# US 11,309,134 B2 · Capacitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,134 B2 - Document ID: US11309134B2 - Status: Granted - Kind: B2 - Application number: 16/524,295 - Filed: 2019-07-29 - Published: 2020-02-13 - Granted: 2022-04-19 - Earliest claimed: 2018-08-09 - Assignees: Taiyo Yuden Co., Ltd. - Applicants: Taiyo Yuden Co., Ltd. - Inventors: Riki Suemasa; Takayuki Sekiguchi - Web page: https://patentgrep.com/patent/US11309134B2 ## CPC - H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} - H01G 4/005: Electrodes - H01G 4/008: Selection of materials - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/06: Solid dielectrics - H01G 4/228: Terminals - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H05K 1/162: {incorporating printed capacitors} - H10D 1/696: {comprising multiple layers, e.g. comprising a barrier layer and a metal layer (barrier layers to prevent diffusion of hydrogen or oxygen in perovskite based capacitors H10D1/688)} - H05K 1/181: associated with surface mounted components - H05K 2201/0179: Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor - H05K 2201/10015: Non-printed capacitor - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract A capacitor according to one embodiment of the present invention relates to a thin film capacitor including a base member and a MIM structure provided on the base member. The thin film capacitor includes a first external electrode and a second external electrode that are electrically connected to the MIM structure. The base member has a plurality of through holes penetrating between a first surface and a second surface of the base member. The MIM structure includes a first portion extending along the first surface of the base member, a second portion extending along the second surface of the base member, and a third portion provided in the plurality of through holes of the base member so as to connect the first portion to the second portion. ## Claims ### Claim 1 A capacitor, comprising: a base member having a first surface and a second surface opposed to the first surface, a plurality of through holes extending through the base member between the first surface and the second surface; a MIM structure including: a first dielectric layer; a first electrode layer provided on one surface of the first dielectric layer; and a second electrode layer provided on another surface of the first dielectric layer; a first external electrode electrically connected to the MIM structure; and a second external electrode electrically connected to the MIM structure and spaced from the first external electrode, wherein each of the first dielectric layer, the first electrode layer, and the second electrode layer extends from a first portion to a second portion of the MIM structure through each of the plurality of through holes, the first portion extending along the first surface of the base member, and the second portion extending along the second surface of the base member, wherein the first external electrode is directly electrically connected to one of the first electrode layer and the second electrode layer both at the first portion and the second portion; and wherein the second external electrode is directly electrically connected to another of the first electrode layer and the second electrode layer both at the first portion and the second portion. ### Claim 2 (depends on 1) The capacitor according to claim 1, wherein the first external electrode includes: a first electrode portion extending along the first surface; a second electrode portion extending along the second surface; and a first connection electrode portion connecting the first electrode portion to the second electrode portion, and wherein the second external electrode includes: a third electrode portion extending along the first surface; a fourth electrode portion extending along the second surface; and a second connection electrode portion connecting the third electrode portion to the fourth electrode portion. ### Claim 3 (depends on 2) The capacitor according to claim 2, wherein the first external electrode is configured so that a thickness T1 of the first connection electrode portion is ten or more times as large as a thickness t1 of the first electrode layer. ### Claim 4 (depends on 2) The capacitor according to claim 2, wherein the first external electrode is configured so that a thickness T1 of the first connection electrode portion is ten or more times as large as a thickness t2 of the second electrode layer. ### Claim 5 (depends on 2) The capacitor according to claim 2, wherein the second external electrode is configured so that a thickness T2 of the second connection electrode portion is ten or more times as large as a thickness t1 of the first electrode layer. ### Claim 6 (depends on 2) The capacitor according to claim 2, wherein the second external electrode is configured so that a thickness T2 of the second connection electrode portion is ten or more times as large as the thickness t2 of the second electrode layer. ### Claim 7 (depends on 1) The capacitor according to claim 1, further comprising: a protective layer provided so as to cover the MIM structure. ### Claim 8 (depends on 1) A circuit board comprising the capacitor according to claim 1. ### Claim 9 (depends on 8) An electronic device comprising the circuit board according to claim 8.