# US 11,309,227 B2 · Chip package structure having a package substrate disposed around a die

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- Number: US 11,309,227 B2
- Document ID: US11309227B2
- Status: Granted
- Kind: B2
- Application number: 16/757,012
- Filed: 2017-10-20
- Published: 2020-08-27
- Granted: 2022-04-19
- Earliest claimed: 2017-10-20
- Assignees: Huawei Technologies Co., Ltd.
- Applicants: Huawei Technologies Co., Ltd.
- Inventors: Jianping Fang; Yanqin Liao; Haohui Long; Hui Si
- Web page: https://patentgrep.com/patent/US11309227B2

## CPC

- G06V 40/1329: {Protecting the fingerprint sensor against damage caused by the finger}
- H10W 74/141: {the encapsulations being on at least the sidewalls of the semiconductor body}
- G06V 40/1318: {using electro-optical elements or layers, e.g. electroluminescent sensing}
- H10D 62/117: {Shapes of semiconductor bodies}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 74/017: {Auxiliary layers for moulds, e.g. release layers or layers preventing residue}
- H10W 74/10: characterised by their shape or disposition
- H10W 72/0198: {batch processes}
- H10W 72/242: {relative to the surface, e.g. recessed, protruding}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.

## Claims

### Claim 1

A chip package structure, comprising:
a die;
a package substrate disposed around the die;
a solder joint is disposed on a first surface of the die; and
an injection molding material disposed on each surface of the die, other than a second surface of the die, wherein at least one pair of opposite sides of the package substrate is embedded in the injection molding material, wherein each pair of opposite sides of the at least one pair of opposite sides is a pair of portions of the package substrate disposed on opposing sides of the die;
wherein a contact area between the at least one pair of opposite sides and the injection molding material is greater than half of a surface area of the at least one pair of opposite sides;
wherein the second surface is opposite the die from the first surface;
wherein the package substrate comprises a first pair of opposite sides and a second pair of opposite sides, wherein the first pair of opposite sides is a pair of first portions of the package substrate disposed on first opposing sides of the die, wherein the second pair of opposite sides is a pair of second portions of the package substrate that are different from the first portions and that are disposed on second opposing sides of the die different from the first opposing sides of the die;
wherein a length of the first pair of opposite sides is greater than a length of the second pair of opposite sides;
wherein the second pair of opposite sides is embedded in the injection molding material such that at least three surfaces of the second pair of opposite sides are in contact with the injection molding material;
wherein a height of the first pair of opposite sides in a target direction is greater than a height of the second pair of opposite sides in the target direction, and wherein a first target surface of the first pair of opposite sides is flush with the second surface of the die; and
wherein the target direction is perpendicular to the second surface of the die, and the first target surface is a surface that is of the first pair of opposite sides and that is not in contact with the injection molding material in the target direction.

### Claim 2 (depends on 1)

The chip package structure according to claim 1, wherein the first pair of opposite sides is embedded in the injection molding material such that at least three surfaces of the first pair of opposite sides are in contact with the injection molding material.

### Claim 3 (depends on 1)

The chip package structure according to claim 1, wherein a ratio of a contact area between the package substrate and the injection molding material to a surface area of the package substrate is greater than ⅔, ¾, or ⅘.

### Claim 4

A chip comprising:
a chip package structure, comprising:
a die;
a package substrate disposed around the die;
a solder joint disposed on a first surface of the die;
an injection molding material disposed on each surface the die other than a second surface of the die;
wherein at least one pair of opposite sides of the package substrate is embedded in the injection molding material, wherein each pair of opposite sides of the at least one pair of opposite sides is a pair of portions of the package substrate disposed on opposing sides of the die;
wherein a contact area between the at least one pair of opposite sides and the injection molding material is greater than half of a surface area of the at least one pair of opposite sides; and
wherein the second surface is opposite the die from the first surface;
wherein the package substrate comprises a first pair of opposite sides and a second pair of opposite sides, wherein the first pair of opposite sides is a pair of first portions of the package substrate disposed on opposing sides of the die, wherein the second pair of opposite sides is a pair of second portions of the package substrate that are different from the first portions and that are disposed on second opposing sides of the die different from the first opposing sides of the die, and wherein a length of the first pair of opposite sides is greater than a length of the second pair of opposite sides;
wherein the second pair of opposite sides is embedded in the injection molding material such that at least three surfaces of the second pair of opposite sides are in contact with the injection molding material;
wherein a height of the first pair of opposite sides in a target direction is greater than a height of the second pair of opposite sides in the target direction, and wherein a first target surface of the first pair of opposite sides is flush with the second surface of the die; and
wherein the target direction is perpendicular to the second surface of the die, and wherein the first target surface is a surface that is of the first pair of opposite sides and that is not in contact with the injection molding material in the target direction.

### Claim 5 (depends on 4)

The chip according to claim 4, wherein the first pair of opposite sides is embedded in the injection molding material such that at least three surfaces of the first pair of opposite sides are in contact with the injection molding material.

### Claim 6 (depends on 4)

The chip package structure according to claim 4, wherein a ratio of a contact area between the package substrate and the injection molding material to a surface area of the package substrate is greater than ⅔, ¾, or ⅘.