semiconductor (Cayman) Ltd. - Applicants: Alpha and Omega Semiconductor (Cayman), Ltd. - Inventors: Xiaotian Zhang; Mary Jane R. Alin; Bo Chen; David Brian Oraboni, Jr.; Long-Ching Wang; Jian Yin - Web page: https://patentgrep.com/patent/US11309233B2 ## CPC - H10W 70/40: Leadframes - H10W 90/811: {Multiple chips on leadframes} - H10W 70/411: {Chip-supporting parts, e.g. die pads} - H10W 70/427: {Bent parts} - H10W 70/465: {Bumps or wires} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/00: Package configurations - H10W 72/07552: {changes in structures or sizes} - H10W 72/07554: {changes in dispositions} - H10W 72/527: {Multiple bond wires having different sizes} - H10W 72/547: {Dispositions of multiple bond wires} - H10W 72/5473: {multiple bond wires connected to a common bond pad} - H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/884: {Die-attach connectors and bond wires} - H10W 72/926: {Multiple bond pads having different sizes} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/753: {between laterally-adjacent chips} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A power semiconductor package comprises a lead frame, a low side field-effect transistor (FET), a high side FET, a capacitor, a resistor, an inductor assembly, a first plurality of bonding wires, and a molding encapsulation. In one example, an entirety of the inductor assembly is disposed at a position higher than an entirety of the low side FET, higher than an entirety of the high side FET, and higher than an entirety of the first plurality of bonding wires. In another example, a bottom surface of the low side FET and a bottom surface of the inductor assembly are co-planar. ## Claims ### Claim 1 A power semiconductor package comprising: a lead frame comprising a first die paddle; and a second die paddle; a first lead comprising a first elevated section comprising a first end paddle; a second lead comprising a second elevated section comprising a second end paddle, wherein the first end paddle and the second end paddle being disposed higher than the first die paddle and the second die paddle; a low side field-effect transistor (FET) having a bottom surface drain electrode attached to the first die paddle, the low side FET comprising a source electrode and a gate electrode on a top surface of the low side FET; a high side FET having a bottom surface drain electrode attached to the second die paddle, the high side FET comprising a source electrode and a gate electrode on a top surface of the high side FET; a first plurality of bonding wires connecting the top surface source electrode of the high side FET to the first die paddle; an inductor assembly comprising a first terminal and a second terminal, the first terminal stacking on the first end paddle and the second terminal stacking on the second end paddle; a first conductive material comprising a top surface directly attached to the inductor assembly; and a bottom surface directly attached to the first end paddle; a second conductive material comprising a top surface directly attached to the inductor assembly; and a bottom surface directly attached to the second end paddle; and a molding encapsulation enclosing the low side FET, the high side FET, the first plurality of bonding wires, the inductor assembly, a majority portion of the first lead, a majority portion of the second lead, and a majority portion of the lead frame. ### Claim 2 (depends on 1) The power semiconductor package of claim 1, wherein the first end paddle is adjacent the first die paddle and the second die paddle; and wherein the second end paddle is adjacent the first die paddle and the second die paddle. ### Claim 3 (depends on 2) The power semiconductor package of claim 2, wherein the first elevated section of the first lead is electrically and mechanically connected to the inductor assembly by the first conductive material; wherein the second elevated section of the second lead is electrically and mechanically connected to the inductor assembly by the second conductive material; wherein a top surface of the first elevated section of the first lead is parallel to a bottom surface of the inductor assembly; and wherein a top surface of the second elevated section of the second lead is parallel to the bottom surface of the inductor assembly. ### Claim 4 (depends on 3) The power semiconductor package of claim 3, wherein each of the first conductive material and the second conductive material comprises a powder metallurgy material. ### Claim 5 (depends on 3) The power semiconductor package of claim 3, wherein each of the first conductive material and the second conductive material comprises an elastomer material. ### Claim 6 (depends on 3) The power semiconductor package of claim 3, wherein a bottom surface of the lead frame is exposed from the molding encapsulation. ### Claim 7 (depends on 3) The power semiconductor package of claim 3 further comprising an integrated circuit (IC) mounted on the second die paddle, wherein a second plurality of bonding wires connect the IC to a plurality of leads of the lead frame. ### Claim 8 (depends on 7) The power semiconductor package of claim 7, wherein the molding encapsulation encloses the IC. ### Claim 9 (depends on 1) The power semiconductor package of claim 1, wherein a height of the first elevated section is at least two hundred and fifty microns above the first die paddle and the second die paddle. ### Claim 10 A power semiconductor package comprising: a lead frame comprising a first die paddle; a second die paddle; and a first end paddle; a low side field-effect transistor (FET) having a bottom surface drain electrode attached to the first die paddle, the low side FET comprising a source electrode and a gate electrode on a top surface of the low side FET; a high side FET having a bottom surface drain electrode attached to the second die paddle, the high side FET comprising a source electrode and a gate electrode on a top surface of the high side FET; a first plurality of bonding wires connecting the source electrode of the high side FET to the first die paddle; an inductor assembly, a first terminal of the inductor assembly being attached to the second die paddle, and a second terminal of the inductor assembly being attached to the first end paddle; a first conductive material comprising a top surface directly attached to the first terminal of the inductor assembly; and a bottom surface directly attached to the first die paddle; a second conductive material comprising a top surface directly attached to the second terminal of the inductor assembly; and a bottom surface directly attached to the first end paddle; and a molding encapsulation enclosing the low side FET, the high side FET, the first plurality of bonding wires, the inductor assembly, and a majority portion of the lead frame. ### Claim 11 (depends on 10) The power semiconductor package of claim 10, wherein a bottom surface of the low side FET and a bottom surface of the inductor assembly are co-planar. ### Claim 12 (depends on 10) The power semiconductor package of claim 10, wherein the first terminal of the inductor assembly is electrically and mechanically connected to the first die paddle by the first conductive material; and wherein the second terminal of the inductor assembly is electrically and mechanically connected to the first end paddle by the second conductive material. ### Claim 13 (depends on 12) The power semiconductor package of claim 12, wherein each of the first conductive material and the second conductive material comprises a powder metallurgy material. ### Claim 14 (depends on 12) The power semiconductor package of claim 12, wherein each of the first conductive material and the second conductive material comprises an elastomer material. ### Claim 15 (depends on 12) The power semiconductor package of claim 12, wherein a bottom surface of the lead frame is exposed from the molding encapsulation. ### Claim 16 (depends on 12) The power semiconductor package of claim 12, further comprising an integrated circuit (IC) mounted on the first die paddle, wherein a second plurality of bonding wires connect the IC to a plurality of leads of the lead frame. ### Claim 17 (depends on 16) The power semiconductor package of claim 16, wherein the molding encapsulation encloses the IC. ### Claim 18 A power semiconductor package comprising: a lead frame comprising a first die paddle; and a second die paddle; a first lead comprising a first elevated section comprising a first end paddle; a second lead comprising a second elevated section comprising a second end paddle, wherein the first end paddle and the second end paddle being disposed higher than the first die paddle and the second die paddle; a low side field-effect transistor (FET) having a bottom surface drain electrode attached to the first die paddle, the low side FET comprising a source electrode and a gate electrode on a top surface of the low side FET; a high side FET having a bottom surface drain electrode attached to the second die paddle, the high side FET comprising a source electrode and a gate electrode on a top surface of the high side FET; a first plurality of bonding wires connecting the top surface source electrode of the high side FET to the first die paddle; an inductor assembly comprising a first terminal and a second terminal, the first terminal stacking on the first end paddle and the second terminal stacking on the second end paddle; a first conductive material comprising a top surface directly attached to the inductor assembly; and a bottom surface directly attached to the first end paddle; a second conductive material comprising a top surface directly attached to the inductor assembly; and a bottom surface directly attached to the second end paddle; and a molding encapsulation enclosing the low side FET, the high side FET, the first plurality of bonding wires, the first end paddle, the second end paddle, and the inductor assembly.