# US 11,308,602 B2 · Cascade defect inspection > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,308,602 B2 - Document ID: US11308602B2 - Status: Granted - Kind: B2 - Application number: 16/479,203 - Filed: 2018-01-18 - Published: 2019-11-14 - Granted: 2022-04-19 - Earliest claimed: 2017-01-18 - Assignees: ASML Netherlands B.V. - Applicants: ASML Netherlands B.V. - Inventors: Zhichao Chen; Wei Fang - Web page: https://patentgrep.com/patent/US11308602B2 ## CPC - G06T 7/0004: {Industrial image inspection} - G01N 21/9501: {Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} - G06T 2207/10061: from scanning electron microscope - G06T 2207/30148: Semiconductor; IC; Wafer - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) ## Abstract A defect inspection system is disclosed. According to certain embodiments, the system includes a memory storing instructions implemented as a plurality of modules. Each of the plurality of modules is configured to detect defects having a different property. The system also includes a controller configured to cause the computer system to: receive inspection data representing an image of a wafer; input the inspection data to a first module of the plurality of modules, the first module outputs a first set of points of interests (POIs) having a first property; input the first set of POIs to a second module of the plurality of modules, the second module output a second set of POIs having the second property; and report that the second set of POIs as defects having both the first property and the second property. ## Claims ### Claim 1 A computer system comprising: a memory storing instructions implemented as a plurality of modules, each of the plurality of modules being configured to detect defects having a different property; and a controller configured to cause the computer system to: receive inspection data representing an image of a wafer; input first inspection data to a first module of the plurality of modules, wherein the first module outputs a first set of points of interests (POIs) having a first property; input second inspection data to a second module of the plurality of modules, wherein the second inspection data does not include the first set of POIs, and the second module outputs a second set of POIs having a second property; input the second set of POIs to a third module of the plurality of modules, wherein the third module outputs a third set of POIs having a third property; and report the third set of POIs as defects having both the second property and the third property. ### Claim 2 (depends on 1) The computer system of claim 1, wherein the controller is further configured to cause the computer system to: report the first set of POIs as defects having the first property, or report the second set of POIs as defects having the second property. ### Claim 3 (depends on 1) The computer system of a claim 1, wherein the controller is further configured to cause the computer system to: input the first inspection data to the third module, the third module outputs a fourth set of POIs having the third property; input the first and fourth sets of POIs to the second module, the second module outputs a fifth set of POIs having the second property; and report the fifth set of POIs as defects having i) the first property or the third property, and ii) the second property. ### Claim 4 (depends on 1) The computer system of claim 1, wherein the controller is further configured to cause the computer system to: input the fourth set of POIs to a fourth module of the plurality of modules, the fourth module outputs a sixth set of POIs having a fourth property; and report the sixth set of POIs as defects having the first, second, and fourth properties. ### Claim 5 (depends on 1) The computer system of claim 1, wherein POIs outputted by each of the plurality of modules are sub-regions of the wafer that include possible defects. ### Claim 6 (depends on 1) The computer system of claim 1, wherein the property of a defect includes at least one of a defect size and a defect type. ### Claim 7 (depends on 1) The computer system of claim 1, wherein the computer system is coupled with an electron-beam inspection tool configured to scan the wafer with one or more primary electron beams and to generate the inspection data based on one or more sets of secondary electrons reflected from the wafer, wherein the controller is configured to cause the computer system to receive the inspection data from the electron-beam inspection tool and generate the inspection image based on the inspection data. ### Claim 8 A computer system comprising: a memory storing instructions; and a processor electronically coupled to the memory and configured to execute the instructions to cause the computer system to: receive inspection data representing an image of a wafer; determine, in first inspection data representing the image of the wafer, a first set of points of interests (POIs) having a first property; determine, in second inspection data representing the image of the wafer, a second set of POIs having a second property, wherein the second inspection data does not include the first set of POIs; determine, in the second set of POIs, a third set of POIs having a third property; and report the third set of POIs as defects having both the second property and the third property. ### Claim 9 (depends on 8) The computer system of claim 8, wherein the processor is further configured to execute the instructions to cause the computer system to: report the first set of POIs as defects having the first property, or report the second set of POIs as defects having the second property. ### Claim 10 (depends on 8) The computer system of claim 8, wherein the processor is further configured to execute the instructions to cause the computer system to: determine, in the first inspection data, a fourth set of POIs having the third property; determine, in the first and fourth sets of POIs, a fifth set of POIs having the second property; and report the fifth set of POIs as defects having i) the first property or the third property, and ii) the second property. ### Claim 11 (depends on 8) The computer system of claim 8, wherein the processor is further configured to execute the instructions to cause the computer system to: determine, in the fourth set of POIs, a sixth set of POIs having a fourth property; and report the sixth set of POIs as defects having the first, second, and fourth properties. ### Claim 12 (depends on 8) The computer system of claim 8, wherein the POIs determined by the processor are sub-regions of the wafer that include possible defects. ### Claim 13 (depends on 8) The computer system of claim 8, wherein the property of a defect includes at least one of a defect size and a defect type. ### Claim 14 (depends on 8) The computer system of claim 8, wherein the computer system is coupled with an electron-beam inspection tool configured to scan the wafer with one or more primary electron beams and to generate the inspection data based on one or more sets of secondary electrons reflected from the wafer, wherein the processor is configured to cause the computer system to receive the inspection data from the electron-beam inspection tool and generate the inspection image based on the inspection data. ### Claim 15 A method comprising: receiving inspection data representing an image of a wafer; inputting first inspection data to a first module of a plurality of modules, each of the plurality of modules being configured to detect defects with a different property, wherein the first module outputs a first set of points of interests (POIs) having a first property; inputting second inspection data to a second module of the plurality of modules, wherein the second inspection data does not include the first set of POIs, and the second module outputs a second set of POIs having a second property; inputting the second set of POIs to a third module of the plurality of modules, wherein the third module outputs a third set of POIs having a third property; and reporting the third set of POIs as defects having both the second property and the third property.