# US 11,309,014 B2 · Memory device transmitting small swing data signal and operation method thereof

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- Number: US 11,309,014 B2
- Document ID: US11309014B2
- Status: Granted
- Kind: B2
- Application number: 17/143,619
- Filed: 2021-01-07
- Published: 2021-07-22
- Granted: 2022-04-19
- Earliest claimed: 2020-01-21
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Byongmo Moon; Sungoh Ahn
- Web page: https://patentgrep.com/patent/US11309014B2

## CPC

- G11C 11/4074: Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
- G06F 1/10: Distribution of clock signals {, e.g. skew}
- G06F 1/263: {Arrangements for using multiple switchable power supplies, e.g. battery and AC (G06F1/30 takes precedence)}
- G11C 5/025: {Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device (geometrical lay-out of the components in integrated circuits, geometrical lay-out of the components in integrated circuits H10D89/10)}
- G11C 5/147: {Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops (G11C5/141 takes precedence)}
- G11C 7/1057: {Data output buffers, e.g. comprising level conversion circuits, circuits for adapting load}
- G11C 7/1084: {Data input buffers, e.g. comprising level conversion circuits, circuits for adapting load}
- G11C 11/4093: Input/output [I/O] data interface arrangements, e.g. data buffers
- G11C 11/4096: Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches
- H10W 90/00: Package configurations
- H10W 72/07254: {changes in dispositions}
- H10W 72/247: {Dispositions of multiple bumps}
- H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips}
- H10W 90/722: {between stacked chips}
- H10W 90/792: {between multiple chips}
- G11C: STATIC STORES (semiconductor memory devices H10B)
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Disclosed is a memory device, which includes a buffer die that outputs a first power supply voltage to a first through-substrate via (e.g., through-silicon via (TSV)) and receives a small swing data signal from a second TSV generated based on the first power supply voltage, and a core die that is electrically connected to the buffer die through the first and second TSVs, includes a first cell capacitor electrically connected to the first TSV and configured to block a first noise introduced to the first power supply voltage received through the first TSV. The core die outputs the small swing data signal to the second TSV.

## Claims

### Claim 1

A memory device comprising:
a buffer die configured to output a first power supply voltage to a first through-substrate via (TSV) and to receive a first small swing data signal from a second TSV generated based on the first power supply voltage; and
a first core die electrically connected to the buffer die through the first and second TSVs, including a first cell capacitor electrically connected to the first TSV and configured to block a first noise introduced to the first power supply voltage received through the first TSV, the first core die configured to output the first small swing data signal to the second TSV,
wherein a voltage of a high level of the first small swing data signal is lower than the first power supply voltage.

### Claim 2 (depends on 1)

The memory device of claim 1, wherein the buffer die is further configured to:
output a second power supply voltage smaller than the first power supply voltage to a third TSV,
output a third power supply voltage smaller than the second power supply voltage to a fourth TSV, and
receive the first small swing data signal based on the second and third power supply voltages, and
wherein the first core die:
is electrically connected to the buffer die further through the third and fourth TSVs,
includes a second cell capacitor connected to the third TSV and configured to block a second noise introduced to the second power supply voltage received through the third TSV, and
is configured to generate the first small swing data signal based on the first to third power supply voltages.

### Claim 3 (depends on 2)

The memory device of claim 2, wherein the first core die includes a transmitter configured to be driven based on the first to third power supply voltages and to generate the first small swing data signal, and
wherein the transmitter includes:
a multiplexer configured to generate a pull-up signal and a pull-down signal based on a first data signal, a second data signal corresponding to an inverted version of the first data signal, a clock signal, the first power supply voltage, and the third power supply voltage;
a first transistor connected between a first node configured to receive the second power supply voltage and a second node configured to output the first small swing data signal, and configured to operate in response to the pull-up signal; and
a second transistor connected between the second node and a third node configured to receive the third power supply voltage, and configured to operate in response to the pull-down signal.

### Claim 4 (depends on 3)

The memory device of claim 3, wherein the first and second transistors are NMOS transistors.

### Claim 5 (depends on 2)

The memory device of claim 2, further comprising:
a voltage regulator configured to provide the second power supply voltage to the buffer die,
wherein the first core die includes a transmitter driven based on the first to third power supply voltages and configured to generate the first small swing data signal, and
wherein the transmitter includes:
a comparator configured to compare the second power supply voltage and a voltage of a first node and output a comparison signal;
a first transistor connected between a second node configured to receive the first power supply voltage and the first node, the first transistor configured to operate in response to the comparison signal;
a second transistor connected between the first node and a third node configured to output the first small swing data signal, the second transistor configured to operate in response to a first data signal; and
a third transistor connected between the third node and a fourth node configured to receive the third power supply voltage, the third transistor configured to operate in response to a second data signal corresponding to an inverted version of the first data signal.

### Claim 6 (depends on 2)

The memory device of claim 2, wherein the buffer die includes a receiver driven based on the second and third power supply voltages and configured to determine a logical level of the first small swing data signal, and
wherein the receiver includes:
a first transistor connected between a first node and an output node at which a voltage of the determined logical level is formed and configured to operate in response to a voltage of an input node configured to receive the first small swing data signal;
a second transistor connected between the first node and a second node and configured to operate in response to a reference voltage used as a reference for determining the logical level;
a third transistor connected between the second node and a third node configured to receive the third power supply voltage, and configured to operate in response to a voltage of the second node;
a fourth transistor connected between the output node and the third node and configured to operate in response to the voltage of the second node;
a fifth transistor connected between a fourth node configured to receive the second power supply voltage and the first node and configured to operate in response to the voltage of the second node; and
a boosting capacitor connected between the input node and the second node.

### Claim 7 (depends on 2)

The memory device of claim 2, wherein a voltage of the first small swing data signal ranges from the second power supply voltage to the third power supply voltage.

### Claim 8 (depends on 1)

The memory device of claim 1, wherein the first core die includes a memory cell array including a plurality of memory cells,
wherein each memory cell of the plurality of memory cells includes a transistor, and a capacitor connected to the transistor and configured to store data, and
wherein the first cell capacitor and the capacitor of memory cell are at the same height.

### Claim 9 (depends on 1)

The memory device of claim 1, wherein the buffer die and the first core die are from different wafers.

### Claim 10 (depends on 1)

The memory device of claim 1, further comprising:
a second core die disposed in parallel with the buffer die and the first core die and configured to receive the first power supply voltage through a first feed line including the first TSV and to transmit or receive the first small swing data signal through a second feed line including the second TSV,
wherein the first feed line includes a first micro-bump interposed between the buffer die and the first core die and a second micro-bump interposed between the first core die and the second core die, and
wherein the second feed line includes a third micro-bump interposed between the buffer die and the first core die and a fourth micro-bump interposed between the first core die and the second core die.

### Claim 11 (depends on 1)

The memory device of claim 1, wherein the buffer die includes:
a power line distributer configured to output the first power supply voltage to the first TSV;
a first driver circuit driven based on the first power supply voltage and including a receiver configured to receive the first small swing data signal from the second TSV and a transmitter configured to output a second small swing data signal to the second TSV; and
an interface circuit electrically connected to the first driver circuit and including a flip-flop configured to hold the first small swing data signal and a sense amplifier configured to amplify the first small swing data signal.

### Claim 12 (depends on 1)

The memory device of claim 1, wherein the first core die includes:
a second driver circuit driven based on the first power supply voltage and including a transmitter configured to output the first small swing data signal to the second TSV and a receiver configured to receive a second small swing data signal from the second TSV; and
a memory cell array configured to store data corresponding to the first small swing data signal and data corresponding to the second small swing data signal.

### Claim 13

A memory device comprising:
a buffer die configured to output a first power supply voltage to a first through-substrate via (TSV) and to output a small swing data signal to a second TSV generated based on the first power supply voltage; and
a core die electrically connected to the buffer die through the first and second TSVs, including a first cell capacitor electrically connected to the first TSV and configured to block a first noise introduced to the first power supply voltage received through the first TSV, the core die configured to receive the small swing data signal from the second TSV,
wherein a voltage of a high level of the small swing data signal is lower than the first power supply voltage.

### Claim 14 (depends on 13)

The memory device of claim 13, wherein the buffer die is further configured to:
output a second power supply voltage smaller than the first power supply voltage to a third TSV,
output a third power supply voltage smaller than the second power supply voltage to a fourth TSV, and
generate the small swing data signal based on the first to third power supply voltages,
wherein the core die:
is electrically connected to the buffer die further through the third and fourth TSVs,
includes a second cell capacitor connected to the third TSV and configured to block a second noise introduced to the second power supply voltage received through the third TSV, and
is further configured to receive the small swing data signal based on the second and third power supply voltages.

### Claim 15 (depends on 14)

The memory device of claim 14, wherein the buffer die includes a transmitter driven based on the first to third power supply voltages and configured to generate the small swing data signal, and
wherein the transmitter includes:
a multiplexer configured to generate a pull-up signal and a pull-down signal based on a first data signal, a second data signal corresponding to an inverted version of the first data signal, a clock signal, the first power supply voltage, and the third power supply voltage;
a first transistor connected between a first node configured to receive the second power supply voltage and a second node configured to output the small swing data signal and the first transistor configured to operate in response to the pull-up signal; and
a second transistor connected between the second node and a third node configured to receive the third power supply voltage and the second transistor configured to operate in response to the pull-down signal.

### Claim 16 (depends on 14)

The memory device of claim 14, wherein the buffer die includes a transmitter driven based on the first to third power supply voltages and configured to generate the small swing data signal, and
wherein the transmitter includes:
a comparator configured to compare the second power supply voltage and a voltage of a first node and output a comparison signal;
a first transistor connected between a second node configured to receive the first power supply voltage and the first node and the first transistor configured to operate in response to the comparison signal;
a second transistor connected between the first node and a third node configured to output the small swing data signal and the second transistor configured to operate in response to a first data signal; and
a third transistor connected between the third node and a fourth node configured to receive the third power supply voltage and the third transistor configured to operate in response to a second data signal corresponding to an inverted version of the first data signal.

### Claim 17 (depends on 14)

The memory device of claim 14, wherein the core die includes a receiver driven based on the second and third power supply voltages and configured to determine a logical level of the small swing data signal, and
wherein the receiver includes:
a first transistor connected between a first node and an output node at which a voltage of the determined logical level is formed and configured to operate in response to a voltage of an input node configured to receive the small swing data signal;
a second transistor connected between the first node and a second node and configured to operate in response to a reference voltage used as a reference for determining the logical level;
a third transistor connected between the second node and a third node configured to receive the third power supply voltage and configured to operate in response to a voltage of the second node;
a fourth transistor connected between the output node and the third node and configured to operate in response to the voltage of the second node;
a fifth transistor connected between a fourth node configured to receive the second power supply voltage and the first node and configured to operate in response to the voltage of the second node; and
a boosting capacitor connected between the input node and the second node.

### Claim 18

An operation method of a memory device which includes a buffer die and a core die electrically connected to the buffer die through a first through-substrate via (TSV) and a second TSV, the method comprising:
supplying a first power supply voltage from the buffer die to the core die through the first TSV;
blocking or reducing a first noise introduced to the first power supply voltage by a first cell capacitor of the core die, the first cell capacitor electrically connected to the first TSV;
generating, at the buffer die or the core die, a small swing data signal based on the first power supply voltage; and
transmitting the small swing data signal through the second TSV.

### Claim 19 (depends on 18)

The method of claim 18, wherein the core die is further electrically connected to the buffer die through a third TSV and a fourth TSV, and the method further comprising:
supplying a second power supply voltage smaller than the first power supply voltage from the buffer die to the core die through the third TSV;
blocking or reducing a second noise introduced to the second power supply voltage by a second cell capacitor of the core die, the second cell capacitor electrically connected to the third TSV; and
supplying a third power supply voltage smaller than the second power supply voltage from the buffer die to the core die through the fourth TSV.

### Claim 20 (depends on 19)

The method of claim 19, wherein the generating of the small swing data signal based on the first power supply voltage at the buffer die or the core die includes:
generating, at the buffer die or the core die, the small swing data signal based on the first to third power supply voltages, and
wherein a voltage of the small swing data signal ranges from the second power supply voltage to the third power supply voltage.