# US 11,309,133 B2 · Multilayer electronic component and board having the same mounted thereon > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,133 B2 - Document ID: US11309133B2 - Status: Granted - Kind: B2 - Application number: 16/860,704 - Filed: 2020-04-28 - Published: 2021-07-01 - Granted: 2022-04-19 - Earliest claimed: 2019-12-31 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Heung Kil Park; Hun Gyu Park; Se Hun Park; Gu Won Ji - Web page: https://patentgrep.com/patent/US11309133B2 ## CPC - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/181: associated with surface mounted components - H05K 3/303: with surface mounted components (H05K3/32 takes precedence) - H05K 2201/10015: Non-printed capacitor - H05K 2201/10242: Metallic cylinders - H05K 2201/10568: Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element - H05K 2201/10984: Component carrying a connection agent, e.g. solder, adhesive - H05K 2201/2036: Permanent spacer or stand-off in a printed circuit or printed circuit assembly - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract The multilayer electronic component includes a capacitor body having first to sixth surfaces; first and second external electrodes including first and second connecting portions, and first and second band portions; first and second connection terminals connected to the first band portion; and third and fourth connection terminals connected to the second band portion. The first and second connection terminals include a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular. The third and fourth connection terminals include a third connection surface facing the second band portion, a fourth connection surface opposing the third connection surface, and a second circumferential surface connecting the third and fourth connection surfaces, a cross section of the second circumferential surface being circular. ## Claims ### Claim 1 A multilayer electronic component comprising: a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the capacitor body having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces and opposing each other, one ends of the plurality of first and second internal electrodes being exposed to the third and fourth surfaces, respectively; first and second external electrodes including first and second connecting portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions extending from the first and second connecting portions to portions of the first surface of the capacitor body, respectively, the first and second external electrodes are connected to the plurality of first and second internal electrodes, respectively; first and second connection terminals connected to the first band portion, on a first surface side of the capacitor body, and spaced apart from each other; and third and fourth connection terminals connected to the second band portion, on the first surface side of the capacitor body, and spaced apart from each other, wherein each of the first and second connection terminals includes a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular, each of the third and fourth connection terminals includes a third connection surface facing the second band portion, a fourth connection surface opposing the third connection surface, and a second circumferential surface connecting the third and fourth connection surfaces, a cross section of the second circumferential surface being circular, wherein (1) the first to fourth connection terminals are respectively provided with a reduced-thickness portion defining a groove disposed therein and being open toward a mounting surface, or (2) the first to fourth connection terminals are respectively provided with a hole disposed therein in a direction connecting the first and second surfaces of the capacitor body, and wherein the first and second connection terminals are connected to the first internal electrodes via the first external electrode, and the third and fourth connection terminals are connected to the second internal electrodes via the second external electrode. ### Claim 2 (depends on 1) The multilayer electronic component of claim 1, wherein the first to fourth connection terminals have a cylindrical shape. ### Claim 3 (depends on 1) The multilayer electronic component of claim 1, wherein the first and second connection terminals are spaced apart from an edge of the first band portion, and the third and fourth connection terminals are spaced apart from an edge of the second band portion. ### Claim 4 (depends on 1) The multilayer electronic component of claim 1, further comprising: first and second conductive adhesive layers disposed between the first connection terminal and the first band portion and between the second connection terminal and the first band portion, respectively; and third and fourth conductive adhesive layers disposed between the third connection terminal and the second band portion and between the fourth connection terminal and the second band portion, respectively. ### Claim 5 (depends on 1) The multilayer electronic component of claim 1, further comprising a plating layer respectively plated on external surfaces of the first to fourth connection terminals, wherein the plating layer comprises one of tin (Sn) and gold (Au). ### Claim 6 (depends on 1) The multilayer electronic component of claim 1, wherein the first and second connection terminals are spaced apart from each other in a direction connecting the fifth and sixth surfaces of the capacitor body, and the third and fourth connection terminals are spaced apart from each other in the direction connecting the fifth and sixth surfaces of the capacitor body. ### Claim 7 A board having a multilayer electronic component mounted thereon, the board comprising: a substrate having first and second electrode pads on one surface; and a multilayer electronic component including: a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the capacitor body having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces and opposing each other, one ends of the plurality of first and second internal electrodes being exposed to the third and fourth surfaces, respectively; first and second external electrodes including first and second connecting portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions extending from the first and second connecting portions to portions of the first surface of the capacitor body, respectively, the first and second external electrodes are connected to the plurality of first and second internal electrodes, respectively; first and second connection terminals connected to the first band portion, on a first surface side of the capacitor body, and spaced apart from each other; and third and fourth connection terminals connected to the second band portion, on the first surface side of the capacitor body, and spaced apart from each other, wherein each of the first and second connection terminals includes a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular, and each of the third and fourth connection terminals includes a third connection surface facing the second band portion, a fourth connection surface opposing the third connection surface, and a second circumferential surface connecting the third and fourth connection surfaces, a cross section of the second circumferential surface being circular, wherein the first and second connection terminals are disposed on the first electrode pad to be connected thereto, and the third and fourth connection terminals are disposed on the second electrode pad to be connected thereto, wherein (1) the first to fourth connection terminals are respectively provided with a reduced-thickness portion defining a groove disposed therein and being open toward a mounting surface, or (2) the first to fourth connection terminals are respectively provided with a hole disposed therein in a direction connecting the first and second surfaces of the capacitor body, and wherein the first and second connection terminals are connected to the first internal electrodes via the first external electrode, and the third and fourth connection terminals are connected to the second internal electrodes via the second external electrode. ### Claim 8 (depends on 7) The board of claim 7, wherein the first to fourth connection terminals have a cylindrical shape. ### Claim 9 (depends on 7) The board of claim 7, wherein the first and second connection terminals are spaced apart from an edge of the first band portion, and the third and fourth connection terminals are spaced apart from an edge of the second band portion. ### Claim 10 (depends on 7) The board of claim 7, wherein the multilayer electronic component further comprises: first and second conductive adhesive layers disposed between the first connection terminal and the first band portion and between the second connection terminal and the first band portion, respectively, and third and fourth conductive adhesive layers disposed between the third connection terminal and the second band portion and between the fourth connection terminal and the second band portion, respectively. ### Claim 11 (depends on 7) The board of claim 7, further comprising a plating layer respectively plated on external surfaces of the first to fourth connection terminals, wherein the plating layer comprises at least one of tin (Sn) and gold (Au). ### Claim 12 (depends on 7) The board of claim 7, wherein the first and second connection terminals are spaced apart from each other in a direction connecting the fifth and sixth surfaces of the capacitor body, and the third and fourth connection terminals are spaced apart from each other in the direction connecting the fifth and sixth surfaces of the capacitor body. ### Claim 13 A multilayer electronic component comprising: a capacitor body including dielectric layers and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the capacitor body including first and second surfaces opposing each other; first and second external electrodes respectively connected to the first internal electrodes and the second internal electrodes, and each including a portion disposed on the first surface of the capacitor body; a first connection terminal disposed on the portion of the first external electrode; and a second connection terminal disposed on the portion of the second external electrode, wherein (1) each of the first and second connection terminals has a reduced-thickness portion defining a recess extending from a lower surface thereof toward an upper surface thereof in a direction from the first surface to the second surface such that the recess of the first connection terminal is spaced apart from the upper surface of the first connection terminal and the recess of the second connection terminal is spaced apart from the upper surface of the second connection terminal, or (2) each of the first and second connection terminals has a recess extending from a lower surface thereof to an upper surface thereof in a direction from the first surface to the second surface, and wherein the first connection terminal is connected to the first internal electrodes via the first external electrode, and the second connection terminal is connected to the second internal electrodes via the second external electrode. ### Claim 14 (depends on 13) The multilayer electronic component of claim 13, further comprising: a first conductive adhesive layer disposed between the first connection terminal and the portion of the first external electrode; and a second conductive adhesive layer disposed between the second connection terminal and the portion of the second external electrode. ### Claim 15 (depends on 13) The multilayer electronic component of claim 13, further comprising a plating layer respectively plated on external surfaces of the first and second connection terminals, wherein the plating layer comprises one of tin (Sn) and gold (Au). ### Claim 16 (depends on 13) The multilayer electronic component of claim 13, further comprising a third connection terminal disposed on the portion of the first external electrode and spaced apart from the first connection terminal; and a fourth connection terminal disposed on the portion of the second external electrode and spaced apart from the second connection terminal.