# US 11,309,121 B2 · Magnetic field efficient inductor and method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,309,121 B2 - Document ID: US11309121B2 - Status: Granted - Kind: B2 - Application number: 16/229,180 - Filed: 2018-12-21 - Published: 2020-06-25 - Granted: 2022-04-19 - Earliest claimed: 2018-12-21 - Assignees: Realtek Semiconductor Corp. - Applicants: Realtek Semiconductor Corp. - Inventors: Chia-Liang (Leon) Lin - Web page: https://patentgrep.com/patent/US11309121B2 ## CPC - H01F 27/2847: {Sheets; Strips (H01F27/2866 takes precedence)} - H01F 5/003: {Printed circuit coils} - H01F 5/04: Arrangements of electric connections to coils, e.g. leads - H01F 27/06: Mounting, supporting, or suspending transformers, reactors, or choke coils {not being of the signal type} - H01F 27/2804: {Printed windings} - H01F 27/34: Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields - H01F 27/40: Structural association with built-in electric component, e.g. fuse - H01F 41/041: {Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00)} - H01F 27/065: {Mounting on printed circuit boards} - H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract An inductor includes a coil configured in an open loop topology with a first multi-finger end and a second multi-finger end, wherein the fingers of the first end are disposed in interdigitating fashion with the fingers of the second end, and laid out on a first metal layer of a multi-layer structure; a plurality of pairs of metal strips laid out on a second metal layer of the multi-layer structure, wherein each of said plurality of pairs of metal strips comprises a first metal strip intersecting the first multi-finger end as seen from a top view and connecting to the first multi-finger end through a first set of vias, and a second metal strip intersecting the second multi-finger end as seen from the top view and connecting to the second multi-finger end through a second set of vias. ## Claims ### Claim 1 An inductor comprising: a coil configured in an open loop topology with a first end and a second end, each end having multiple fingers, wherein fingers of the first end are disposed in interdigitating fashion with fingers of the second end, and laid out on a first metal layer of a multi-layer structure; and a plurality of pairs of metal strips laid out on a second metal layer of the multi-layer structure, wherein each pair of said plurality of pairs of metal strips comprises a first metal strip intersecting the first multi-finger end as seen from a top view and connecting to the first multi-finger end through a first set of vias, and a second metal strip intersecting the second multi-finger end as seen from the top view and connecting to the second multi-finger end through a second set of vias; wherein each pair of metal strips is laid out in a lateral zone as seen from the top view, not overlapping with a zone of any other pair of metal strips, and each metal strip is configured to be connected to an end of a capacitor, such that the metal strips of each pair of metal strips are configured for connection to a single capacitor, wherein intersecting connection points of the metal strips and the multiple fingers are configured such that the capacitor connected to each pair of metal strips is connected in parallel with the other connected capacitors. ### Claim 2 (depends on 1) The inductor of claim 1, wherein the multi-layer structure is embedded in a dielectric medium placed upon a substrate. ### Claim 3 (depends on 1) The inductor of claim 1, wherein each pair of said plurality of pairs of metal strips is connected to the respective capacitor to form a resonant tank. ### Claim 4 A method comprising: laying out a coil configured in an open loop topology with a first end and a second end, each end having multiple fingers, wherein fingers of the first end are disposed in interdigitating fashion with fingers of the second end, and laid out on a first metal layer of a multi-layer structure; laying out a plurality of pairs of metal strips on a second metal layer of the multi-layer structure, wherein each pair of said plurality of pairs of metal strips comprises a first metal strip intersecting the first multi-finger end and a second metal strip intersecting the second multi-finger end as seen from a top view; connecting the first metal strip to the first multi-finger end using a plurality of vias for each pair of said plurality of pairs of metal strips; and connecting the second metal strip to the second multi-finger end using a plurality of vias for each pair of said plurality of pairs of metal wherein each pair of metal strips is laid out in a lateral zone as seen from the top view, not overlapping with a zone of any other pair of metal strips, and each metal strip is configured to be connected to an end of a capacitor, such that the metal strips of each pair of metal strips are configured for connection to a single capacitor, wherein intersecting connection points of the metal strips and the multiple fingers are configured such that the capacitor connected to each pair of metal strips is connected in parallel with the other connected capacitors. ### Claim 5 (depends on 4) The method of claim 4, wherein the multi-layer structure is embedded in a dielectric medium placed upon a substrate. ### Claim 6 (depends on 4) The method of claim 4, wherein each pair of said plurality of pairs of metal strips is connected to the respective capacitor to form a resonant tank.