# US 11,308,307 B2 · Fingerprint sensing module

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- Number: US 11,308,307 B2
- Document ID: US11308307B2
- Status: Granted
- Kind: B2
- Application number: 17/359,630
- Filed: 2021-06-27
- Published: 2022-02-17
- Granted: 2022-04-19
- Earliest claimed: 2020-08-17
- Assignees: Au Optronics Corporation
- Applicants: Au Optronics Corporation
- Inventors: Yu-Han Huang; Chao-Chien Chiu; Shih-Hua Lu
- Web page: https://patentgrep.com/patent/US11308307B2

## CPC

- G06V 40/1318: {using electro-optical elements or layers, e.g. electroluminescent sensing}
- G06V 40/1324: {by using geometrical optics, e.g. using prisms (G06V40/1312 takes precedence)}
- G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING

## Abstract

A fingerprint sensing module including a substrate, a plurality of photosensitive devices, a collimation structure layer, a light-shielding layer, an interposer and a plurality of micro lenses is provided. The photosensitive devices are disposed on the substrate. The collimation structure layer is disposed on the photosensitive devices. The light-shielding layer is disposed on the collimation structure layer and has a surface and a plurality of first openings recessed from the surface. The first openings respectively overlap the photosensitive devices. The interposer is disposed on the collimation structure layer and positioned in a part of the first openings of the light-shielding layer. The micro lenses are disposed on the interposer and respectively overlap the first openings.

## Claims

### Claim 1

A fingerprint sensing module, comprising:
a substrate;
a plurality of photosensitive devices, disposed on the substrate;
a collimation structure layer, disposed on the plurality of photosensitive devices;
a light-shielding layer, disposed on the collimation structure layer, wherein the light-shielding layer has a surface and a plurality of first openings recessed from the surface, the plurality of first openings respectively overlap the plurality of photosensitive devices;
an interposer, disposed on the collimation structure layer and located in a part of the plurality of first openings of the light-shielding layer; and
a plurality of micro lenses, disposed on the interposer and respectively overlap the plurality of first openings.

### Claim 2 (depends on 1)

The fingerprint sensing module according to claim 1, further comprising:
an auxiliary layer, disposed between the light-shielding layer and the collimation structure layer, wherein the auxiliary layer has a plurality of second openings overlapping the part of the plurality of first openings.

### Claim 3 (depends on 2)

The fingerprint sensing module according to claim 2, wherein the collimation structure layer comprises a flat layer connected to the auxiliary layer, a part of the plurality of second openings of the auxiliary layer expose a surface of the flat layer, and a part of the plurality of micro lenses directly contact the surface of the flat layer.

### Claim 4 (depends on 3)

The fingerprint sensing module according to claim 3, wherein the plurality of micro lenses are made of the same material as the flat layer.

### Claim 5 (depends on 2)

The fingerprint sensing module according to claim 2, wherein the interposer is further disposed in the part of the plurality of second openings of the auxiliary layer.

### Claim 6 (depends on 2)

The fingerprint sensing module according to claim 2, wherein the auxiliary layer further has a surface exposed by the part of the plurality of first openings, and the interposer covers the surface of the auxiliary layer.

### Claim 7 (depends on 1)

The fingerprint sensing module according to claim 1, wherein the interposer covers the surface of the light-shielding layer.

### Claim 8 (depends on 7)

The fingerprint sensing module according to claim 7, wherein the plurality of micro lenses partially overlap the surface of the light-shielding layer, and directly contact a part of the interposer covering the surface of the light-shielding layer.

### Claim 9 (depends on 1)

The fingerprint sensing module according to claim 1, wherein a material of the interposer comprises molybdenum metal.

### Claim 10

A fingerprint sensing module, comprising:
a substrate;
a plurality of photosensitive devices, disposed on the substrate;
a collimation structure layer, disposed on the plurality of photosensitive devices;
a light-shielding layer, disposed on the collimation structure layer, wherein the light-shielding layer has a surface and a plurality of first openings recessed from the surface, the plurality of first openings respectively overlap the plurality of photosensitive devices;
an interposer, disposed on the collimation structure layer and covering the surface of the light-shielding layer; and
a plurality of micro lenses, disposed on the interposer and overlapping the plurality of first openings and a part of the interposer.

### Claim 11 (depends on 10)

The fingerprint sensing module according to claim 10, wherein the interposer does not overlap the plurality of first openings of the light-shielding layer.

### Claim 12 (depends on 10)

The fingerprint sensing module according to claim 10, further comprising:
an auxiliary layer, disposed between the light-shielding layer and the collimation structure layer, wherein the auxiliary layer has a plurality of second openings overlapping the plurality of first openings.

### Claim 13 (depends on 12)

The fingerprint sensing module according to claim 12, wherein the collimation structure layer comprises a flat layer connected to the auxiliary layer, the plurality of second openings of the auxiliary layer expose a surface of the flat layer, and the plurality of micro lenses directly contact the surface of the flat layer.

### Claim 14 (depends on 13)

The fingerprint sensing module according to claim 13, wherein the plurality of micro lenses are made of the same material as the flat layer.

### Claim 15 (depends on 12)

The fingerprint sensing module according to claim 12, wherein the interposer has a plurality of third openings overlapping the plurality of first openings, and the plurality of first openings of the light-shielding layer, the plurality of second openings of the auxiliary layer, and the plurality of third openings of the interposer are aligned with each other.

### Claim 16 (depends on 12)

The fingerprint sensing module according to claim 12, wherein a material of the auxiliary layer comprises silicon nitride, and a material of the plurality of micro lenses comprises an organic photoresist material.

### Claim 17 (depends on 10)

The fingerprint sensing module according to claim 10, wherein a material of the light-shielding layer comprises molybdenum metal.