# US 11,307,688 B2 · Thermal transfer substrate, touch display panel and manufacturing methods therefor, and display device

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- Number: US 11,307,688 B2
- Document ID: US11307688B2
- Status: Granted
- Kind: B2
- Application number: 16/753,358
- Filed: 2019-03-19
- Published: 2020-10-22
- Granted: 2022-04-19
- Earliest claimed: 2018-03-20
- Assignees: Chengdu Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd.
- Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.
- Inventors: Hongqiang Luo; Jianjun Wu
- Web page: https://patentgrep.com/patent/US11307688B2

## CPC

- G06F 3/041: Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- B32B 37/025: {Transfer laminating}
- G06F 3/0412: {Digitisers structurally integrated in a display}
- G06F 3/044: by capacitive means
- H10K 59/12: Active-matrix OLED [AMOLED] displays
- H10K 59/40: OLEDs integrated with touch screens
- H10K 59/873: {Encapsulations}
- H10K 71/18: using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
- H10K 71/40: Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K 71/80: using temporary substrates
- H10K 77/111: {Flexible substrates}
- B32B 37/12: characterised by using adhesives
- B32B 38/10: Removing layers, or parts of layers, mechanically or chemically
- B32B 2310/0831: using UV radiation
- B32B 2310/0843: using laser
- B32B 2315/08: Glass
- B32B 2457/208: Touch screens
- G06F 2203/04102: Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
- G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
- H10K 59/1201: {Manufacture or treatment}
- H10K 2102/311: {Flexible OLED}
- Y02E 10/549: Organic PV cells
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

Disclosed is a thermal transfer substrate including a base substrate and a touch module on the base substrate. A side of the touch module which is in contact with the base substrate is adhesive, the adhesiveness decreasing under a first condition while increasing under a second condition. The present disclosure solves the problem that the manufacturing yield rate of touch display panels is relatively low, and improves the manufacturing yield rate of the touch display panels. The present disclosure is used for manufacturing a touch display panel.

## Claims

### Claim 1

A thermal transfer system, comprising a display panel and a thermal transfer substrate, the display panel comprising a thin film encapsulation layer, the thermal transfer substrate comprising a base substrate and a touch module on the base substrate, wherein a side of the touch module which is in contact with the base substrate is adhesive, and the adhesiveness decreases under a laser irradiation while increases under ultraviolet irradiation; and
wherein when the touch module is under the laser irradiation, the touch module is in a state of detaching from the base substrate, and when the touch module is under the ultraviolet irradiation, the touch module is in a state of adhering to the thin film encapsulation layer.

### Claim 2 (depends on 1)

The thermal transfer system according to claim 1, wherein the touch module comprises a first buffer layer, a carrier layer and a touch layer which are located on the base substrate in sequence, and the first buffer layer is adhesive.

### Claim 3 (depends on 2)

The thermal transfer system according to claim 2, wherein the first buffer layer comprises a transparent organic thin film.

### Claim 4 (depends on 1)

The thermal transfer system according claim 1, further comprising a second buffer layer on the touch module, wherein the second buffer layer is adhesive, and the adhesiveness of the second buffer layer decreases under a third condition.

### Claim 5 (depends on 4)

The thermal transfer system according to claim 4, wherein a thickness of the second buffer layer is greater than a thickness of the touch module.

### Claim 6 (depends on 4)

The thermal transfer system according to claim 4, wherein the thickness of the touch module ranges from 6 μm to 8 μm, and the thickness of the second buffer layer is not less than 50 μm.

### Claim 7 (depends on 4)

The thermal transfer system according to claim 4, wherein the third condition is the ultraviolet irradiation.

### Claim 8 (depends on 4)

The thermal transfer system according to claim 4, wherein the second buffer layer is an ultraviolet degumming layer.

### Claim 9 (depends on 2)

The thermal transfer system according to claim 2, wherein the touch module further comprises an index matching layer between the support layer and the touch layer, wherein the index matching layer is configured to adjust a refractive index of light when the light transmits through the index matching layer.

### Claim 10

A touch display panel, comprising a substrate, and a light-emitting device, a thin film encapsulation layer and a touch module on the substrate, wherein a side of the touch module which is in contact with the thin film encapsulation layer is adhesive, and the adhesiveness decreases under laser irradiation while increases under ultraviolet irradiation;
wherein when the touch module is under the laser irradiation, the touch module is in a state of detaching from a base substrate of an associated thermal transfer substrate, and when the touch module is under the ultraviolet irradiation, the touch module is in a state of adhering to the thin film encapsulation layer.

### Claim 11 (depends on 10)

The touch display panel according to claim 10, wherein the touch module comprises a first buffer layer, a support layer and a touch layer which are located on the thin film encapsulation layer in sequence, and the first buffer layer is adhesive.

### Claim 12 (depends on 11)

The touch display panel according to claim 11, wherein the first buffer layer comprises a transparent organic thin film.

### Claim 13 (depends on 10)

A display device, comprising the touch display panel according to claim 10.

### Claim 14

A method of manufacturing a touch display panel, comprising:
providing a display panel, comprising a substrate, and a light-emitting device and a thin film encapsulation layer on the substrate;
detaching a touch module on a thermal transfer substrate from a base substrate under laser irradiation, wherein the thermal transfer substrate comprises the base substrate and the touch module on the base substrate, a side of the touch module which is in contact with the base substrate is adhesive, and the adhesiveness decreases under the laser irradiation;
attaching the adhesive side of the touch module to the thin film encapsulation layer; and
adhering the touch module to the thin film encapsulation layer under ultraviolet irradiation, the adhesiveness increasing under the ultraviolet irradiation.

### Claim 15 (depends on 14)

The method according to claim 14, comprising:
forming the touch module on the base substrate, to provide the thermal transfer substrate.

### Claim 16 (depends on 15)

The method according to claim 15, wherein forming the touch module on the base substrate comprises:
forming a first buffer layer on the base substrate, the first buffer layer being adhesive;
forming a support layer on the first buffer layer; and
forming a touch layer on the support layer.

### Claim 17 (depends on 15)

The method according to claim 15, further comprising:
forming a second buffer layer on the touch module, the second buffer layer being adhesive, and the adhesiveness of the second buffer layer decreasing under the ultraviolet irradiation.

### Claim 18 (depends on 17)

The method according to claim 17, adhering the touch module to the thin film encapsulation layer under ultraviolet irradiation comprises:
performing ultraviolet irradiation to decrease the adhesiveness of the second buffer layer to detach the second buffer layer from the touch module and adhere the touch module to the thin film encapsulation layer.

### Claim 19 (depends on 14)

The method according to claim 14, wherein providing the display panel, comprises:
forming the light-emitting device on the substrate; and
forming the thin film encapsulation layer on the light-emitting device.