# US 11,308,381 B2 · Method for producing a radiofrequency device passive wire antenna > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,308,381 B2 - Document ID: US11308381B2 - Status: Granted - Kind: B2 - Application number: 15/555,209 - Filed: 2016-02-11 - Published: 2018-02-22 - Granted: 2022-04-19 - Earliest claimed: 2015-03-02 - Assignees: Thales Dis France SAS - Applicants: Thales Dis France SAS - Inventors: Sebastien Gaspari; Yves Cuny; Brigitte Lacaze; Frédérick Seban - Web page: https://patentgrep.com/patent/US11308381B2 ## CPC - G06K 19/0775: {arrangements for connecting the integrated circuit to the antenna} - G06K 19/07786: {the antenna being of the HF type, such as a dipole} - G06K 19/07794: {the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit} - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract A method for producing a radiofrequency device having a first antenna circuit connected to a radiofrequency chip and a second antenna circuit associated with, or coupled to, the first circuit, the method including the following steps: formation of the first antenna circuit in the form of a conductive wire deposited in a guided manner on a first substrate; and formation of the second antenna circuit in the form of a conductive wire deposited on the same first substrate in a guided manner and at a calibrated distance from the first antenna circuit. ## Claims ### Claim 1 A method for producing a radiofrequency device comprising a first antenna circuit connected to a radiofrequency chip, and a second antenna circuit disposed at a distance from the first antenna circuit at which the second antenna circuit increases a communication range of the radiofrequency device, comprising the following steps: forming the first antenna circuit by depositing a conductive wire onto a first substrate, and after forming the first antenna circuit, forming the second antenna circuit by depositing a conductive wire onto the first substrate and at the distance from the first antenna circuit, wherein the method results in the final product in the fabrication flow. ### Claim 2 (depends on 1) A method according to claim 1, wherein the first circuit includes terminal portions for interconnection to the radiofrequency chip in the form of alternations. ### Claim 3 (depends on 1) A method according to claim 1, wherein portions of wire of the antenna circuit are deposited onto a substrate using embroidery or overlay. ### Claim 4 (depends on 1) A method according to claim 1, wherein the second circuit is a passive antenna coupled with a radiofrequency transponder. ### Claim 5 (depends on 1) A method according to claim 1, further comprising a step of depositing an anisotropic conductive material onto each terminal portion of the first antenna circuit and a step of transferring and connecting a/an coated/encapsulated chip via said anisotropic conductive material. ### Claim 6 (depends on 1) A method according to claim 1, further comprising a step of depositing a conductive material by printing, specifically screen printing, onto each terminal portion of the first antenna circuit and a step of transferring and connecting an unpackaged chip via said conductive material. ### Claim 7 (depends on 1) A method according to claim 1, further comprising a step of coating/encapsulating the chip in a package, except for the studs thereof, prior to the transfer thereof against connection terminal portions. ### Claim 8 (depends on 1) A method according to claim 1, further comprising at least a step of forming a part of the first circuit or fixing the radiofrequency chip in a cavity or an opening—provided in one of the substrates. ### Claim 9 A method for producing a radiofrequency device comprising a first antenna circuit connected to a radiofrequency chip, and a second antenna circuit disposed at a distance from the first antenna circuit at which the second antenna circuit increases a communication range of the radiofrequency device, comprising the following steps: forming the first antenna circuit by depositing a conductive wire onto a first substrate, and after forming the first antenna circuit, forming the second antenna circuit by depositing a conductive wire onto a second substrate and at the distance from the first antenna circuit, wherein the method results in the final product in the fabrication flow. ### Claim 10 (depends on 9) A method according to claim 9, wherein the first circuit includes terminal portions for interconnection to the radiofrequency chip in the form of alternations. ### Claim 11 (depends on 9) A method according to claim 9, wherein portions of wire of the antenna circuit are deposited onto a substrate using embroidery or overlay. ### Claim 12 (depends on 9) A method according to claim 9, wherein the second circuit is a passive antenna coupled with a radiofrequency transponder. ### Claim 13 (depends on 9) A method according to claim 9, further comprising a step of depositing an anisotropic conductive material onto each terminal portion of the first antenna circuit and a step of transferring and connecting a/an coated/encapsulated chip via said anisotropic conductive material. ### Claim 14 (depends on 9) A method according to claim 9, further comprising a step of depositing a conductive material by printing, specifically screen printing, onto each terminal portion of the first antenna circuit and a step of transferring and connecting an unpackaged chip via said conductive material. ### Claim 15 (depends on 9) A method according to claim 9, further comprising a step of coating/encapsulating the chip in a package, except for the studs thereof, prior to the transfer thereof against connection terminal portions. ### Claim 16 (depends on 9) A method according to claim 9, further comprising at least a step of forming a part of the first circuit or fixing the radiofrequency chip in a cavity or an opening provided in one of the substrates.