# US 11,309,135 B2 · Ceramic package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,135 B2 - Document ID: US11309135B2 - Status: Granted - Kind: B2 - Application number: 16/659,902 - Filed: 2019-10-22 - Published: 2020-07-16 - Granted: 2022-04-19 - Earliest claimed: 2019-01-11 - Assignees: Ngk Spark Plug Co., Ltd. - Applicants: Ngk Spark Plug Co., Ltd. - Inventors: Takayuki Miyaji - Web page: https://patentgrep.com/patent/US11309135B2 ## CPC - H01G 2/106: {Fixing the capacitor in a housing} - H01G 9/008: Terminals - H01G 9/08: Housing; Encapsulation - H01G 9/28: Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass - H01G 11/74: Terminals, e.g. extensions of current collectors - H01G 11/82: Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations - H10W 76/18: Insulating materials, e.g. resins, glasses or ceramics - H10W 76/45: Liquid fillings - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed is a ceramic package for filling with a liquid-containing electrolyte, which includes: a package body defining a recessed cavity open at a front surface of the package body and including first and second ceramic layers stacked together; a plurality of electrode pads disposed on a bottom surface of the recessed cavity; and a plurality of outer connection terminals disposed on a back surface of the package body, wherein each of the electrode pads includes a pad body portion having a polygonal shape in plan view and an interlayer pad portion formed along an interlayer surface between the first and second ceramic layers, wherein the interlayer pad portion has a protruding part protruding outwardly from the pad body portion, and wherein via conductors are formed between the protruding parts of the electrode pads and the outer connection terminals through the first ceramic layer. ## Claims ### Claim 1 A ceramic package for filling with a liquid-containing electrolyte, comprising: a package body having opposite front and back surfaces and defining therein a recessed cavity open at the front surface of the package body to be filled with the liquid-containing electrolyte, the package body comprising a plurality of ceramic layers including first and second ceramic layers stacked together, the first ceramic layer being located closer to the back surface of the package body than the second ceramic layer, an interlayer surface between the first and second ceramic layers being defined along an extension of a bottom surface of the recessed cavity in a plane direction; a plurality of electrode pads disposed on the bottom surface of the recessed cavity and the interlayer surface between the first and second ceramic layers; a plurality of outer connection terminals disposed on the back surface of the package body; via conductors extending through at least the first ceramic layer and respectively connecting the electrode pads to the outer connection terminals, wherein each of the electrode pads includes a pad body portion having a polygonal shape in plan view and an interlayer pad portion formed along the interlayer surface between the first and second ceramic layers such that a boundary of the pad body portion and the interlayer pad portion is positioned at the interlayer surface between the first and second ceramic layers, wherein the interlayer pad portion has a protruding part protruding outwardly from the pad body portion in plan view, and wherein the via conductors are formed between the protruding parts of the electrode pads and the outer connection terminals through at least the first ceramic layer. ### Claim 2 (depends on 1) The ceramic package according to claim 1, wherein the package body has a rectangular shape in plan view, wherein the interlayer pad portion is adjacent to and integral with the pad body portion, and wherein a width of the protruding part is smaller than a width of the interlayer pad portion except the protruding part in plan view. ### Claim 3 (depends on 1) The ceramic package according to claim 1, wherein, when viewed in plan, the protruding part has a rectangular shape, a trapezoid-like shape whose wide base side is located opposite from the pad body portion, or a T shape having a linear section located opposite from the pad body portion and in parallel with a side surface of the recessed cavity closest to the protruding part and a narrow neck section located closer to the pad body portion than the linear section. ### Claim 4 (depends on 1) The ceramic package according to claim 1, wherein two or more of the plurality of outer connection terminals are electrically connected to one of the plurality of electrode pads. ### Claim 5 (depends on 1) The ceramic package according to claim 1, wherein the plurality of outer connection terminals are arranged on a peripheral region of the back surface of the package body. ### Claim 6 (depends on 1) The ceramic package according to claim 1, further comprising a plurality of side conductors disposed on a side surface of the package body between the front and back surfaces, wherein side-surface-side ends of the outer connection terminals are respectively connected to back-surface-side ends of the side conductors. ### Claim 7 (depends on 1) The ceramic package according to claim 1, further comprising one or more additional outer connection terminals disposed on a center region of the back surface surrounded by the plurality of outer connection terminals.