# US 11,309,198 B2 · Wafer processing system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,198 B2 - Document ID: US11309198B2 - Status: Granted - Kind: B2 - Application number: 16/919,180 - Filed: 2020-07-02 - Published: 2021-03-18 - Granted: 2022-04-19 - Earliest claimed: 2019-09-16 - Assignees: SPTS Technologies Limited - Applicants: SPTS Technologies Limited - Inventors: Attila Nagy; Kris Martin - Web page: https://patentgrep.com/patent/US11309198B2 ## CPC - H10P 72/0464: {characterised by the construction of the transfer chamber} - H10P 72/0466: {characterised by the construction of the load-lock chamber} - H10P 72/0468: {comprising a chamber adapted to a particular process} - H10P 72/14: {Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls} - H10P 72/3302: {Mechanical parts of transfer devices} - H10P 72/3306: {Horizontal transfer of a single workpiece} - H10P 72/3411: {involving loading and unloading of wafers} - H10P 72/50: for positioning, orientation or alignment - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A wafer processing system has a transport vacuum chamber for handling a frame assembly under vacuum conditions, at least one vacuum cassette elevator load lock for housing a cassette and adjusting a vertical position of the cassette under vacuum conditions, and at least one wafer processing module in vacuum communication with the transport vacuum chamber. An actuating assembly changes guide members from an expanded configuration to a contracted configuration to reduce a first cross-sectional dimension of a frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area that is perpendicular to the first cross-sectional dimension. ## Claims ### Claim 1 A wafer processing system comprising: a transport vacuum chamber for handling a frame assembly under vacuum conditions; at least one vacuum cassette elevator load lock for housing a cassette and adjusting a vertical position of the cassette under vacuum conditions, wherein the at least one vacuum cassette elevator load lock is in vacuum communication with the transport vacuum chamber; and at least one wafer processing module in vacuum communication with the transport vacuum chamber; wherein the transport vacuum chamber comprises: an alignment device for adjusting a translational and rotational position of the frame assembly into alignment with a target position within the transport vacuum chamber; and a transfer robot disposed within the transport vacuum chamber for transferring the frame assembly between the at least one cassette vacuum chamber, the at least one alignment device, and the at least one wafer processing module under vacuum conditions; in which the alignment device comprises: a positioning assembly disposed within the transport vacuum chamber comprising a plurality of guide members that are arranged to define a frame assembly receiving area within the transport vacuum chamber; at least one support for supporting the frame assembly in the frame assembly receiving area; and an actuating assembly operable to change the plurality of guide members from an expanded configuration to a contracted configuration so as to reduce a first cross-sectional dimension of the frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area that is perpendicular to the first cross-sectional dimension; wherein when the plurality of guide members change from the expanded configuration to the contracted configuration while the frame assembly is supported on the at least one support, the plurality of guide members engage with the frame assembly so as to adjust the translational and/or rotational position of the frame assembly into alignment with the target position. ### Claim 2 (depends on 1) A wafer processing system according to claim 1, in which the alignment device comprises at least three of the guide members. ### Claim 3 (depends on 1) A wafer processing system according to claim 1, wherein the guide members comprise a first guide member movable from the expanded configuration to the contracted configuration so as to reduce the first cross-sectional dimension of the frame assembly receiving area. ### Claim 4 (depends on 3) A wafer processing system according to claim 3, wherein the guide members comprise a second guide member, wherein the first and second guide members are disposed on substantially opposite sides of the frame assembly receiving area. ### Claim 5 (depends on 4) A wafer processing system according to claim 4, wherein the second guide member is movable from the expanded configuration to the contracted configuration to reduce the first cross-sectional dimension of the frame assembly receiving area. ### Claim 6 (depends on 5) A wafer processing system according to claim 5, wherein the guide members comprise a third guide member movable from the expanded configuration to the contracted configuration so as to reduce the second cross-sectional dimension of the frame assembly receiving area. ### Claim 7 (depends on 1) A wafer processing system according to claim 1, wherein each of the guide members that are movable are movable by a distance in the range of 5-30 mm, 6-20 mm, or 7.5-15 mm. ### Claim 8 (depends on 1) A wafer processing system according to claim 1, wherein the at least one support comprises a plurality of support pins. ### Claim 9 (depends on 1) A wafer processing system according to claim 1, wherein the positioning assembly further comprises a body, and the guide members are mountable on the body to define the frame assembly receiving area. ### Claim 10 (depends on 9) A wafer processing system according to claim 9, wherein the at least one support is mountable on the body of the positioning assembly so that when the frame assembly is supported on the at least one support, the frame assembly is spaced apart from the body. ### Claim 11 (depends on 9) A wafer processing system according to claim 9, wherein the body comprises a core and arms extending radially outwardly from the core, wherein the guide members are mountable on the arms to define the frame assembly receiving area. ### Claim 12 (depends on 9) A wafer processing system according to claim 9, wherein at least one of the guide members is mountable on the body at a plurality of radially different locations. ### Claim 13 (depends on 1) A wafer processing system according to claim 1, wherein a biasing means, such as an extension spring, biases the guide members towards the contracted configuration. ### Claim 14 (depends on 1) A wafer processing system according to claim 1, wherein a part of the actuating assembly extends through a wall of the transport vacuum chamber via a vacuum feedthrough. ### Claim 15 (depends on 1) A wafer processing system according to claim 1, wherein the positioning assembly is movable between a raised position and a lowered position. ### Claim 16 (depends on 15) A wafer processing system according to claim 15, wherein the positioning assembly is movable between the raised and lowered positions by a distance in the range of 10-100 mm, 25-75 mm, 30-50 mm, or about 40 mm. ### Claim 17 (depends on 15) A wafer processing system according to claim 15, further comprising at least one auxiliary frame support for supporting the frame assembly when the positioning assembly is in the lowered position. ### Claim 18 (depends on 1) A wafer processing system according to claim 1, further comprising an orientation adjuster for rotating the positioning assembly. ### Claim 19 (depends on 1) A wafer processing system according to claim 1, further comprising a plurality of the alignment devices disposed within the transport vacuum chamber. ### Claim 20 A transport vacuum chamber for handling a frame assembly under vacuum conditions comprising: an alignment device for adjusting a translational and rotational position of the frame assembly into alignment with a target position within the transport vacuum chamber; and a transfer robot disposed within the transport vacuum chamber for transferring the frame assembly onto the alignment device; wherein the alignment device comprises: a positioning assembly disposed within the transport vacuum chamber comprising a plurality of guide members that are arranged to define a frame assembly receiving area within the transport vacuum chamber; at least one support for supporting the frame assembly in the frame assembly receiving area; and an actuating assembly operable to change the plurality of guide members from an expanded configuration to a contracted configuration so as to reduce a first cross-sectional dimension of the frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area that is perpendicular to the first cross-sectional dimension; wherein when the plurality of guide members change from the expanded configuration to the contracted configuration while the frame assembly is supported on the at least one support, the plurality of guide members engage with the frame assembly so as to adjust the translational and/or rotational position of the frame assembly into alignment with the target position. ### Claim 21 (depends on 20) A method of adjusting a translational and rotational position of a frame assembly into alignment with a target position under vacuum conditions using a transport vacuum chamber according to claim 20, the method comprising the steps of: a. configuring the plurality of guide members into the expanded configuration; b. positioning the frame assembly onto the at least one support in the frame assembly receiving area; c. changing the plurality of guide members from the expanded configuration to the contracted configuration so that the plurality of guide members engage with the frame assembly so as to adjust the translational and/or rotational position of the frame assembly into alignment with the target position. ### Claim 22 (depends on 21) A method according to claim 21, wherein the frame assembly is of the type comprising a pair of parallel diametrically opposed straight edges, and the guide members engage with at least the pair of parallel diametrically opposed straight edges. ### Claim 23 (depends on 21) A method according to claim 21, further comprising a step of unloading the frame assembly from the support by: i. changing the guide members from the contracted configuration into the expanded configuration; ii. positioning a part of the transfer robot between the frame assembly and the positioning assembly; and iii. lowering the positioning assembly so that the frame assembly is lowered onto the end effector of the transfer robot. ### Claim 24 (depends on 21) A method according to claim 21, wherein the method is performed prior to loading the frame assembly into a cassette vacuum chamber or a wafer processing module. ### Claim 25 (depends on 1) A method of handling a frame assembly under vacuum conditions using the wafer processing system according to claim 1, the method comprising the steps of: providing a frame assembly on the transfer robot that is disposed within the transport vacuum chamber; transferring the frame assembly from the transfer robot onto the alignment device; aligning the translational and rotational position of the frame assembly into alignment with the target position using the alignment device; and subsequently transferring the frame assembly from the alignment device to the at least one vacuum cassette elevator load lock or to the at least one wafer processing module.